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    Conductive polymer device and method of manufacturing same
    2.
    发明申请
    Conductive polymer device and method of manufacturing same 审中-公开
    导电聚合物装置及其制造方法

    公开(公告)号：US20060055501A1

    公开(公告)日：2006-03-16

    申请号：US10538221

    申请日：2003-03-14

    申请人： Ray Burke ,  Maurice O'Brien ,  Poting Lan ,  Stelar Chu

    发明人： Ray Burke ,  Maurice O'Brien ,  Poting Lan ,  Stelar Chu

    IPC分类号： H01C7/10 ,  H01C7/13

    CPC分类号： H01C1/148 ,  H01C7/028 ,  H01C7/18

    摘要： An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer, a second metal layer, at least one layer of device, material sandwiched between the first and second metal layers. A first layer of insulating material substantially covers the first metal layer. A third metal layer is provided on the first layer of insulating material. This third metal layer is divided to provide a first terminal and a second terminal. The first terminal is electrically connected to the first metal layer by a conductive interconnect formed through said first layer of insulating material, and the second terminal is electrically connected to said second metal layer by a conductive path comprising an insulated conductive channel which passes through and is insulated from said first metal layer and said at least one layer of device material. The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used.

    摘要翻译： 使用印刷电路板制造工艺制造电子设备。 特别地，层状器件包括第一金属层，第二金属层，至少一层器件，夹在第一和第二金属层之间的材料。 第一绝缘材料层基本上覆盖第一金属层。 在第一绝缘材料层上设置第三金属层。 该第三金属层被分割以提供第一端子和第二端子。 第一端子通过所述第一绝缘材料层形成的导电互连电连接到第一金属层，并且第二端子通过导电路径电连接到所述第二金属层，所述导电路径包括穿过的绝缘导电通道，并且是 与所述第一金属层和所述至少一个装置材料层绝缘。 使用绝缘通道提供了一种成本有效的制造方法，并使所使用的器件材料的有效面积最大化。

    Encapsulated conductive polymer device and method of manufacturing the same
    3.
    发明申请
    Encapsulated conductive polymer device and method of manufacturing the same 审中-公开
    封装导电聚合物装置及其制造方法

    公开(公告)号：US20060055500A1

    公开(公告)日：2006-03-16

    申请号：US10538220

    申请日：2003-01-24

    申请人： Ray Burke ,  Maurice O'Brien ,  Brian Ahearne ,  John Kelly

    发明人： Ray Burke ,  Maurice O'Brien ,  Brian Ahearne ,  John Kelly

    IPC分类号： H01C7/13

    CPC分类号： H01C1/14 ,  H01C1/028 ,  H01C1/1406 ,  H01C1/142 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281

    摘要： The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

    摘要翻译： 本发明涉及封装或绝缘装置。 在某些环境和应用中，有必要保护设备免受外部代理的影响。 本发明通过提供一种包括具有限定在其中的孔的绝缘材料的部分来实现这一点。 活动的元件，例如正温度系数（PTC）的材料被接收在限定的孔内。 元件基本上被一侧上的第一金属层和相对侧上的第二金属层覆盖。 第一绝缘材料层基本上覆盖第一金属层，第二绝缘材料层基本上覆盖第二金属层。 第一端子提供到第一金属层的外部电连接，而第二端子提供到第二金属层的外部电连接。 第一端子通过导电布线连接到第一金属层，导电布线穿过第一绝缘层，第二端子通过导电布线连接到第二金属层，穿过第二绝缘层。 此外，本发明提供了一种使用常规PCB技术制造矩阵形式的器件的方法，以便于大量生产封装器件。 另外，所得到的组件可以用作单一设备中的含铅或SMT组件或SIP和DIP封装中的多个器件配置。

    Multi-layer polymeric electronic device and method of manufacturing same
    4.
    发明申请
    Multi-layer polymeric electronic device and method of manufacturing same 审中-公开
    多层聚合物电子器件及其制造方法

    公开(公告)号：US20060176675A1

    公开(公告)日：2006-08-10

    申请号：US10548971

    申请日：2004-03-15

    申请人： Gordon Bourns ,  Gary Straker ,  Ray Burke ,  Thanh Nguyen

    发明人： Gordon Bourns ,  Gary Straker ,  Ray Burke ,  Thanh Nguyen

    IPC分类号： H05K7/06 ,  H05K3/36 ,  H05K1/03

    CPC分类号： H01G4/232 ,  H01C1/1406 ,  H01C1/148 ,  H01C1/16 ,  H01C7/021 ,  H01C7/027 ,  H01C7/18 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/09181 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： An electronic device is formed of multiple, alternating layers of conductive polymer and metal foil electrodes, in which electrical connections between selected electrodes are provided by cross-conductors formed by plated through-hole vias. More specifically, the device includes a first cross-conductor that electrically connects a first set of electrodes, and a second cross-conductor electrically connects a second set of electrodes. Correspondingly, the first cross-conductor is electrically and physically isolated from the second set of electrodes, while the second cross-conductor is electrically and physically isolated from the first set of electrodes. The electrodes are etched to form an isolation gap that isolates that electrode from either the first or second cross-conductor. The first and second cross-conductors, in turn, are formed by plating the through-hole vias, so as to establish electrically-conductive contact with those electrodes not separated from the via by an isolation gap. Thus, a device may be formed with N non-metallic (e.g. polymeric) layers and N+1 electrodes, where N is an integer greater than 1, wherein a first cross-conductor electrically contacts a first set of electrodes, and a second cross-conductor electrically contacts a second set of electrodes, whereby the non-metallic layers are connected in parallel.

    摘要翻译： 电子器件由导电聚合物和金属箔电极的多个交替层形成，其中所选电极之间的电连接由通过电镀通孔形成的交叉导体提供。 更具体地，该装置包括电连接第一组电极的第一交叉导体，而第二导体电连接第二组电极。 相应地，第一交叉导体与第二组电极电和物理地隔离，而第二导体与第一组电极电性和物理隔离。 蚀刻电极以形成将该电极与第一或第二导体隔离的隔离间隙。 第一和第二交叉导体又通过电镀通孔形成，以便与未通过隔离间隙与通孔分离的那些电极建立导电接触。 因此，器件可以形成有N个非金属（例如聚合物）层和N + 1个电极，其中N是大于1的整数，其中第一交叉导体电接触第一组电极，并且第二十字 电极与第二组电极电接触，由此非金属层并联连接。