Three-dimensional microstructures
    3.
    发明申请
    Three-dimensional microstructures 审中-公开
    三维微结构

    公开(公告)号:US20050154567A1

    公开(公告)日:2005-07-14

    申请号:US10924759

    申请日:2004-08-24

    摘要: The present invention relates to three-dimensional microstructures and methods for making these microstructures, particularly microstructures having integral features less than about 1 mm. Examples of these microstructures include trusses. The microstructures can be prepared from two-dimensional structures having a deformable portion. Thus, by applying a deformation along these deformable portions, e.g. bending, a third-dimension can be created. The deformable portions can comprise thinner dimensions than more rigid portions to allow facile deformation to a predetermined angle or orientation. Electroplating at least a portion of the three-dimensional microstructure with a metal coating allows the formation of integral features in addition to covering any defects formed by the deformation and/or strengthening any thin components. The initial two-dimensional microstructure can be prepared by various patterning methods such as soft lithographic methods.

    摘要翻译: 本发明涉及用于制造这些微结构的三维微结构和方法,特别是具有小于约1mm的整体特征的微结构。 这些微结构的实例包括桁架。 微结构可以由具有可变形部分的二维结构制备。 因此,通过沿着这些可变形部分施加变形,例如, 弯曲,可以创建第三维。 可变形部分可以包括比更刚性部分更薄的尺寸,以允许容易地变形到预定角度或取向。 用金属涂层电镀三维微结构的至少一部分,除了覆盖由变形和/或增强任何薄组分形成的任何缺陷之外,还可形成整体特征。 初始的二维微结构可以通过各种图案化方法如软平版印刷方法制备。