公开(公告)号：US6156408A

公开(公告)日：2000-12-05

申请号：US920441

申请日：1997-08-29

Applicant: Wen Xu Zhou ,  Daniel Roman Gamota ,  Sean Xin Wu ,  Chao-pin Yeh ,  Karl W. Wyatt ,  Chowdary Ramesh Koripella

Inventor： Wen Xu Zhou ,  Daniel Roman Gamota ,  Sean Xin Wu ,  Chao-pin Yeh ,  Karl W. Wyatt ,  Chowdary Ramesh Koripella

IPC: H01L21/60 ,  H01L23/16 ,  H05K1/02 ,  H05K3/34 ,  B32B3/10

CPC classification number: H01L24/81 ,  H01L23/16 ,  H05K1/0271 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/176 ,  H05K3/3436 ,  H05K3/3452 ,  Y10S428/901 ,  Y10T428/24273

Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Abstract translation: 用于可再加工的直接芯片附接的方法（400,500）和装置（200）包括热机械和机械稳定的焊接接头，用于在电路板的顶表面上布置连接焊盘以便于电子元件的连接，并且固定加强件 具有孔以将焊接接头容纳到电路板的顶表面以便于将连接焊盘焊接到电子元件上，其中，所述加强件限制电路板的变形以提供可靠的焊点，并且便于将电子元件从 电路板。

公开(公告)号：US6108109A

公开(公告)日：2000-08-22

申请号：US978900

申请日：1997-11-26

Applicant: Alan Gengsheng Chen ,  Jang-Hun (James) Yeh ,  Sean Xin Wu

Inventor： Alan Gengsheng Chen ,  Jang-Hun (James) Yeh ,  Sean Xin Wu

IPC: G02B7/00 ,  G02B5/32

CPC classification number: G02B7/008

Abstract: The present invention provides a method, device and optical package (10,22) for enhancing a temperature stability by controlling a variable characteristic of an optical package and optical interconnect system. The device includes an optical emitter (14) for generating a predetermined beam of light (16) having a predetermined wavelength, a photo-sensing unit (20) for receiving a portion (18) of the predetermined beam of light (16), and a stability-enhancing broad bandwidth holographic optical element (12), wherein the predetermined wavelength of the predetermined beam of light substantially coincides with a working range wavelength of a broad bandwidth of the stability-enhancing broad bandwidth holographic optical element (12), for enhancing the temperature stability of the optical package and the optical interconnect system in response to changes in a thermal expansion of the stability-enhancing broad bandwidth holographic optical element (12) and the changes in the predetermined wavelength of the predetermined optical beam caused by temperature variations.

Abstract translation: 本发明提供一种用于通过控制光学封装和光学互连系统的可变特性来增强温度稳定性的方法，装置和光学封装（10,22）。 该装置包括用于产生具有预定波长的预定光束（16）的光发射器（14），用于接收预定光束（16）的部分（18）的感光单元（20），以及 稳定性增强宽带全息光学元件（12），其中预定光束的预定波长基本上与稳定性增强宽带宽全息光学元件（12）的宽带宽的工作范围波长一致，用于增强 响应于稳定性增强宽带全息光学元件（12）的热膨胀变化以及由温度变化引起的预定光束的预定波长的变化，光学封装和光学互连系统的温度稳定性。

公开(公告)号：US5844319A

公开(公告)日：1998-12-01

申请号：US808773

申请日：1997-03-03

Applicant: Danniel Roman Gamota ,  George Amos Carson ,  Sean Xin Wu ,  Brian J. Bullock

Inventor： Danniel Roman Gamota ,  George Amos Carson ,  Sean Xin Wu ,  Brian J. Bullock

IPC: H01L21/60 ,  H05K1/02 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H05K1/0271 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K3/3436

Abstract: A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).

Abstract translation: 微电子组件（10）包括通过多个未封装的焊料凸块互连（16）连接到聚合物基板（12）的集成电路部件（14）。 围绕集成电路部件（14）将轴环（18）固定到聚合物基体（12）上，并且由热膨胀系数小于基底（12）的热膨胀系数的无机材料形成。 套环（18）限制聚合物基材（12）在管芯附接区域（22）中的热膨胀，从而减少由聚合物基材（12）和集成电路部件（12）的热膨胀失配引起的任何有害影响 14）。

公开(公告)号：US6031856A

公开(公告)日：2000-02-29

申请号：US961105

申请日：1997-10-30

Applicant: Sean Xin Wu ,  Gary Mui ,  Chao-Pin Yeh ,  Karl W. Wyatt

Inventor： Sean Xin Wu ,  Gary Mui ,  Chao-Pin Yeh ,  Karl W. Wyatt

IPC: H01S5/00 ,  H01L33/00 ,  H01L33/48 ,  H01S5/183 ,  H01S5/22 ,  H01S5/30 ,  H01L21/20

CPC classification number: H01S5/22 ,  H01L2224/48091 ,  H01L2224/73265

Abstract: The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Abstract translation: 本发明提供了一种用于消除安装在载体（28）上的光发射器（26）之间的倾斜角（40）的方法，制品和光学封装（24）。 所述方法，制品和光学封装（24）包括具有其中形成有空腔（46）的顶表面（42）的载体（28），插入到所述腔（46）中的粘合剂材料（38），以及 放置在所述载体（28）的顶表面（42）上并且至少部分地覆盖所述空腔（46）的光发射器（26），从而提供至少一个出口点，用于从其中溢出所述粘合剂材料。