公开(公告)号：US08819918B2

公开(公告)日：2014-09-02

申请号：US12193941

申请日：2008-08-19

申请人： Stéphane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

发明人： Stéphane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

IPC分类号： H01Q13/00

CPC分类号： G06K19/07749 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/103 ,  H05K3/321 ,  H05K2201/10287 ,  H05K2201/10727 ,  H01L2924/00

摘要： A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

摘要翻译： 提供了诸如双接口卡之类的芯片卡的制造方法。 该方法通常包括将多个卡片支撑片材一个放置在另一个上，将导电粘合剂沉积在至少一个片材上的接触垫上，将双接口模块定位在建立在至少一个片材中的凹槽中，并执行层压 步。

公开(公告)号：US06617676B1

公开(公告)日：2003-09-09

申请号：US09868570

申请日：2001-08-08

申请人： Laurent Oddou ,  Stéphane Ayala ,  Michael Zafrany

发明人： Laurent Oddou ,  Stéphane Ayala ,  Michael Zafrany

IPC分类号： H01L2980

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L24/24 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/09772 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10S257/922 ,  H01L2924/00

摘要： A method for making a contactless chip card of the type having an electronic module, and an antenna connected to the module, includes the following steps: producing, on a first support sheet, the antenna with connection terminals provided at its ends; producing an insulating bridge partly covering the antenna coils except for the connection terminals; depositing a drop of filling material on the insulating bridge; transferring the electronic module, with its connection pads being oriented towards the insulating bridge; and providing an electric connection between the module contact pads and the antenna connection terminals.

摘要翻译： 一种用于制造具有电子模块的类型的非接触式芯片卡的方法和连接到模块的天线，包括以下步骤：在第一支撑片上制造具有设置在其端部的连接端子的天线; 制造除了连接端子以外部分地覆盖天线线圈的绝缘桥; 在绝缘桥上沉积一滴填充材料; 传送电子模块，其连接垫朝向绝缘桥; 并在模块接触垫和天线连接端子之间提供电连接。

公开(公告)号：US08130166B2

公开(公告)日：2012-03-06

申请号：US12244137

申请日：2008-10-02

申请人： Stéphane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

发明人： Stéphane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

IPC分类号： H01Q21/00

CPC分类号： H01Q1/2225 ,  G06K7/10178

摘要： A coupling device is formed by a continuous conductive path having a central section and two extremity sections, the central section forming at least a small spiral for inductive coupling with the transponder device, the extremities sections forming each one large spiral for inductive coupling with the reader device, wherein the small spiral shows a larger pitch than the ones of the large spirals, and wherein the two extremities of the continuous path are loose such that the coupling device forms an open circuit. The pitches of the large spirals are chosen such as that the interturn stray capacitances is important and that the large spirals have mainly a capacitive behavior. And the pitch of the small spiral is chosen such as that the interturn stray capacitances are negligible, and that the small spiral has mainly an inductive behavior.

摘要翻译： 耦合装置由具有中心部分和两个末端部分的连续导电路径形成，中心部分形成至少一个用于与应答器装置进行电感耦合的小螺旋，四肢部分形成每个用于与读取器感应耦合的大螺旋 装置，其中小螺旋表现出比大螺旋的螺距更大的间距，并且其中连续路径的两个末端是松动的，使得联接装置形成开路。 选择大螺旋的间距，例如匝间杂散电容是重要的，并且大螺旋主要具有电容性行为。 并且选择小螺旋桨的间距，例如匝间杂散电容是可忽略的，并且小螺旋主要具有感应性能。

公开(公告)号：US06517005B1

公开(公告)日：2003-02-11

申请号：US09379298

申请日：1999-08-23

申请人： Stéphane Ayala

发明人： Stéphane Ayala

IPC分类号： G06K1906

CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07769 ,  G06K19/07779 ,  G06K19/07783

摘要： The invention concerns the production of contactless transmission chip card, and particularly mixed cards operating with or without contact. The method for the reliable and efficient setting of an integrated circuit module (M) and of an inductive transmission antenna (A), consists in producing the module providing connection ranges for the antenna, making an antenna with a flat coiled wire, and soldering the ends of said antenna on the module ranges, then making a plastic wafer (30) provided with an opening, the bottom of this opening being closed by an adhesive film (34). The module and the antenna are set against the wafer, and maintained by the adhesive material at the bottom of the housing. Another wafer (40) is directly mounted on the assembly.

摘要翻译： 本发明涉及非接触式传输芯片卡的生产，特别是具有或不具有接触操作的混合卡。 用于集成电路模块（M）和感应发射天线（A）的可靠和有效设置的方法包括制造提供天线连接范围的模块，制造具有扁平线圈导线的天线，并焊接 在所述模块的所述天线的端部，然后制造设置有开口的塑料晶片（30），所述开口的底部由粘合膜（34）封闭。 模块和天线相对于晶片设置，并由壳体底部的粘合剂材料保持。 另一晶片（40）直接安装在组件上。