公开(公告)号：US06632588B2

公开(公告)日：2003-10-14

申请号：US10190873

申请日：2002-07-08

申请人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

发明人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

IPC分类号： G03F700

CPC分类号： H05K3/0082 ,  B41C1/1008 ,  B41C1/1016 ,  B41C1/1033 ,  B41C2210/02 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/12 ,  B41C2210/24 ,  B41C2210/262 ,  G03F7/00 ,  H05K3/064 ,  H05K2203/107 ,  Y10S430/145 ,  Y10S430/146 ,  Y10S430/165

摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.

摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物

公开(公告)号：US5641608A

公开(公告)日：1997-06-24

申请号：US546790

申请日：1995-10-23

申请人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

发明人： John J. Grunwald ,  Shulamit Hirsh ,  Chava Gal

IPC分类号： B41C1/10 ,  B41M5/36 ,  G03F7/00 ,  H05K3/00 ,  H05K3/06

CPC分类号： H05K3/0082 ,  B41C1/1008 ,  B41C1/1016 ,  G03F7/00 ,  B41C1/1033 ,  B41C2210/02 ,  B41C2210/04 ,  B41C2210/06 ,  B41C2210/12 ,  B41C2210/24 ,  B41C2210/262 ,  H05K2203/107 ,  H05K3/064 ,  Y10S430/145 ,  Y10S430/146 ,  Y10S430/165

摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.

摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物。

公开(公告)号：US5342734A

公开(公告)日：1994-08-30

申请号：US882207

申请日：1992-05-13

申请人： Richard M. Lazarus ,  John J. Grunwald ,  Chava Gal ,  Shulamit Hirsch

发明人： Richard M. Lazarus ,  John J. Grunwald ,  Chava Gal ,  Shulamit Hirsch

IPC分类号： G03F7/004 ,  G03F7/039 ,  H01L21/027 ,  G03C1/492

CPC分类号： G03F7/0045

摘要： A positive working deep UV sensitive photoresist which provides improved critical dimension stability during prolonged periods of post exposure delay before baking comprises an acid stable polymer which is insoluble in water but normally soluble in an aqueous alkaline medium, a photoinitiator which generates acid upon exposure to actinic radiation, and a mixed carbonate ester of tertiary butyl alcohol and a polyhydric phenol which is an acid labile compound which inhibits the dissolution of the normally soluble polymer in said alkaline medium.

摘要翻译： 正面工作的深紫外线敏感光刻胶，其在烘烤前后曝光延迟的延长期间提供改进的临界尺寸稳定性包括不溶于水但通常可溶于碱性水溶液的酸稳定聚合物，光敏引发剂，其在暴露于光化反应时产生酸 辐射，和叔丁醇的混合碳酸酯和作为酸不稳定化合物的多元酚，其抑制常规可溶性聚合物在所述碱性介质中的溶解。