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    METHOD FOR PACKAGING SEMICONDUCTOR
    3.
    发明申请
    METHOD FOR PACKAGING SEMICONDUCTOR 审中-公开
    包装半导体的方法

    公开(公告)号：US20100087067A1

    公开(公告)日：2010-04-08

    申请号：US12523560

    申请日：2007-10-25

    申请人： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun

    发明人： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun

    IPC分类号： H01L21/3205

    CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2924/00

    摘要： A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B-staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time.

    摘要翻译： 提供了一种用于封装半导体的方法，以允许模具附着膏的均匀涂布，缩短B阶段时间，并提高模头拾取特性和模具附着特性。 该方法包括制备粘度为1500至100,000cps的模头附着膏; 旋转晶片并将晶片附着膏施加到晶片的上表面，形成预定厚度; 并且将施加在晶片上的糊料进行B分级。 该方法可以通过代替WBL（晶片背面层叠）膜，均匀地将晶片附着膏施加到晶片来降低成本，通过调节出料糊的粘度和剂量，自由地控制施加的芯片附着膏的厚度，并且速度 旋转涂布机，并且还通过减少B阶段时间缩短处理时间。

    Die-attaching paste composition and method for hardening the same
    4.
    发明申请
    Die-attaching paste composition and method for hardening the same 审中-公开
    贴合糊组合物及其硬化方法

    公开(公告)号：US20070134847A1

    公开(公告)日：2007-06-14

    申请号：US11633132

    申请日：2006-12-01

    申请人： Byoung-Un Kang ,  Jae-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Kyung-Tae Wi

    发明人： Byoung-Un Kang ,  Jae-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Kyung-Tae Wi

    IPC分类号： H01L21/00

    CPC分类号： C08F283/10 ,  C09J4/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00

    摘要： Disclosed are a die-attaching paste composition and a method for hardening the same. The present invention provides the die-attaching paste composition applied at a thickness of 200 μm or less on a printed circuit board (PCB), including liquid or solid epoxy, acrylate, a flexing agent, an organic filler and a UV-initiator. The method for hardening a die-attaching paste of the present invention includes carrying out a B-staging process by irradiating a UV-ray to the die-attaching paste composition. According to the present invention, a processing time may be more shortened and storage of the die-attaching paste may be more significantly improved when a B-staging process using UV rays is applied than when a conventional thermal crosslinking method is used, and therefore a manufacturing cost in the conventional assembly industries may be decreased. Also, the B-staging process may be uniformly carried out and physical properties of the die-attaching paste may be adjusted to desired characteristics since the UV exposure to the die-attaching paste is easily controlled.

    摘要翻译： 公开了一种管芯贴附糊剂组合物及其硬化方法。 本发明提供了在包括液体或固体环氧树脂，丙烯酸酯，挠曲剂，有机填料和UV引发剂的印刷电路板（PCB）上以200μm或更小的厚度涂覆的管芯粘合膏组合物。 本发明的模具贴附膏的硬化方法包括通过对管芯贴附膏组合物照射紫外线进行B阶段化处理。 根据本发明，当使用使用紫外线的B阶段处理时，与使用常规的热交联方法相比，可以更加缩短处理时间，并且可以更显着地改善管芯贴附膏的存储，因此 常规装配行业的制造成本可能会降低。 此外，可以均匀地进行B阶段化处理，并且可以容易地控制对模具附着膏的UV曝光，从而可以将管芯贴附膏的物理性质调节到期望的特性。