公开(公告)号：US20110147072A1

公开(公告)日：2011-06-23

申请号：US13060095

申请日：2009-06-17

申请人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

发明人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

IPC分类号： H05K1/03 ,  C23C22/68 ,  C22C9/00 ,  B32B15/04

CPC分类号： C23F1/18 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T29/49982 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

公开(公告)号：US08809696B2

公开(公告)日：2014-08-19

申请号：US13060095

申请日：2009-06-17

申请人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

发明人： Tomoaki Yamashita ,  Sumiko Nakajima ,  Sadao Itou ,  Fumio Inoue ,  Shigeharu Arike

IPC分类号： H05K1/00

CPC分类号： C23F1/18 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T29/49982 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

公开(公告)号：US20080289868A1

公开(公告)日：2008-11-27

申请号：US12182908

申请日：2008-07-30

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/11 ,  H05K1/16

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

公开(公告)号：US20060162956A1

公开(公告)日：2006-07-27

申请号：US10500119

申请日：2002-12-24

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsduya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsduya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US08028402B2

公开(公告)日：2011-10-04

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/36 ,  H01R9/00 ,  H01K3/10

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

摘要翻译： 公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路 形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。 连接板通过特定的加工形成，包括使用三层复合金属层。

公开(公告)号：US20090008141A1

公开(公告)日：2009-01-08

申请号：US12230564

申请日：2008-09-02

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/11 ,  H05K1/16

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US08426742B2

公开(公告)日：2013-04-23

申请号：US12597835

申请日：2008-04-23

申请人： Yoshinori Ejiri ,  Shuichi Hatakeyama ,  Shigeharu Arike ,  Kiyoshi Hasegawa

发明人： Yoshinori Ejiri ,  Shuichi Hatakeyama ,  Shigeharu Arike ,  Kiyoshi Hasegawa

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01B1/02

CPC分类号： C23C18/1651 ,  C23C18/1837 ,  C23C18/42 ,  C23C18/54 ,  H01L21/4846 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H05K2203/072 ,  H05K2203/073 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

摘要： The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.

摘要翻译： 通过将导电层，无电解镀镍膜，作为99质量％以下的位错或无电解镀钯膜的第一钯镀膜连接的端子，可以提高具有位移镀金膜的连接端子的连接可靠性，或者 更优选为纯度为90质量％以上且99质量％以下的化学镀钯膜的第二镀钯膜，以及置换镀金膜，其中，化学镀镍膜，第一钯镀层 膜，第二钯电镀膜和置换镀金膜在导电层的一侧依次层叠，位移镀金膜位于与导电层相反一侧的最上层。

公开(公告)号：US20090274581A1

公开(公告)日：2009-11-05

申请号：US12501056

申请日：2009-07-10

申请人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

发明人： Hiroshi Kawazoe ,  Akishi Nakaso ,  Shigeharu Arike

IPC分类号： B01L3/00

CPC分类号： B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

公开(公告)号：US5403869A

公开(公告)日：1995-04-04

申请号：US107115

申请日：1993-08-17

申请人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

发明人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

IPC分类号： C08G59/32 ,  C08G59/34 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  C08G59/06 ,  C08L63/02 ,  C08L63/08

CPC分类号： C08G59/027 ,  C08G59/32 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  Y10S428/901 ,  Y10T29/49162

摘要： An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

摘要翻译： 一种粘合剂，其包含（a）分子量为5000以上的固体环氧树脂，（b）具有至少三个环氧基的多官能环氧树脂，（c）具有至少三个环氧基的分子内环氧改性的聚丁二烯，（d ）阳离子型光引发剂，（e）特殊重量比的锡化合物，对生产具有良好耐热性，耐溶剂性的多线布线板有效，并且其中粘合层没有空隙并且防止绝缘封装线的移动。