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公开(公告)号：US09016880B2
公开(公告)日：2015-04-28
申请号：US13720558
申请日：2012-12-19
申请人： Ronald Joseph Schutz
发明人： Ronald Joseph Schutz
CPC分类号： G02B17/0615 , B29D11/00596 , B60R1/10
摘要： An advantageous optical apparatus with relatively large field viewing of an image to the rear of an observer is disclosed. The apparatus has two mirrors having cylindrical symmetry where the mirrors are positioned so that a plane of symmetry for each mirror is substantially coincident. The mirrors are further configured so that the apparatus has an astigmatism less than 0.0035, and a ratio between the far field and the near field magnification of less than 0.9. The apparatus is fabricated, in one embodiment, by using force to conform a thin polymer mirror onto an appropriate surface configuration on a monolithic block.
摘要翻译： 公开了一种有利的光学装置，其具有对观察者后方的图像的相对较大的场观察。 该装置具有两个具有圆柱对称性的反射镜，其中反射镜被定位成使得每个反射镜的对称平面基本上重合。 反射镜被进一步配置，使得该装置具有小于0.0035的散光，并且远场和近场放大率之间的比小于0.9。 在一个实施例中，通过使用力将薄聚合物镜适配到单片块上的适当表面构造上来制造该装置。
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公开(公告)号：US07011574B2
公开(公告)日：2006-03-14
申请号：US10996669
申请日：2004-11-24
IPC分类号： B24B1/00
CPC分类号： B24B37/245 , B24D3/34 , H01L21/31053 , H01L21/3212
摘要： A polyelectrolyte dispensing polishing pad, a process for its production and a method of polishing, e.g., chemical mechanical polishing (CMP), a substrate such as a semiconductor wafer, are provided. The pad is usable for CMP planarization of an oxide or metal layer on the wafer. The pad has a polishing layer of erodible binder material containing uniformly distributed therein both abrasive particles and a water soluble ionizable electrolyte substance such as a polyelectrolyte, such that during polishing the binder material incrementally erodes and the abrasive particles and electrolyte substance incrementally release into direct contact with the substrate. The electrolyte substance inhibits CMP removal of silicon nitride, e.g., as a stop layer, under an upper oxide or metal layer, such that the upper layer is selectively polished and the CMP stops on the stop layer leaving the latter intact.
摘要翻译： 提供聚电解质分配抛光垫，其制造方法和抛光方法，例如化学机械抛光（CMP），诸如半导体晶片的基板。 衬垫可用于晶片上的氧化物或金属层的CMP平坦化。 该垫具有含有均匀分布在其中的研磨颗粒和水溶性可电离电解质物质如聚电解质的可侵蚀粘合剂材料的抛光层，使得在抛光过程中，粘结剂材料逐渐侵蚀，磨料颗粒和电解质物质逐渐释放直接接触 与基材。 该电解质物质抑制了在上部氧化物或金属层下的作为停止层的氮化硅的CMP去除，使得上层被选择性地抛光，并且CMP停止在停止层上，使其保持不变。
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3.发明授权Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor 有权在半导体的化学 - 机械抛光过程中提高金属去除速率的方法
公开(公告)号：US6136714A
公开(公告)日：2000-10-24
申请号：US213469
申请日：1998-12-17
申请人： Ronald Joseph Schutz
发明人： Ronald Joseph Schutz
IPC分类号： H01L21/304 , C09K3/14 , H01L21/285 , H01L21/302 , H01L21/321 , H01L21/768
CPC分类号： C09K3/1463 , H01L21/3212 , H01L21/7684 , H01L21/28568
摘要： A method for enhancing the removal rate of a metal barrier layer during CMP includes providing a semiconductor wafer having an insulator layer, a metal barrier layer formed on at least a portion of the insulation layer and a conductive layer formed thereon and contacting the semiconductor wafer with a chemical-mechanical polishing slurry containing a metal removal-enhancing amount of at least one chelating agent.
摘要翻译： 一种用于增强CMP期间金属阻挡层去除速率的方法包括：提供具有绝缘体层的半导体晶片，形成在绝缘层的至少一部分上的金属阻挡层和形成在其上的导电层，并使半导体晶片与 含有金属去除增强量的至少一种螯合剂的化学机械抛光浆料。
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4.发明授权Method of integrated circuit fabrication including a step of depositing tungsten 失效集成电路制造方法，包括沉积钨的步骤
公开(公告)号：US5693561A
公开(公告)日：1997-12-02
申请号：US645852
申请日：1996-05-14
IPC分类号： H01L21/768 , H01L21/283
CPC分类号： H01L21/76855 , H01L21/76843
摘要： Integrated circuit fabrication includes the formation of tungsten contacts in windows. Between the tungsten and the contact region are Ti and TiN layers. Defects are prevented or reduced by sealing grain boundaries in the TiN layer prior to tungsten deposition. Grain boundaries are sealed by rinsing the TiN layer in water at ambient temperature or above.
摘要翻译： 集成电路制造包括在窗户中形成钨触点。 在钨和接触区之间是Ti和TiN层。 在钨沉积之前通过在TiN层中密封晶界来防止或减少缺陷。 通过在环境温度以上的水中冲洗TiN层来密封晶界。
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公开(公告)号：US20140168803A1
公开(公告)日：2014-06-19
申请号：US13720558
申请日：2012-12-19
申请人： Ronald Joseph Schutz
发明人： Ronald Joseph Schutz
CPC分类号： G02B17/0615 , B29D11/00596 , B60R1/10
摘要： An advantageous optical apparatus with relatively large field viewing of an image to the rear of an observer is disclosed. The apparatus has two mirrors having cylindrical symmetry where the mirrors are positioned so that a plane of symmetry for each mirror is substantially coincident. The mirrors are further configured so that the apparatus has an astigmatism less than 0.0035, and a ratio between the far field and the near field magnification of less than 0.9. The apparatus is fabricated, in one embodiment, by using force to conform a thin polymer mirror onto an appropriate surface configuration on a monolithic block.
摘要翻译： 公开了一种有利的光学装置，其具有对观察者后方的图像的相对较大的场观察。 该装置具有两个具有圆柱对称性的反射镜，其中反射镜被定位成使得每个反射镜的对称平面基本上重合。 反射镜被进一步配置，使得该装置具有小于0.0035的散光，并且远场和近场放大率之间的比小于0.9。 在一个实施例中，通过使用力将薄聚合物镜适配到单片块上的适当表面构造上来制造该装置。
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6.发明授权Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate 有权聚电解质分散抛光垫，其制造方法和抛光基材的方法公开(公告)号：US06841480B2
公开(公告)日：2005-01-11
申请号：US10067587
申请日：2002-02-04
IPC分类号： B24B37/24 , B24D3/34 , H01L21/3105 , H01L21/321 , H01L21/302
CPC分类号： B24B37/245 , B24D3/34 , H01L21/31053 , H01L21/3212
摘要： A polyelectrolyte dispensing polishing pad, a process for its production and a method of polishing, e.g., chemical mechanical polishing (CMP), a substrate such as a semiconductor wafer, are provided. The pad is usable for CMP planarization of an oxide or metal layer on the wafer. The pad has a polishing layer of erodible binder material containing uniformly distributed therein both abrasive particles and a water soluble ionizable electrolyte substance such as a polyelectrolyte, such that during polishing the binder material incrementally erodes and the abrasive particles and electrolyte substance incrementally release into direct contact with the substrate. The electrolyte substance inhibits CMP removal of silicon nitride, e.g., as a stop layer, under an upper oxide or metal layer, such that the upper layer is selectively polished and the CMP stops on the stop layer leaving the latter intact.
摘要翻译： 提供聚电解质分配抛光垫，其制造方法和抛光方法，例如化学机械抛光（CMP），诸如半导体晶片的基板。 衬垫可用于晶片上的氧化物或金属层的CMP平坦化。 该垫具有含有均匀分布在其中的研磨颗粒和水溶性可电离电解质物质如聚电解质的可侵蚀粘合剂材料的抛光层，使得在抛光过程中，粘结剂材料逐渐侵蚀，磨料颗粒和电解质物质逐渐释放直接接触 与基材。 该电解质物质抑制了在上部氧化物或金属层下的作为停止层的氮化硅的CMP去除，使得上层被选择性地抛光，并且CMP停止在停止层上，使其保持不变。
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