公开(公告)号：US06632588B2

公开(公告)日：2003-10-14

申请号：US10190873

申请日：2002-07-08

申请人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

发明人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

IPC分类号： G03F700

CPC分类号： H05K3/0082 ,  B41C1/1008 ,  B41C1/1016 ,  B41C1/1033 ,  B41C2210/02 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/12 ,  B41C2210/24 ,  B41C2210/262 ,  G03F7/00 ,  H05K3/064 ,  H05K2203/107 ,  Y10S430/145 ,  Y10S430/146 ,  Y10S430/165

摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.

摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物

公开(公告)号：US5641608A

公开(公告)日：1997-06-24

申请号：US546790

申请日：1995-10-23

申请人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

发明人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

IPC分类号： B41C1/10 ,  B41M5/36 ,  G03F7/00 ,  H05K3/00 ,  H05K3/06

CPC分类号： H05K3/0082 ,  B41C1/1008 ,  B41C1/1016 ,  G03F7/00 ,  B41C1/1033 ,  B41C2210/02 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/12 ,  B41C2210/24 ,  B41C2210/262 ,  H05K2203/107 ,  H05K3/064 ,  Y10S430/145 ,  Y10S430/146 ,  Y10S430/165

摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.

摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物。