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    Systems and methods for enhanced control of laser drilling processes
    1.
    发明授权
    Systems and methods for enhanced control of laser drilling processes 失效
    增强激光钻孔工艺控制的系统和方法

    公开(公告)号：US08440933B2

    公开(公告)日：2013-05-14

    申请号：US12761868

    申请日：2010-04-16

    申请人： Harris L. Marcus ,  Robin Bright

    发明人： Harris L. Marcus ,  Robin Bright

    IPC分类号： B23K26/00

    CPC分类号： B23K26/032 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/26 ,  B23K2103/50 ,  B23K2103/52

    摘要： Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.

    摘要翻译： 提供了系统和方法，用于基于在激光钻孔期间实时收集的原子发射光谱发射来监测和/或控制激光钻孔工艺。 这些系统和方法可用于监测和控制一系列材料（例如金属（包括合金）和陶瓷）的激光钻孔操作，并且可用于识别表征孔完成并管理/停止激光钻孔操作的光谱特性 基于此。 精确监测孔完井的能力提供了减少不必要的激光脉冲的重要优点，否则可能降低制造效率和/或增加部件材料的热或机械损伤。 还可以采用这些系统和方法来控制激光钻孔操作，以便在必要时提高孔质量和/或实施校正动作，以确保激光钻孔操作产生高质量的钻孔。

    Systems and Methods For Enhanced Control of Laser Drilling Processes
    3.
    发明申请
    Systems and Methods For Enhanced Control of Laser Drilling Processes 失效
    激光钻孔加工控制系统与方法

    公开(公告)号：US20110017715A1

    公开(公告)日：2011-01-27

    申请号：US12761868

    申请日：2010-04-16

    申请人： Harris L. Marcus ,  Robin Bright

    发明人： Harris L. Marcus ,  Robin Bright

    IPC分类号： B23K26/38

    CPC分类号： B23K26/032 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/26 ,  B23K2103/50 ,  B23K2103/52

    摘要： Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.

    摘要翻译： 提供了系统和方法，用于基于在激光钻孔期间实时收集的原子发射光谱发射来监测和/或控制激光钻孔工艺。 这些系统和方法可用于监测和控制一系列材料（例如金属（包括合金）和陶瓷）的激光钻孔操作，并且可用于识别表征孔完成并管理/停止激光钻孔操作的光谱特性 基于此。 精确监测孔完井的能力提供了减少不必要的激光脉冲的重要优点，否则可能降低制造效率和/或增加部件材料的热或机械损伤。 还可以采用这些系统和方法来控制激光钻孔操作，以便在必要时提高孔质量和/或实施校正动作，以确保激光钻孔操作产生高质量的钻孔。