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公开(公告)号:US20130143416A1
公开(公告)日:2013-06-06
申请号:US13701752
申请日:2011-06-03
申请人: Shane Norval
发明人: Shane Norval
IPC分类号: H01L21/263
CPC分类号: H01L21/2633 , B23K26/0006 , B23K26/142 , B23K26/36 , B23K2103/56
摘要: A technique comprising: using a laser beam to ablate a target surface (2) via projection lens (12) as part of a process of defining one or more elements of one or more electronic devices, wherein the ablating is performed whilst extracting material ablated from the target surface via an extraction device inlet (6) having at least a portion at a level between said target surface (2) and said projection lens (12) and at the level of a plume of ablated material above said target surface.
摘要翻译: 一种技术,包括:使用激光束经由投影透镜(12)来消融目标表面(2),作为限定一个或多个电子设备的一个或多个元件的过程的一部分,其中,在从第 所述目标表面经由提取装置入口(6),所述提取装置入口(6)具有在所述目标表面(2)和所述投影透镜(12)之间的至少一部分处于所述目标表面上方的消融材料层的水平面。
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公开(公告)号:US09985207B2
公开(公告)日:2018-05-29
申请号:US11720979
申请日:2005-12-06
IPC分类号: H01L51/00 , H01L21/288 , H01L21/768 , H01L51/05
CPC分类号: H01L51/0021 , H01L21/288 , H01L21/76802 , H01L21/76804 , H01L51/0017 , H01L51/0541
摘要: A method of producing an electronic device including the steps of: (i) providing a body including a first, conductive element separated from a first surface of said body by a portion of said body; (ii) removing a selected portion of said body to define a recess in said body extending from said first surface and via which a portion of said first element is exposed; and (iii) putting into said recess a liquid medium carrying a first material; wherein said first material is preferentially deposited on the exposed inner surface of said body defining said recess, and wherein the deposited first material is used to provide a connection between said first element and a second conductive element located within said body or later deposited over said first surface of said body.
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公开(公告)号:US20140057433A1
公开(公告)日:2014-02-27
申请号:US14110593
申请日:2012-04-11
申请人: Paul Cain , Shane Norval , Boon Hean Pui
发明人: Paul Cain , Shane Norval , Boon Hean Pui
IPC分类号: H01L21/768
CPC分类号: H01L21/76895 , G02F1/136213 , G02F2001/13606 , H01L27/3248 , H01L27/326 , H01L27/3272 , H01L27/3274 , H01L51/0037
摘要: A technique comprising: forming laterally-extending switching circuitry of a device for controlling an overlying laterally-extending array of pixel conductors of said device; forming an electrically conductive laterally-extending patterned screen over said switching circuitry via a first insulating region, said patterned screen defining holes for receiving conductive interlayer connects between said switching circuitry and said array of pixel conductors; and thereafter: forming a second insulating region over said patterned screen, forming said array of pixel conductors over said patterned screen via said second insulating region for capacitative coupling with said patterned screen, forming through holes through at least said first and second insulating regions at the locations of said holes defined in said patterned screen, and forming said interlayer connects in said through holes; and wherein said patterned screen is configured such that the area of overlap between the array of pixel conductors and underlying conductive elements is substantially constant within a range of lateral positions of the pixel conductors relative to the switching circuitry, which range is greater in a first direction than 40% of the pitch of the pixel conductors in said first direction.
摘要翻译: 一种技术,包括:形成用于控制所述装置的像素导体的横向延伸阵列阵列的装置的横向延伸切换电路; 通过第一绝缘区域在所述开关电路上形成导电的横向延伸的图案化屏幕,所述图案化屏幕限定孔,用于接收所述开关电路和所述像素导体阵列之间的导电层间连接; 然后:在所述图案化屏幕上形成第二绝缘区域,在所述图案化屏幕上通过所述第二绝缘区域形成所述像素导体阵列,用于与所述图案化屏幕电容耦合,在所述图案化屏幕的至少所述第一和第二绝缘区域形成通孔 在所述图案化屏幕中限定的所述孔的位置和形成所述中间层连接在所述通孔中; 并且其中所述图案化屏幕被配置为使得像素导体阵列和下面的导电元件之间的重叠区域在像素导体相对于开关电路的横向位置的范围内基本上是恒定的,该范围在第一方向上较大 比所述第一方向上的像素导体的间距的40%。
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公开(公告)号:US20090232969A1
公开(公告)日:2009-09-17
申请号:US11720979
申请日:2005-12-06
IPC分类号: B05D5/12
CPC分类号: H01L51/0021 , H01L21/288 , H01L21/76802 , H01L21/76804 , H01L51/0017 , H01L51/0541
摘要: A method of producing an electronic device including the steps of: (i) providing a body including a first, conductive element separated from a first surface of said body by a portion of said body; (ii) removing a selected portion of said body to define a recess in said body extending from said first surface and via which a portion of said first element is exposed; and (iii) putting into said recess a liquid medium carrying a first material; wherein said first material is preferentially deposited on the exposed inner surface of said body defining said recess, and wherein the deposited first material is used to provide a connection between said first element and a second conductive element located within said body or later deposited over said first surface of said body.
摘要翻译: 一种电子设备的制造方法,包括以下步骤:(i)提供主体,其包括通过所述主体的一部分与所述主体的第一表面分离的第一导电元件; (ii)去除所述主体的选定部分以限定在所述主体中从所述第一表面延伸的凹部,并且所述第一元件的一部分暴露在所述凹部中; 和(iii)将具有第一材料的液体介质放入所述凹部中; 其中所述第一材料优选沉积在限定所述凹部的所述主体的暴露的内表面上,并且其中所沉积的第一材料用于在所述第一元件和位于所述主体内的第二导电元件之间提供连接,或稍后沉积在所述第一元件上 身体的表面。
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