公开(公告)号：US20090315172A1

公开(公告)日：2009-12-24

申请号：US12213754

申请日：2008-06-24

申请人： Fong Lim ,  See Yau Lee ,  Yang Hong Heng

发明人： Fong Lim ,  See Yau Lee ,  Yang Hong Heng

IPC分类号： H01L21/50 ,  H01L23/34

CPC分类号： H01L23/373 ,  H01L23/492 ,  H01L23/49537 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/0615 ,  H01L2224/16225 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/814 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92242 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.

摘要翻译： 半导体芯片组件包括半导体芯片和热解石墨元件，其是在芯片工作期间电连接并提供来自芯片的电流的电导通的电极。

公开(公告)号：US08482119B2

公开(公告)日：2013-07-09

申请号：US12213754

申请日：2008-06-24

申请人： Fong Lim ,  See Yau Lee ,  Yang Hong Heng

发明人： Fong Lim ,  See Yau Lee ,  Yang Hong Heng

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/373 ,  H01L23/492 ,  H01L23/49537 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/0615 ,  H01L2224/16225 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/814 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92242 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.