Embedded multilayer chip capacitor and printed circuit board having the same
    4.
    发明授权
    Embedded multilayer chip capacitor and printed circuit board having the same 有权
    嵌入式多层片式电容器和具有相同功能的印刷电路板

    公开(公告)号:US07499258B2

    公开(公告)日:2009-03-03

    申请号:US11319722

    申请日:2005-12-29

    IPC分类号: H01G4/236 H01G4/06

    摘要: The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor has a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.

    摘要翻译: 本发明提供一种嵌入式多层片状电容器及具有该电容器的印刷电路板。 嵌入式多层片状电容器具有电容器主体,该电容器本体具有彼此层叠的多个电介质层; 多个第一和第二内部电极,形成在电容器本体内部,被电介质层分隔开; 并且第一和第二通孔在电容器体内垂直延伸。 第一通孔连接到第一内部电极,第二通孔连接到第二内部电极。 第一通孔被引导到电容器主体的底部,第二通孔被引导到电容器主体的顶部。