公开(公告)号：US20120223775A1

公开(公告)日：2012-09-06

申请号：US13464460

申请日：2012-05-04

申请人： Dong Young KIM ,  Jae Woan BYUN ,  Sung Ho SHIN ,  Kyoung Joon KIM ,  Chan Young PARK

发明人： Dong Young KIM ,  Jae Woan BYUN ,  Sung Ho SHIN ,  Kyoung Joon KIM ,  Chan Young PARK

IPC分类号： H03F3/68

CPC分类号： H03F1/0288 ,  H03F1/56 ,  H03F3/195

摘要： The embodiment relates to a Doherty amplifier, wherein in order to perform impedance matching. The embodiment comprises an impedance converter and a connector. The impedance converter includes a plurality of lines having different lengths and disposes between an output end of a carrier amplifier and an output end of a peaking amplifier. The connector connects a line selected from the plurality of lines having different lengths of the impedance converter to the output end of the carrier amplifier and to the output end of the peaking amplifier.

摘要翻译： 该实施例涉及一种Doherty放大器，其中为了执行阻抗匹配。 该实施例包括阻抗转换器和连接器。 阻抗转换器包括具有不同长度的多条线，并且配置在载波放大器的输出端和峰值放大器的输出端之间。 连接器将从具有不同长度的阻抗变换器的多条线路中选出的线连接到载波放大器的输出端，并连接到峰值放大器的输出端。

公开(公告)号：US08015839B2

公开(公告)日：2011-09-13

申请号：US11995918

申请日：2006-07-25

申请人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

发明人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

IPC分类号： F25D17/04

CPC分类号： F25D17/065 ,  F25D2317/061 ,  F25D2317/0663

摘要： The present invention relates to a cool air supply structure of a storage receptacle for a refrigerator. The present invention comprises one or more box casings detachably installed in a refrigerating chamber, each box casing having a mounting space and a channel through which cool air flows, the cool air being supplied from a cool air supply source through a cool air supply port formed in a side surface of the refrigerating chamber; and one or more storage receptacles, each storage receptacle being withdrawably installed in the mounting space, wherein food accommodated in an accommodation space provided in the storage receptacle is indirectly cooled by the cool air that flows through the channel. According to the present invention, there is an advantageous effect in that the food accommodated in a plurality of storage receptacles can be stored to be fresher by indirectly cooling the food and simultaneously the supply of cool air can be controlled depending on the use or not of the storage receptacles.

摘要翻译： 本发明涉及一种用于冰箱的储存容器的冷气供应结构。 本发明包括一个或多个可拆卸地安装在冷藏室中的盒壳体，每个箱体壳体具有安装空间和冷气流过的通道，冷空气通过形成的冷空气供应口从冷空气供应源供应 在冷藏室的侧表面中; 和一个或多个存储插座，每个存储容器可抽出地安装在安装空间中，其中容纳在设置在存储容器中的容纳空间中的食物被流过通道的冷空气间接冷却。 根据本发明，有利的效果在于，容纳在多个储存容器中的食物可以通过间接冷却食物而被储存以更新鲜，并且可以根据使用情况来控制冷空气的供应 存放容器。

公开(公告)号：US20080206985A1

公开(公告)日：2008-08-28

申请号：US11878508

申请日：2007-07-25

申请人： Chae-Iyoung Kim ,  Chang-Ki Hong ,  Bo-un Yoon ,  Sung-ho Shin ,  Byoung-ho Kwon

发明人： Chae-Iyoung Kim ,  Chang-Ki Hong ,  Bo-un Yoon ,  Sung-ho Shin ,  Byoung-ho Kwon

IPC分类号： H01L21/44

CPC分类号： H01L21/76816 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31144 ,  H01L21/7688 ,  Y10S438/947

摘要： Methods of fabricating a semiconductor device is provided. The methods include forming an interlayer insulating layer on a semiconductor substrate having a first region and a second region. First contact plugs may be formed on a portion of the second region to fill a plurality of first contact holes. A plurality of first contact mask layers and a plurality of first dummy mask layers may be formed on the interlayer insulating layer. The first contact mask layers may be formed in the first region. The first dummy mask layers may be formed in the second region. A plurality of second contact mask layers may be formed between two adjacent first contact mask layers. A plurality of second dummy mask layers may be formed between two adjacent first dummy mask layers. The interlayer insulating layer may be etched using the first contact mask layers and the second contact mask layers as etch stop layers to form a plurality of second contact holes through the interlayer insulating layer formed in the first region.

摘要翻译： 提供制造半导体器件的方法。 所述方法包括在具有第一区域和第二区域的半导体衬底上形成层间绝缘层。 第一接触塞可以形成在第二区域的一部分上以填充多个第一接触孔。 多个第一接触掩模层和多个第一伪掩模层可以形成在层间绝缘层上。 第一接触掩模层可以形成在第一区域中。 第一虚拟掩模层可以形成在第二区域中。 可以在两个相邻的第一接触掩模层之间形成多个第二接触掩模层。 可以在两个相邻的第一虚拟掩模层之间形成多个第二虚拟掩模层。 可以使用第一接触掩模层和第二接触掩模层作为蚀刻停止层来蚀刻层间绝缘层，以形成穿过形成在第一区域中的层间绝缘层的多个第二接触孔。

公开(公告)号：US20080196440A1

公开(公告)日：2008-08-21

申请号：US11995918

申请日：2006-07-25

申请人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

发明人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

IPC分类号： F25D17/08 ,  F25D17/00 ,  F25D17/06

CPC分类号： F25D17/065 ,  F25D2317/061 ,  F25D2317/0663

摘要： The present invention relates to a cool air supply structure of a storage receptacle for a refrigerator. The present invention comprises one or more box casings detachably installed in a refrigerating chamber, each box casing having a mounting space and a channel through which cool air flows, the cool air being supplied from a cool air supply source through a cool air supply port formed in a side surface of the refrigerating chamber; and one or more storage receptacles, each storage receptacle being withdrawably installed in the mounting space, wherein food accommodated in an accommodation space provided in the storage receptacle is indirectly cooled by the cool air that flows through the channel. According to the present invention, there is an advantageous effect in that the food accommodated in a plurality of storage receptacles can be stored to be fresher by indirectly cooling the food and simultaneously the supply of cool air can be controlled depending on the use or not of the storage receptacles.

摘要翻译： 本发明涉及一种用于冰箱的储存容器的冷气供应结构。 本发明包括一个或多个可拆卸地安装在冷藏室中的盒壳体，每个箱体壳体具有安装空间和冷气流过的通道，冷空气通过形成的冷空气供应口从冷空气供应源供应 在冷藏室的侧表面中; 和一个或多个存储插座，每个存储容器可抽出地安装在安装空间中，其中容纳在设置在存储容器中的容纳空间中的食物被流过通道的冷空气间接冷却。 根据本发明，有利的效果在于，容纳在多个储存容器中的食物可以通过间接冷却食物而被储存以更新鲜，并且可以根据使用情况来控制冷空气的供应 存放容器。

公开(公告)号：US20080037470A1

公开(公告)日：2008-02-14

申请号：US11576849

申请日：2005-01-04

申请人： Young-Lak Kim ,  Sung-Ho Shin ,  Hyun-Wook Kim ,  Jong-Tae Ihm

发明人： Young-Lak Kim ,  Sung-Ho Shin ,  Hyun-Wook Kim ,  Jong-Tae Ihm

IPC分类号： H04Q7/00

CPC分类号： H04W36/14

摘要： The handover method includes the steps of the base stations of the synchronous mobile communication network transmitting dummy pilot signals for the asynchronous mobile communication network, the mobile communication terminal, for which call connection with the asynchronous mobile communication network is performed through the asynchronous wireless device, determining whether the dummy pilot signals for the asynchronous mobile communication network have been received through the asynchronous wireless device; the mobile communication terminal requesting handover from the asynchronous mobile communication network if it is determined that the dummy pilot signals for the asynchronous mobile communication network have been received; and the asynchronous mobile communication network determining that handover is possible, notifying the mobile communication terminal of the determination that handover is possible, and the asynchronous mobile communication network requesting handover to the synchronous mobile communication network, thus performing handover.

摘要翻译： 切换方法包括以下步骤：同步移动通信网络的基站发送用于异步移动通信网络的虚拟导频信号，移动通信终端，其通过异步无线设备执行与异步移动通信网络的呼叫连接， 确定异步移动通信网络的虚拟导频信号是否已经通过异步无线设备接收; 如果确定已经接收到用于异步移动通信网络的虚拟导频信号，则移动通信终端请求从异步移动通信网络的切换; 并且异步移动通信网络确定切换是可能的，向移动通信终端通知可能进行切换的确定以及请求切换到同步移动通信网络的异步移动通信网络，从而执行切换。

公开(公告)号：US20070184663A1

公开(公告)日：2007-08-09

申请号：US11702124

申请日：2007-02-05

申请人： Jun-Yong Kim ,  Ho-Young Kim ,  Chang-Ki Hong ,  Bo-Un Yoon ,  Sung-Ho Shin

发明人： Jun-Yong Kim ,  Ho-Young Kim ,  Chang-Ki Hong ,  Bo-Un Yoon ,  Sung-Ho Shin

IPC分类号： H01L21/461 ,  H01L21/302

CPC分类号： H01L21/31053

摘要： Example embodiments are directed to a method of planarizing a semiconductor device. A first CMP process may be performed on an insulating layer to remove a stepped structure of the insulating layer. A second CMP process may be performed to planarize the insulating layer with the stepped structure removed until a given pattern is exposed. A process temperature of the first CMP process may be higher than that of the second CMP process. Accordingly, an initial stepped structure may be more readily removed in a planarization process of a surface of the semiconductor device, which may reduce the CMP process time and may increase the degree of planarization.

摘要翻译： 示例性实施例涉及一种平面化半导体器件的方法。 可以在绝缘层上执行第一CMP工艺以去除绝缘层的阶梯状结构。 可以执行第二CMP工艺以使去除直到给定图案暴露的阶梯结构的绝缘层平坦化。 第一CMP工艺的工艺温度可以高于第二CMP工艺的工艺温度。 因此，可以在半导体器件的表面的平坦化处理中更容易地去除初始阶梯结构，这可以减少CMP处理时间并且可以增加平坦化程度。

公开(公告)号：US5979174A

公开(公告)日：1999-11-09

申请号：US85007

申请日：1998-05-28

申请人： Seok Ro Kim ,  San Ho Park ,  Kyung Seok Yoon ,  Gyoo Jong Bae ,  Sung Ho Shin

发明人： Seok Ro Kim ,  San Ho Park ,  Kyung Seok Yoon ,  Gyoo Jong Bae ,  Sung Ho Shin

IPC分类号： F25D17/08 ,  F25D17/06 ,  F25D23/02 ,  F25D29/00 ,  F25D17/04 ,  F25D11/02

CPC分类号： F25D17/065 ,  F25D23/028 ,  F25D2317/062 ,  F25D2317/0653 ,  F25D2400/04 ,  F25D2700/123

摘要： A refrigerator includes a fresh food compartment, a freezer compartment defined by inner walls and an outer case respectively, an insulation barrier separating the compartments, and doors for providing access to the compartments. A passageway is formed in the barrier for providing refrigerated air to the fresh food compartment. A connecting duct diverges from the passageway and extends forwardly towards the front portion of the fresh food compartment. A door duct communicating with the connecting duct when the door is closed is coupled to the door. As a result, the fresh food compartment and door-adjacent portions of the fresh food compartment are promptly and uniformly cooled.

摘要翻译： 冰箱包括一个新鲜的食物隔间，一个由内壁和一个外壳限定的冷冻室，一个分隔隔间的绝缘屏障，以及用于提供进入隔间的门。 在屏障中形成通道，用于向新鲜食物室提供冷藏空气。 连接管道从通道分叉并向前延伸到新鲜食物室的前部。 当门关闭时与连接管道连通的门管与门相连接。 结果，新鲜食物室的新鲜食物隔间和门的相邻部分被迅速均匀地冷却。

公开(公告)号：US5892944A

公开(公告)日：1999-04-06

申请号：US779118

申请日：1997-01-06

申请人： Atsushi Fukumoto ,  Toshinari Takahashi ,  Toshio Okamoto ,  Hideki Yoshida ,  Sung Ho Shin

发明人： Atsushi Fukumoto ,  Toshinari Takahashi ,  Toshio Okamoto ,  Hideki Yoshida ,  Sung Ho Shin

IPC分类号： G06F9/46 ,  G06F9/40

CPC分类号： G06F9/468

摘要： A program execution and operation right management system capable of providing flexible and sufficient protection uniformly even for the thread operation instructions among the threads sharing the same virtual address space and/or for individual memory region. In the system, operation right data indicating which thread can be operated by which thread among a plurality of threads are stored, and whether a thread operation with respect to one thread requested by another thread among a plurality of threads is allowed by the operation right data is judged. Then, the processor is allowed to carry out said thread operation with respect to that one thread by that another thread only when it is judged that said thread operation is allowed by the operation right data.

摘要翻译： 程序执行和操作权限管理系统能够均匀地提供灵活和足够的保护，即使对于共享相同虚拟地址空间的线程和/或针对各个存储器区域的线程操作指令也是如此。 在系统中，指示存储多个线程中的哪个线程可以操作哪个线程的操作权限数据，以及在多个线程中由另一个线程请求的一个线程的线程操作是否被操作权限数据 被判断。 然后，只有当判断出操作权限数据允许所述线程操作时，才允许处理器通过该另一线程对该线程执行所述线程操作。

公开(公告)号：US20100097799A1

公开(公告)日：2010-04-22

申请号：US12371493

申请日：2009-02-13

申请人： Sung Ho SHIN

发明人： Sung Ho SHIN

IPC分类号： F21V1/00

CPC分类号： F21V29/83 ,  F21V29/717 ,  F21V29/763 ,  F21V29/767 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28D15/0275

摘要： An LED lighting flood lamp having a double heat dissipation plate structure using nano spreaders are provided, in which the double heat dissipation plate structure is formed by installing the nano spreaders having high heat diffusion inside the lamp and forming heat dissipation plates on upper and lower parts of the nano spreaders, and heat dissipation pins are arranged in zigzag on the upper part of the upper heat dissipation plate, so that the heat dissipation efficiency is maximized, and the lamp has a slim external appearance without being limited in installation space. The LED lighting flood lamp includes LEDs, an LED mounting substrate on which the LEDs are mounted, nano spreaders mounted on an upper side of the LED mounting substrate, an upper heat dissipation plate fixed to an upper side of the nano spreaders and having a plurality of heat dissipation pins formed on an upper surface thereof, a lower heat dissipation plate fixed to a lower part of the LED mounting substrate, and a diffusion lens plate fixed to a lower part of the lower heat dissipation plate.

摘要翻译： 提供了具有使用纳米吊具的双散热板结构的LED照明泛光灯，其中通过在灯内安装具有高热扩散的纳米扩散器并在上部和下部形成散热板来形成双散热板结构 的纳米扩散器，散热销在上部散热板的上部以锯齿形布置，使得散热效率最大化，并且灯具外形美观，而不会受到安装空间的限制。 LED照明泛光灯包括LED，安装有LED的LED安装基板，安装在LED安装基板的上侧的纳米吊具，固定在纳米吊具上侧的上部散热板，并具有多个 形成在其上表面的散热销，固定在LED安装基板的下部的下部散热板和固定在下部散热板的下部的漫射透镜板。

公开(公告)号：US20100091487A1

公开(公告)日：2010-04-15

申请号：US12371521

申请日：2009-02-13

申请人： Sung Ho Shin

发明人： Sung Ho Shin

IPC分类号： F21V29/00 ,  F21S4/00 ,  F21V1/00

CPC分类号： F21V3/02 ,  F21K9/23 ,  F21K9/232 ,  F21S45/47 ,  F21V29/74 ,  F21V29/83 ,  F21Y2115/10

摘要： A heat dissipation member having variable heat dissipation paths and an LED lighting flood lamp using the same are provided, which can maximize heat dissipation effect by widening an air contact area and making air flow rapidly, seek a waterproof effect and prevention of a scald due to contact with a high-temperature heat dissipation plate, and prevent the reduction of heat dissipation efficiency caused by foreign substances by keeping wings of the heat dissipation plate not exposed to an outside. The LED lighting flood lamp using a heat dissipation member having variable heat dissipation paths includes LEDs, an LED mounting substrate on which the LEDs are mounted, a heat dissipation member having a lower part to which the LED mounting substrate is fixed and provided with the variable heat dissipation paths formed thereon, an upper cap fixed to outer surfaces of heat dissipation plates of the heat dissipation member; a fixing ring member fixed to the lower part of the heat dissipation member to achieve inflow of outside air, and a lower lens fixed to a lower part of the cap.

摘要翻译： 提供具有可变散热路径的散热构件和使用其的LED照明泛光灯，其可以通过加宽空气接触面积并使空气流快速地最大化散热效果，寻求防水效果并防止由于 与高温散热板接触，并且通过将散热板的翅片保持不暴露于外部来防止由异物引起的散热效率的降低。 使用具有可变散热路径的散热构件的LED照明泛光灯包括LED，安装有LED的LED安装基板，具有LED安装基板固定的下部的散热构件， 形成在其上的散热路径，固定在散热构件的散热板的外表面上的上盖; 固定在所述散热构件的下部以实现外部空气的流入的固定环构件，以及固定在所述盖的下部的下部透镜。