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    Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
    5.
    发明授权
    Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein 有权
    保护层形成在半导体器件部件上，以便减少或消除其中的分层和裂纹的发生

    公开(公告)号：US06885108B2

    公开(公告)日：2005-04-26

    申请号：US10391267

    申请日：2003-03-18

    申请人： Shijian Luo ,  Tongbi Jiang ,  S. Derek Hinkle

    发明人： Shijian Luo ,  Tongbi Jiang ,  S. Derek Hinkle

    IPC分类号： H01L23/31 ,  H01L29/40

    CPC分类号： H01L23/3157 ,  H01L23/3114 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A method for forming protective layers on a plurality of semiconductor device components carried by a fabrication substrate includes applying a layer of protective material to surfaces of the semiconductor device components. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. The protective material may be applied as a preformed sheet or in a liquid form, then at least partially cured or hardened. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material. Semiconductor device components, including chip-scale packages, which are formed by the method are also disclosed.

    摘要翻译： 在由制造衬底携带的多个半导体器件部件上形成保护层的方法包括将一层保护材料施加到半导体器件部件的表面。 然后将保护材料层切断并且制造衬底至少部分地断开。 然后在切断期间形成的裂缝和分层区域愈合。 保护材料可以作为预制片材或液体形式施用，然后至少部分固化或硬化。 如果使用可固化聚合物作为保护材料，则可以在切断之前部分固化，然后在完全固化之前自愈合。 或者，可以使用热塑性材料作为保护材料，通过加热热塑性材料的至少区域来实现愈合。 还公开了通过该方法形成的半导体器件部件，包括芯片级封装。

    Semiconductor device structures including protective layers formed from healable materials
    7.
    发明授权
    Semiconductor device structures including protective layers formed from healable materials 有权
    包括由可再生材料形成的保护层的半导体器件结构

    公开(公告)号：US07199464B2

    公开(公告)日：2007-04-03

    申请号：US11053351

    申请日：2005-02-08

    申请人： Shijian Luo ,  Tongbi Jiang ,  S. Derek Hinkle

    发明人： Shijian Luo ,  Tongbi Jiang ,  S. Derek Hinkle

    IPC分类号： H01L29/40

    CPC分类号： H01L23/3157 ,  H01L23/3114 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/00 ,  H01L2224/05599

    摘要： Semiconductor device structures include protective layers that are formed from healable or healed materials. The healable materials are configured to eliminate cracks and delamination, including singulation-induced cracks and delamination. The protective layers may be formed by applying a layer of protective material to surfaces of semiconductor device components that are carried by a fabrication substrate. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material.

    摘要翻译： 半导体器件结构包括由可密封或愈合材料形成的保护层。 可再生材料被配置为消除裂纹和分层，包括分裂引起的裂纹和分层。 可以通过将保护材料层施加到由制造衬底承载的半导体器件部件的表面上来形成保护层。 然后将保护材料层切断并且制造衬底至少部分地断开。 然后在切断期间形成的裂缝和分层区域愈合。 如果使用可固化聚合物作为保护材料，则可以在切断之前部分固化，然后在完全固化之前自愈合。 或者，可以使用热塑性材料作为保护材料，通过加热热塑性材料的至少区域来实现愈合。