Process for manufacturing a piezoelectric component
    1.
    发明授权
    Process for manufacturing a piezoelectric component 失效
    制造压电元件的工艺

    公开(公告)号:US5703425A

    公开(公告)日:1997-12-30

    申请号:US495677

    申请日:1995-07-31

    Abstract: The invention relates to a process for manufacturing a piezoelectric component and to the component resulting from such a process. According to the invention, the manufacturing process comprises the stacking of at least one piezoelectric element (1) and of at least two metallic electrodes (2), each piezoelectric element (1) being inserted between two metallic electrodes (2), characterized in that each piezoelectric element and each metallic electrode is produced, respectively, by coiling a piezoelectric film and by coiling a metallized film.

    Abstract translation: PCT No.PCT / FR94 / 00031 Sec。 371日期1995年7月31日 102(e)日期1995年7月31日PCT 1994年1月11日PCT PCT。 公开号WO94 / 17562 日期:1994年8月4日本发明涉及一种制造压电元件的方法以及由该方法产生的元件。 根据本发明,制造工艺包括至少一个压电元件(1)和至少两个金属电极(2)的堆叠,每个压电元件(1)插入两个金属电极(2)之间,其特征在于: 每个压电元件和每个金属电极分别通过卷绕压电膜和卷绕金属化膜来制造。

    Method for the manufacture of foil capacitors
    2.
    发明授权
    Method for the manufacture of foil capacitors 失效
    箔电容器的制造方法

    公开(公告)号:US5513424A

    公开(公告)日:1996-05-07

    申请号:US389968

    申请日:1995-02-15

    Abstract: A method for the manufacture of foil capacitors with metallized plastic films, said method comprising the following steps:coiling at least one pair of metallized plastic films so as to form the stacked structure of the capacitors;metallizing the lateral faces of the coiled structure in order to create the plates of the capacitors;cutting out the coiled and metallized structure, or parent capacitor, into semi-finished capacitors;putting the semi-finished capacitors and their connection wires through a cleansing flux;soldering the connection wires to the plates of the semi-finished capacitors;wherein the soldering is done by wave soldering and wherein, between said metallization and said cutting, a heat treatment operation designed to give the plastic film the characteristics needed to withstand the wave soldering and a new metallization designed to ensure the mechanical and electrical quality of the connections are carried out successively.

    Abstract translation: 一种用金属化塑料膜制造箔电容器的方法,所述方法包括以下步骤:卷绕至少一对金属化塑料膜,以形成电容器的堆叠结构; 对卷绕的结构的侧面进行金属化,以便形成电容器的板; 将线圈和金属化结构或母电容器切割成半成品电容器; 将半成品电容器及其连接线穿过清洁助焊剂; 将连接线焊接到半成品电容器的板上; 其中所述焊接是通过波峰焊进行的,并且其中在所述金属化和所述切割之间进行热处理操作,该热处理操作被设计成使塑料膜具有承受波峰焊所需的特性,以及设计成确保塑料膜的机械和电气质量的新的金属化 连接依次进行。

    Process for producing laminated capacitors and capacitor made from such
a process
    3.
    发明授权
    Process for producing laminated capacitors and capacitor made from such a process 失效
    用于制造由这种方法制成的层压电容器和电容器的方法

    公开(公告)号:US5384005A

    公开(公告)日:1995-01-24

    申请号:US183236

    申请日:1994-01-19

    CPC classification number: H01G13/06 B23K26/362

    Abstract: A process for producing laminated capacitors includes stacking of metallized plastic films. It includes a step of winding of at least one pair of metallized plastic films, this step being separated into three phases, a first phase of making finishing turns and during which the films are demetallized so that their superposition does not lead to any additional capacitance in the final component, a second phase of superposing the films so that they contribute to the capacitance of the final component and during which the films are demetallized near their edges, and a third phase intended to perform finishing turns under the same conditions as during the first phase, wherein the demetallizations of the films occurring in the successive phases are performed by etching. The process for producing laminated capacitors can also include at least one step of demetallization of metallized plastic films appearing in the form of widths of great width intended to be cut into elementary ribbons, in which the demetallization is performed by etching.

    Abstract translation: 层叠电容器的制造方法包括层叠金属化塑料膜。 它包括缠绕至少一对金属化塑料膜的步骤,该步骤被分为三个阶段,第一阶段进行精整匝,并且在该阶段期间,薄膜被去金属化,使得它们的叠加不会导致任何额外的电容 最终成分,叠加膜的第二阶段,使得它们有助于最终成分的电容,并且在其附近边缘附近去除金属膜,第三相旨在在与第一次成分相同的条件下进行整理匝数 相,其中在连续相中发生的膜的去金属化通过蚀刻进行。 制造叠层电容器的方法还可以包括至少一个将金属化的塑料薄膜去金属化的步骤,该金属化塑料薄膜呈宽度大小的形式,将要切割成基本薄带,其中通过蚀刻进行去金属化。

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