公开(公告)号：US20110147072A1

公开(公告)日：2011-06-23

申请号：US13060095

申请日：2009-06-17

申请人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

发明人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

IPC分类号： H05K1/03 ,  C23C22/68 ,  C22C9/00 ,  B32B15/04

CPC分类号： C23F1/18 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T29/49982 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

公开(公告)号：US08809696B2

公开(公告)日：2014-08-19

申请号：US13060095

申请日：2009-06-17

申请人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

发明人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

IPC分类号： H05K1/00

CPC分类号： C23F1/18 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T29/49982 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。