公开(公告)号：US20100032815A1

公开(公告)日：2010-02-11

申请号：US12432621

申请日：2009-04-29

申请人： JaeSeon An ,  Jeong Lee ,  SangJin Cha ,  SungHo Youn

发明人： JaeSeon An ,  Jeong Lee ,  SangJin Cha ,  SungHo Youn

IPC分类号： H01L23/552 ,  H01L21/50

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

摘要翻译： 这里描述的是具有EMI屏蔽和相关方法的半导体器件封装。 在一个实施例中，半导体器件封装包括：（1）衬底单元，其包括邻近衬底单元的周边设置并且至少部分地在衬底单元的上表面和下表面之间延伸的接地元件; （2）设置在所述衬底单元的上表面附近的半导体器件; （3）与基板单元的上表面相邻并且覆盖半导体器件的封装体; 和（4）邻近包装体的外表面设置的EMI屏蔽。 封装体的周边横向凹入，使得接地元件的连接表面电暴露并电连接到EMI屏蔽。 接地元件提供入射到EMI屏蔽上的接地电磁辐射的电路。

公开(公告)号：US08410584B2

公开(公告)日：2013-04-02

申请号：US12432621

申请日：2009-04-29

申请人： JaeSeon An ,  Jeong Lee ,  SangJin Cha ,  SungHo Youn

发明人： JaeSeon An ,  Jeong Lee ,  SangJin Cha ,  SungHo Youn

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

摘要翻译： 这里描述的是具有EMI屏蔽和相关方法的半导体器件封装。 在一个实施例中，半导体器件封装包括：（1）衬底单元，其包括邻近衬底单元的周边设置并且至少部分地在衬底单元的上表面和下表面之间延伸的接地元件; （2）设置在所述衬底单元的上表面附近的半导体器件; （3）与基板单元的上表面相邻并且覆盖半导体器件的封装体; 和（4）邻近包装体的外表面设置的EMI屏蔽。 封装体的周边横向凹入，使得接地元件的连接表面电暴露并电连接到EMI屏蔽。 接地元件提供入射到EMI屏蔽上的接地电磁辐射的电路。