Sensor Device for Detecting LEEG Signals and Detecting Method Thereof
    2.
    发明申请
    Sensor Device for Detecting LEEG Signals and Detecting Method Thereof 审中-公开
    用于检测LEEG信号的传感器装置及其检测方法

    公开(公告)号:US20070073184A1

    公开(公告)日:2007-03-29

    申请号:US11534807

    申请日:2006-09-25

    IPC分类号: A61B5/04

    摘要: A sensor device that detects Laplacian electroencephalogram (LEEG) signals includes a signal acquisition module placed on a scalp of a subject to acquire brain signals. A signal processor is coupled or connected to the signal acquisition module to perform a Laplacian operation on the signals acquired by the signal acquisition module such that the noise signal is reduced to yield an analog LEEG signal with a high signal-to-noise (S/N) ratio.

    摘要翻译: 检测拉普拉斯脑电图(LEEG)信号的传感器装置包括放置在受试者头皮上的信号采集模块以获取脑信号。 信号处理器被耦合或连接到信号采集模块,以对由信号采集模块获取的信号执行拉普拉斯算子,使得降低噪声信号以产生具有高信噪比的模拟LEEG信号(S / N)比。

    Chip adapter
    3.
    发明申请
    Chip adapter 审中-公开
    芯片适配器

    公开(公告)号:US20080012105A1

    公开(公告)日:2008-01-17

    申请号:US11483530

    申请日:2006-07-11

    申请人: Sheng-Fu Chen

    发明人: Sheng-Fu Chen

    IPC分类号: H01L23/02

    CPC分类号: H05K7/1023

    摘要: A chip adapter includes an adapter body, which has an accommodation top open chamber that accommodates a chip, a plurality of conducting elements respectively mounted in a bottom side in the accommodation top open chamber and bonded to a motherboard for the contact of respective contacts of the accommodated chip, a hook disposed at one side, and two pivot holes at an opposite side, and a M-shaped metal spring rod, which has two coupling end tips respectively pivoted to the pivot holes of the adapter body, a middle retaining portion for fastening to the hook of the adapter body, and two pressure arms connected between the coupling end tips and the middle retaining portion for imparting a downward pressure to the accommodated chip to hold the chip in position.

    摘要翻译: 芯片适配器包括适配器主体,其具有容纳芯片的容置顶部敞开室,分别安装在容纳顶部开放室中的底侧中的多个导电元件,并且结合到母板以用于接触 容纳芯片,设置在一侧的钩和在相对侧的两个枢轴孔,以及M形金属弹簧杆,其具有分别枢转到适配器主体的枢转孔的两个联接端头,用于 紧固到适配器主体的钩子上,以及连接在联接端头和中间保持部分之间的两个压力臂,用于向所容纳的芯片施加向下的压力以将芯片保持在适当位置。