Abstract:
At least one data-line pair has a first data line aligned with a first column of memory cells and a second data line aligned with a second column of memory cells. The first data line is coupled to the second column of memory cells and the second data line is coupled to the first column of memory cells.
Abstract:
A dummy cell having a low threshold voltage is disposed in a memory cell array in alignment with a memory cell. A dummy cell with a low threshold voltage adjacent to a selected memory cell column is selected, and a source-side local bit line of the selected memory cell is coupled to a global bit line via such dummy cell. Since the source-side local bit line is coupled to a ground node at its both ends, source resistance of the memory cell can be reduced, and dependency of the source resistance of the memory cell on the position within the memory cell array can also be reduced. This allows for reducing dependency of source resistance of a memory cell on the position within the memory cell array and on the temperature in a nonvolatile semiconductor memory device.
Abstract:
A non-volatile semiconductor memory device includes, a plurality of word lines, a plurality of bit lines, a plurality of memory circuits, and a reading circuit. A plurality of bits are memorized at each memory cell. The plurality of bit lines lie at right angle to the word lines. The reading circuit is configured to read certain data from every (n−1)th (n is an integer that is greater than two) memory cell of a memory cell array that is connecting to at least a word line. The memory cell exists on the point of intersection with the word line and the bit line. Then data reading and data writing are made by applying the voltage on the word line and the bit line. The non-volatile semiconductor memory device is electrically rewritable.
Abstract:
At least one data-line pair has a first data line aligned with a first column of memory cells and a second data line aligned with a second column of memory cells. The first data line is coupled to the second column of memory cells and the second data line is coupled to the first column of memory cells.
Abstract:
Memory devices and methods are disclosed to facilitate utilization of a multi level inhibit programming scheme. In one such embodiment, isolated channel regions having boosted channel bias levels are formed across multiple memory cells and are created in part and maintained through capacitive coupling with word lines coupled to the memory cells and biased to predetermined bias levels. Methods of manipulation of isolated channel region bias levels through applied word line bias voltages affecting a program inhibit effect, for example, are also disclosed.
Abstract:
Methods for small unit internal verify read operation and a memory device are disclosed. In one such method, expected data is programmed into a grouping of columns of memory cells (e.g., memory block). Mask data is loaded into a third dynamic data cache of three dynamic data caches. The expected data is loaded into a second data cache. After a read operation of programmed columns of memory cells, the read data is compared to the expected data and error bit indicators are stored in the second data cache in the error bit locations. The second data cache is masked with the mask data so that only those error bits that are unmasked are counted. If the number of unmasked error bit indicators is greater than a threshold, the memory block is marked as unusable.
Abstract:
Memory devices and methods are disclosed to facilitate utilization of a multi level inhibit programming scheme. In one such embodiment, isolated channel regions having boosted channel bias levels are formed across multiple memory cells and are created in part and maintained through capacitive coupling with word lines coupled to the memory cells and biased to predetermined bias levels. Methods of manipulation of isolated channel region bias levels through applied word line bias voltages affecting a program inhibit effect, for example, are also disclosed.
Abstract:
Disclosed are methods, systems and devices, one such device being a memory device configured to concurrently assert a first pulse pattern through a plurality of conductors disposed on both a source side and a drain side of a floating-gate transistor, wherein a source side of the first pulse pattern has a different median voltage than a drain side of the first pulse pattern.
Abstract:
The number of times of rewriting of memory cells is stored by number of rewrite (EW) times storage section. In data rewriting to memory cells, number of rewriting times data of a selected memory cell is transferred to and latched in a number of EW times sense latch section and transferred to a number of EW times counter. Controlling processor (CPU) sets a condition on a write pulse on the basis of a value obtained by updating a count value of the number of EW times counter and controls the operation of rewriting. In data rewriting, a count value after update of the number of EW times counter is transferred to the number of EW times sense latch section. The updated number of rewritings is transferred to a corresponding number of EW times storage section, in parallel to data rewriting to a memory cell.
Abstract:
There is provided a non-volatile semiconductor device having a memory cell in which a threshold value voltage changes in accordance with the application of the writing pulse having a predetermined width and voltage with respect to word lines and bit lines and data depending upon the threshold value voltage is written, wherein writing failure is generated in the first time data writing operation, and a writing condition is set for suppressing the writing condition is set which is capable of suppressing the writing failure rate than the case of the first time writing operation when the writing operation is re-executed.