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公开(公告)号:US20100319754A1
公开(公告)日:2010-12-23
申请号:US12709350
申请日:2010-02-19
申请人: Basha S. Sajjad , Shmuel Erez , S. Daniel Miller , Mahendran T. Chidambaram , Ravi Vellanki , Gerald Schock
发明人: Basha S. Sajjad , Shmuel Erez , S. Daniel Miller , Mahendran T. Chidambaram , Ravi Vellanki , Gerald Schock
IPC分类号: H01L31/052 , H01L31/048 , H01L31/18
CPC分类号: H01L31/056 , H01L31/048 , H01L31/0547 , Y02E10/52
摘要: Improvements for a photovoltaic module (PVM) include the use of a micro-embossed, reflective optical film located in areas of the PVM not covered by the solar cells. The optical film is configured to reflect light incident upon the PVM onto the solar cells and may be formed from a polymeric material. Further enhancements include the use of a compliant heat conducting polymeric film on back sides of the solar cells and a heat conductive polymeric film deposited on an aluminum foil to form a composite film, which effects heat transfer from the solar cell junctions and improves cell efficiency. A top glass with selective frequency and anti-reflective coatings may also be used. Further, improved interconnects for the solar cells eliminate sharp edges, helping to avoid any potential for encapsulant tearing or tab “push-through” and resultant shorting during lamination.
摘要翻译: 光伏模块(PVM)的改进包括使用位于未被太阳能电池覆盖的PVM的区域中的微压纹的反射型光学膜。 光学膜被配置为将入射到PVM上的光反射到太阳能电池上,并且可以由聚合物材料形成。 进一步的增强包括在太阳能电池的背面上使用柔性导热聚合物膜,以及沉积在铝箔上以形成复合膜的导热聚合物膜,其实现来自太阳能电池接头的热传递并提高电池效率。 也可以使用具有选择性频率和抗反射涂层的顶部玻璃。 此外,用于太阳能电池的改进的互连消除了锋利的边缘,有助于避免在层压期间任何潜在的密封剂撕裂或突片“推入”并导致短路。
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公开(公告)号:US06333268B1
公开(公告)日:2001-12-25
申请号:US09630231
申请日:2000-08-01
申请人: Vladimir Starov , Shmuel Erez , Syed S. Basha , Arkadiy I. Shimanovich , Ravi Vellanki , Krishnan Shrinivasan , Karen A. Reinhardt , Aleksandr Kabansky
发明人: Vladimir Starov , Shmuel Erez , Syed S. Basha , Arkadiy I. Shimanovich , Ravi Vellanki , Krishnan Shrinivasan , Karen A. Reinhardt , Aleksandr Kabansky
IPC分类号: G03F736
CPC分类号: H01L21/02054 , G03F7/42 , G03F7/427 , H01J37/32357 , H01L21/76814
摘要: Adherent matrix layers such as post-etch and other post-process residues are removed from a substrate by exposing them to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix layers and condensing the vapor phase solvent into the adherent matrix layers and revaporized to promote fragmentation of the matrix and facilitate removal. Megasonic energy may be transmitted via a transmission member to the adherent matrix through the solvent condensed thereon to loosen fragments and particles. The substrate is typically rotated to improve contact between the megasonic energy transmission member and the condensed solvent and achieve more uniform cleaning. A co-solvent which is soluble in the vapor phase solvent may be added to enhance removal of specific adherent matrix materials. A plasma pretreatment may be employed to react with and modify the matrix in a way that improves subsequent penetration by the vapor phase solvent and fragmentation of the adherent matrix for more complete removal from the substrate.
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