利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.009 秒)

    ATOM PROBE COMPONENT TREATMENTS
    1.
    发明申请
    ATOM PROBE COMPONENT TREATMENTS 审中-公开
    原子探针组分处理

    公开(公告)号：US20090138995A1

    公开(公告)日：2009-05-28

    申请号：US11917672

    申请日：2006-06-16

    申请人： Thomas F. Kelly ,  David J. Larson ,  Richard L. Martens ,  Keith J. Thompson ,  Robert M. Ulfig ,  Scott A. Wiener

    发明人： Thomas F. Kelly ,  David J. Larson ,  Richard L. Martens ,  Keith J. Thompson ,  Robert M. Ulfig ,  Scott A. Wiener

    IPC分类号： G12B21/00

    CPC分类号： H01J37/3056 ,  H01J37/32853 ,  H01J37/32862

    摘要： The present invention relates to treatments for atom probe components. For example, certain aspects are directed toward processes for treating an atom probe component that includes removing material from a surface of the atom probe component (e.g., using an ion beam, a plasma, a chemical etching process, and/or photonic energy). Another aspect of the invention is directed toward a method for treating an atom probe specimen that includes using a computing device to automatically control a voltage used in an ion sputtering process. Still other aspects of the invention are directed toward methods for treating an atom probe component that includes introducing photonic energy proximate to a surface of the atom probe component, annealing at least a portion of a surface of the atom probe component, coating at least a portion of a surface of the atom probe component, and/or cooling at least a portion of the atom probe component.

    摘要翻译： 本发明涉及原子探针成分的处理。 例如，某些方面涉及用于处理原子探针组分的方法，其包括从原子探针组分的表面除去材料（例如，使用离子束，等离子体，化学蚀刻工艺和/或光能）。 本发明的另一方面涉及一种用于处理原子探针样品的方法，其包括使用计算装置自动控制在离子溅射工艺中使用的电压。 本发明的其它方面涉及用于处理原子探针组分的方法，所述方法包括将光子能引入到原子探针组分的表面附近，退火至少部分原子探针组分的表面，涂覆至少一部分 的原子探针组分的表面，和/或冷却原子探针组分的至少一部分。

    ATOM PROBE DATA AND ASSOCIATED SYSTEMS AND METHODS
    2.
    发明申请
    ATOM PROBE DATA AND ASSOCIATED SYSTEMS AND METHODS 审中-公开
    原子探针数据及相关系统和方法

    公开(公告)号：US20100288926A1

    公开(公告)日：2010-11-18

    申请号：US12294716

    申请日：2007-03-27

    申请人： Scott A. Wiener ,  Thomas F. Kelly ,  David J. Larson ,  Keith J. Thompson ,  Robert M. Ulfig ,  Brian P. Geiser ,  Thomas C. Kunicki ,  Raymond W. O'Neill ,  Jason Schneir

    发明人： Scott A. Wiener ,  Thomas F. Kelly ,  David J. Larson ,  Keith J. Thompson ,  Robert M. Ulfig ,  Brian P. Geiser ,  Thomas C. Kunicki ,  Raymond W. O'Neill ,  Jason Schneir

    IPC分类号： G01B21/30

    CPC分类号： H01J37/285 ,  H01J37/265 ,  H01J2237/24571 ,  H01J2237/24592

    摘要： The present invention relates to atom probe data and associated systems and methods. Aspects of the invention are directed toward a computing system configured to predict a characteristic associated with an atom probe specimen that includes a data set receiving component configured to receive a three-dimensional data set associated with a portion of the specimen. The system further includes a predicting/calculating component configured to predict the characteristic associated with the specimen based on the data set. Other aspects of the invention are directed toward a method for evaluating a manufacturing process using atom probe data that includes receiving a three-dimensional data set associated with a portion of a microelectronic assembly produced by a manufacturing process. The method further includes determining a variation between the data set and a configuration expected to result from the manufacturing process.

    摘要翻译： 本发明涉及原子探针数据及相关系统和方法。 本发明的方面针对被配置为预测与原子探针样本相关联的特征的计算系统，所述特征包括被配置为接收与样本的一部分相关联的三维数据集的数据集接收部件。 该系统还包括预测/计算部件，其被配置为基于数据集预测与样本相关联的特性。 本发明的其它方面涉及使用原子探测器数据来评估制造过程的方法，该方法包括接收与由制造过程产生的微电子组件的一部分相关联的三维数据集。 该方法还包括确定数据集与期望从制造过程产生的配置之间的变化。

    CMP platen plug
    4.
    发明授权
    CMP platen plug 失效
    CMP压板插头

    公开(公告)号：US6086464A

    公开(公告)日：2000-07-11

    申请号：US261993

    申请日：1999-03-05

    申请人： Robert M. Ulfig ,  Richard E. Lamm

    发明人： Robert M. Ulfig ,  Richard E. Lamm

    IPC分类号： B24B37/16 ,  B24D9/08 ,  B24B7/00

    CPC分类号： B24B37/16

    摘要： An improved chemical mechanical polishing apparatus for polishing a semiconductor wafer used in the fabrication of silicon-based semiconductor devices is provided so as to eliminate an air pocket bubble from being formed underneath a polishing pad without the need for cutting the same. This is achieved by a CMP platen plug which is disposed in a recess formed in a top cover plate member so as to completely fill the recess in order to displace the air pocket. The polishing pad is then secured over the platen plug and the top cover plate member. As a result, the useful life of the polishing pad has been prolonged.

    摘要翻译： 提供了一种用于抛光用于制造硅基半导体器件的半导体晶片的改进的化学机械抛光装置，以便消除在抛光垫下形成的气泡气泡，而不需要切割它们。 这通过CMP压板插头来实现，CMP压板插头设置在形成在顶盖板构件中的凹部中，以便完全填充凹部以便使空气袋移位。 然后将抛光垫固定在压板插头和顶盖板构件上。 结果，抛光垫的使用寿命延长了。