公开(公告)号：US5451721A

公开(公告)日：1995-09-19

申请号：US764733

申请日：1991-09-24

Applicant: Yutaka Tsukada ,  Shuhei Tsuchida

Inventor： Yutaka Tsukada ,  Shuhei Tsuchida

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/4602 ,  H05K1/0265 ,  H05K2201/0352 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2203/1438 ,  H05K2203/1581 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4661 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.

Abstract translation: 公开了一种多层印刷电路板和相应的制造方法，该电路板实现相对高的布线密度和相对高的布线设计自由度。 通过使用通孔电连接电源导体或接地导体，在本发明的印刷电路板中获得这些优点。 另一方面，任何两个相邻信号布线层中的信号导体使用仅通过中间电绝缘层延伸的通孔电连接。 优选地，电绝缘层是感光树脂层，并且通孔使用常规的光刻技术形成。

公开(公告)号：US06378201B1

公开(公告)日：2002-04-30

申请号：US08497614

申请日：1995-06-30

Applicant: Yutaka Tsukada ,  Shuhei Tsuchida

Inventor： Yutaka Tsukada ,  Shuhei Tsuchida

IPC: H01K310

CPC classification number: H05K3/4602 ,  H05K1/0265 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0352 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2203/1438 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.

Abstract translation: 公开了一种多层印刷电路板和相应的制造方法，该电路板实现相对高的布线密度和相对高的布线设计自由度。 通过使用通孔电连接电源导体或接地导体，在本发明的印刷电路板中获得这些优点。 另一方面，任何两个相邻信号布线层中的信号导体使用仅通过中间电绝缘层延伸的通孔电连接。 优选地，电绝缘层是感光树脂层，并且通孔使用常规的光刻技术形成。