摘要:
A particle detector for detecting a particle beam includes a negatively charged electrode plate having a first side facing the particle beam, a second side opposite to the first side, and a through-hole extending from the first side to the second side for receiving the particle beam. A detection device adjacent to the second side of the electrode plate detects signals corresponding to the particle beam approaching the through-hole.
摘要:
A method of unblinding an alignment mark comprising the following steps. A substrate having a cell area and an alignment mark within an alignment area is provided. An STI trench is formed into the substrate within the cell area. A silicon oxide layer is formed over the substrate, filling the STI trench and the alignment mark. The silicon oxide layer is planarized to form a planarized STI within the STI trench and leaving silicon oxide within the alignment mark to form a blinded alignment mark. A wet chemical etchant is applied within the alignment mark area over the blinded alignment mark to at least partially remove the silicon oxide within the alignment mark. The remaining silicon oxide is removed from within the blinded alignment mark to unblind the alignment mark. A drop etcher apparatus is also disclosed.
摘要:
A dual-polarity mass spectrometer includes an ion source, a negative ion mass analyzer, and a positive ion mass analyzer to measure both the negative and positive ion spectra of a sample material simultaneously. The ion source includes a sample surface on which the sample material is positioned, the sample material providing positive ions and negative ions when excited by a laser beam or an energetic particle stream. A first extraction electrode is connected to a voltage higher than the sample surface to attract the negative ions from the sample electrode. A second extraction electrode is connected to a voltage lower than the sample surface to attract the positive ions from the sample electrode. The negative and positive ions are analyzed simultaneously by the negative ion mass analyzer and the positive ion mass analyzer, respectively.
摘要:
A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.
摘要:
A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.
摘要:
A dual-polarity mass spectrometer includes an ion source, a negative ion mass analyzer, and a positive ion mass analyzer to measure both the negative and positive ion spectra of a sample material simultaneously. The ion source includes a sample surface on which the sample material is positioned, the sample material providing positive ions and negative ions when excited by a laser beam or an energetic particle stream. A first extraction electrode is connected to a voltage higher than the sample surface to attract the negative ions from the sample electrode. A second extraction electrode is connected to a voltage lower than the sample surface to attract the positive ions from the sample electrode. The negative and positive ions are analyzed simultaneously by the negative ion mass analyzer and the positive ion mass analyzer, respectively.
摘要:
A particle detector for detecting a particle beam includes a negatively charged electrode plate having a first side facing the particle beam, a second side opposite to the first side, and a through-hole extending from the first side to the second side for receiving the particle beam. A detection device adjacent to the second side of the electrode plate detects signals corresponding to the particle beam approaching the through-hole.
摘要:
A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate flow rate control and adjustable mixing ratio thereof. The first slurry and the second slurry may be mixed in-line utilizing an in-line mixing mechanism to provide a mixed slurry thereof. Alternatively, the first and second slurries may be pre-mixed utilizing a pre-mixing mechanism to provide a mixed slurry there.
摘要:
A method of unblinding an alignment mark comprising the following steps. A substrate having a cell area and an alignment mark within an alignment area is provided. An STI trench is formed into the substrate within the cell area. A silicon oxide layer is formed over the substrate, filling the STI trench and the alignment mark. The silicon oxide layer is planarized to form a planarized STI within the STI trench and leaving silicon oxide within the alignment mark to form a blinded alignment mark. A wet chemical etchant is applied within the alignment mark area over the blinded alignment mark to at least partially remove the silicon oxide within the alignment mark. The remaining silicon oxide is removed from within the blinded alignment mark to unblind the alignment mark. A drop etcher apparatus is also disclosed.