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1.发明授权Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates 有权用于在表面上形成抗蚀剂图案的直接成像方法以及其在制造印刷版中的用途公开(公告)号：US06632588B2
公开(公告)日：2003-10-14
申请号：US10190873
申请日：2002-07-08
申请人： John J. Grunwald , Shulamit Hirsh , Chava Gal
发明人： John J. Grunwald , Shulamit Hirsh , Chava Gal
IPC分类号： G03F700
CPC分类号： H05K3/0082 , B41C1/1008 , B41C1/1016 , B41C1/1033 , B41C2210/02 , B41C2210/04 , B41C2210/06 , B41C2210/12 , B41C2210/24 , B41C2210/262 , G03F7/00 , H05K3/064 , H05K2203/107 , Y10S430/145 , Y10S430/146 , Y10S430/165
摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.
摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物
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2.发明授权Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates 失效用于在表面上形成抗蚀剂图案的直接成像方法以及其在制造印刷版中的用途
公开(公告)号：US5641608A
公开(公告)日：1997-06-24
申请号：US546790
申请日：1995-10-23
申请人： John J. Grunwald , Shulamit Hirsh , Chava Gal
发明人： John J. Grunwald , Shulamit Hirsh , Chava Gal
CPC分类号： H05K3/0082 , B41C1/1008 , B41C1/1016 , G03F7/00 , B41C1/1033 , B41C2210/02 , B41C2210/04 , B41C2210/06 , B41C2210/12 , B41C2210/24 , B41C2210/262 , H05K2203/107 , H05K3/064 , Y10S430/145 , Y10S430/146 , Y10S430/165
摘要： A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.
摘要翻译： 描述了用于在衬底表面上直接生产抗蚀剂成像图案的方法（例如在与印刷电路板（PCB）制造相关的铜包覆电介质的表面上的耐蚀刻有机树脂材料的图案 工艺或制造印版的过程），该方法使用热敏抗蚀剂而不是光致抗蚀剂，即经历热诱导而不是光诱导的化学转化的组合物。 通过聚焦热源（例如，在IR区域中发射的热激光）以预定的图案扫描未涂有光固体的热敏组合物膜，以产生局部热致化学转化 直接产生抗蚀剂图案或在膜中产生图案的可显影潜像的组合物。
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公开(公告)号：US5342734A
公开(公告)日：1994-08-30
申请号：US882207
申请日：1992-05-13
IPC分类号： G03F7/004 , G03F7/039 , H01L21/027 , G03C1/492
CPC分类号： G03F7/0045
摘要： A positive working deep UV sensitive photoresist which provides improved critical dimension stability during prolonged periods of post exposure delay before baking comprises an acid stable polymer which is insoluble in water but normally soluble in an aqueous alkaline medium, a photoinitiator which generates acid upon exposure to actinic radiation, and a mixed carbonate ester of tertiary butyl alcohol and a polyhydric phenol which is an acid labile compound which inhibits the dissolution of the normally soluble polymer in said alkaline medium.
摘要翻译： 正面工作的深紫外线敏感光刻胶，其在烘烤前后曝光延迟的延长期间提供改进的临界尺寸稳定性包括不溶于水但通常可溶于碱性水溶液的酸稳定聚合物，光敏引发剂，其在暴露于光化反应时产生酸 辐射，和叔丁醇的混合碳酸酯和作为酸不稳定化合物的多元酚，其抑制常规可溶性聚合物在所述碱性介质中的溶解。
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公开(公告)号：US4762768A
公开(公告)日：1988-08-09
申请号：US879385
申请日：1986-06-27
申请人： John J. Grunwald , Allen C. Spencer
发明人： John J. Grunwald , Allen C. Spencer
CPC分类号： G03F7/40
摘要： Photo resist image layers, particularly those used for high resolution geometries in microelectronic applications, are stabilized against distortion or degradation by the heat generated during subsequent etching, ion implantation processes and the like, by the application of a film of a thermally stabilizing agent prior to post-development bake of the image layer. High temperature resistant film forming polymers, of which gelatin and gelatin hydrolysates are preferred examples, are employed as thermally stabilizing agents.The process serves to achieve thermal stabilization of the photoresist image layer without significantly affecting the ease of subsequent stripping of the layer. It is particularly effective when used to thermally stabilize positive resist images derived from photoresist systems based on novolak resins.
摘要翻译： 光抗蚀剂图像层，特别是用于微电子应用中用于高分辨率几何形状的抗蚀剂图像层，通过在之前的蚀刻，离子注入工艺等中产生的热量而被稳定，以防止由于热稳定剂的膜而产生的热量的变形或降解 后期烘烤图像层。 使用明胶和明胶水解物作为优选实施例的耐高温成膜聚合物作为热稳定剂。 该方法用于实现光致抗蚀剂图像层的热稳定性，而不显着影响随后剥离该层的容易性。 当用于热稳定来自基于酚醛清漆树脂的光致抗蚀剂体系的正性抗蚀剂图像时，这是特别有效的。
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公开(公告)号：US4701390A
公开(公告)日：1987-10-20
申请号：US802514
申请日：1985-11-27
申请人： John J. Grunwald , Allen C. Spencer
发明人： John J. Grunwald , Allen C. Spencer
CPC分类号： G03F7/40
摘要： Photo resist image layers, particularly those used for high resolution geometries in microelectronic applications, are stabilized against distortion or degradation by the heat generated during subsequent etching, ion implantation processes and the like, by the application of a film of a thermally stabilizing agent prior to post-development bake of the image layer.The process serves to achieve thermal stabilization of the photoresist image layer without significantly affecting the ease of subsequent stripping of the layer. It is particularly effective when used to thermally stabilize positive resist images derived from photoresist systems based on novolak resins.
摘要翻译： 光抗蚀剂图像层，特别是用于微电子应用中用于高分辨率几何形状的抗蚀剂图像层，通过在之前的蚀刻，离子注入工艺等中产生的热量而被稳定，以防止由于热稳定剂的膜而产生的热量的变形或降解 后期烘烤图像层。 该方法用于实现光致抗蚀剂图像层的热稳定性，而不显着影响随后剥离该层的容易性。 当用于热稳定来自基于酚醛清漆树脂的光致抗蚀剂体系的正性抗蚀剂图像时，这是特别有效的。
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6.发明授权Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon 失效改进模塑树脂基材与其沉积金属膜之间的粘合剂的方法
公开(公告)号：US3978252A
公开(公告)日：1976-08-31
申请号：US552539
申请日：1975-02-24
CPC分类号： C23C18/2006 , H05B3/0028 , H05K3/389 , Y10T428/31529 , Y10T428/31678
摘要： An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.
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7.发明授权
公开(公告)号：US4775601A
公开(公告)日：1988-10-04
申请号：US71372
申请日：1987-07-09
申请人： Harold Leever , John J. Grunwald , Bryan Whitmore
发明人： Harold Leever , John J. Grunwald , Bryan Whitmore
CPC分类号： C23C2/32 , C23C2/003 , C23C2/02 , C23C24/045 , Y10T428/12632 , Y10T428/12701 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12792 , Y10T428/12799
摘要： Chipping, flaking, and cracking of mechanical galvanizing coatings applied on metal substrates is prevented by interposing between successive layers of plating metal, which are used in galvanizing the metal substrate, a layer of cushioning metal. Each interposed layer of cushioning metal imparts malleability to the coating such that chipping, cracking, and flaking is prevented or substantially reduced. The plating metal is preferably zinc, while the cushioning metal is preferably tin, lead, or mixtures thereof.
摘要翻译： 金属基材上施加的机械镀锌涂层的切削，剥落和开裂是通过插入用于镀锌金属基底的连续的电镀金属层，缓冲金属层来防止的。 每个夹层的缓冲金属给涂层赋予韧性，使得防止或显着减少碎裂，开裂和剥落。 电镀金属优选为锌，而缓冲金属优选为锡，铅或其混合物。
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公开(公告)号：US4100312A
公开(公告)日：1978-07-11
申请号：US747071
申请日：1976-12-02
CPC分类号： B32B38/162 , H05K3/381 , B32B2038/0092 , B32B2309/02 , B32B2309/12 , B32B2311/00 , B32B2311/24 , B32B2363/00 , H05K2203/1152 , H05K3/181 , H05K3/389 , Y10S428/901 , Y10T428/31529 , Y10T428/31663
摘要： An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.
摘要翻译： 通过在层压箔之前在界面处提供薄的，牺牲的阳极氧化金属箔的第一层压到塑料基板的工艺，获得了包括塑料基板和金属膜的层压体的构件之间的结合强度的改进。 至少塑料有机硅化合物的单分子膜。 在热处理和压力下将经处理的金属箔层压到基底上之后，箔从基底上被化学剥离，为常规化学镀和电镀工艺或其它金属化技术留下了改善的接受性的表面。 当应用于基材时，最终的金属膜显示出比在没有界面的有机硅处理的情况下获得的粘合强度更好的粘合强度，特别是在高温下的粘合强度方面。
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公开(公告)号：US3959523A
公开(公告)日：1976-05-25
申请号：US424896
申请日：1973-12-14
CPC分类号： H05K3/187 , C23C18/1605 , C23C18/1651 , H05K3/184 , H05K2201/0344
摘要： Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.
摘要翻译： 制造电子设备的电路板，其中电路形成导体金属通过全部添加剂无电沉积技术沉积在适当催化和掩蔽的树脂基板上，其中特征特征是使用两级金属沉积 建立所需的金属总厚度。 在第一阶段，在基材上产生细小的金属沉积物，然后水洗，并将其浸入具有足够高沉积速率的第二金属浴中，以在商业实用的时间段内产生所需的金属总厚度 时间。 在热冲击之前和之后，电镀金属对树脂基材的附着力都得到提高，通过这种两阶段电镀工艺来实现。
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10.发明申请Method and Composition to Repair Pinholes and Microvoids in Immersion Silver Plated PWB's Thereby Relieving Creep Corrosion 审中-公开浸渍镀银PWB中针孔和微孔的修复方法和组成，从而缓解蠕变腐蚀公开(公告)号：US20100040773A1
公开(公告)日：2010-02-18
申请号：US12579547
申请日：2009-10-15
申请人： John J. Grunwald
发明人： John J. Grunwald
IPC分类号： B05D1/00
CPC分类号： H05K3/244 , C23C18/44 , C23C18/54 , H05K2201/0347 , H05K2203/073
摘要： This patent discloses embodiments that overcome the deficiencies of pinholes and porosities that plague immersion deposited metal coatings deposited as a final finish to throughole copper Printed Wiring Boards(PWB'S). The patent focuses particularly on silver immersion plated PWB's, where pinholes in the silver film lead to creep corrosion, resulting in failure of costly PWB assemblies in the field. Said pinholes and microvoids are repaired by capping them with electrolessly plated metal, preferably silver.
摘要翻译： 该专利公开了克服针孔和孔隙的缺陷的实施例，其将作为最终抛光沉积的沉积金属涂层沉积在铜铜印刷布线板（PWB'S）上。 该专利特别关注了镀银PWB，其中银膜中的针孔导致蠕变腐蚀，导致现场昂贵的PWB组件的故障。 所述针孔和微孔通过用无电镀金属（优选银）将其加盖来修复。
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