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21 条记录 (耗时 0.021 秒)

    Wire to conductive metal plate laser welding structure
    1.
    发明授权
    Wire to conductive metal plate laser welding structure 有权
    导线金属板激光焊接结构

    公开(公告)号：US08759679B2

    公开(公告)日：2014-06-24

    申请号：US13238634

    申请日：2011-09-21

    申请人： Takushi Yoshida ,  Tomoki Inudo ,  Hiroshi Akimoto

    发明人： Takushi Yoshida ,  Tomoki Inudo ,  Hiroshi Akimoto

    IPC分类号： B23K11/00 ,  B23K26/00

    CPC分类号： H01R43/0221 ,  H01R4/023 ,  Y10T428/12493

    摘要： A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.

    摘要翻译： 一种激光焊接结构，其通过局部施加激光束将信号线的绞合线（wire）和焊接部（导电性金属板）接合而形成，从而使信号线的绞合线和焊接部熔化固化 具有以下特点。 也就是说，信号线的绞合线的熔点和焊接部分的熔点不同。 通过将激光束施加到信号线的绞合线和具有较高熔点的焊接部分之间，即具有较高熔点的焊接部分上的激光焊接结构。

    Connector easily enabling a reduction in thickness and being structurally stable
    2.
    发明授权
    Connector easily enabling a reduction in thickness and being structurally stable 有权
    连接器容易实现厚度的减小并且在结构上稳定

    公开(公告)号：US08690613B2

    公开(公告)日：2014-04-08

    申请号：US13406973

    申请日：2012-02-28

    申请人： Takushi Yoshida ,  Hiroshi Akimoto

    发明人： Takushi Yoshida ,  Hiroshi Akimoto

    IPC分类号： H01R12/00

    CPC分类号： H01R43/16 ,  H01R12/7082 ,  H01R43/24

    摘要： A conductive terminal member is disposed at a portion between an insulating base film and an insulating cover film while insulating intermediate members are disposed at other portions therebetween. In this event, the intermediate members are formed in predetermined shapes and are located so as not to overlap the terminal member. The base film and the cover film are each melt-fixed to the intermediate members so that the terminal member is fixedly held between the base member and the cover film and with the terminal member 14 bent to penetrate windows 11b, 11c in the base and cover to form contact portions 14a, 14c.

    摘要翻译： 导电端子构件设置在绝缘基膜和绝缘覆盖膜之间的部分处，同时绝缘中间构件设置在其间的其它部分。 在这种情况下，中间构件形成为预定形状并且被定位成不与端子构件重叠。 基片和覆盖膜各自熔融固定在中间部件上，使得端子部件固定地保持在基件与覆盖膜之间，并且端子部件14弯曲以穿透基部和盖子中的窗口11b，11c 以形成接触部分14a，14c。

    WIRE TO CONDUCTIVE METAL PLATE LASER WELDING STRUCTURE
    4.
    发明申请
    WIRE TO CONDUCTIVE METAL PLATE LASER WELDING STRUCTURE 有权
    导电金属板激光焊接结构

    公开(公告)号：US20120237787A1

    公开(公告)日：2012-09-20

    申请号：US13238634

    申请日：2011-09-21

    申请人： Takushi YOSHIDA ,  Tomoki Inudo ,  Hiroshi Akimoto

    发明人： Takushi YOSHIDA ,  Tomoki Inudo ,  Hiroshi Akimoto

    IPC分类号： B32B15/00

    CPC分类号： H01R43/0221 ,  H01R4/023 ,  Y10T428/12493

    摘要： A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.

    摘要翻译： 一种激光焊接结构，其通过局部施加激光束将信号线的绞合线（wire）和焊接部（导电性金属板）接合而形成，从而使信号线的绞合线和焊接部熔化固化 具有以下特点。 也就是说，信号线的绞合线的熔点和焊接部分的熔点不同。 通过将激光束施加到信号线的绞合线和具有较高熔点的焊接部分之间，即具有较高熔点的焊接部分上的激光焊接结构。

    Substrate treating system, substrate treating device, program, and recording medium
    6.
    发明申请
    Substrate treating system, substrate treating device, program, and recording medium 有权
    基板处理系统，基板处理装置，程序和记录介质

    公开(公告)号：US20060151112A1

    公开(公告)日：2006-07-13

    申请号：US10541507

    申请日：2003-12-25

    申请人： Takushi Yoshida ,  Masaya Washio

    发明人： Takushi Yoshida ,  Masaya Washio

    IPC分类号： C23F1/00

    CPC分类号： H01L21/67253 ,  B08B3/00 ,  B08B3/02 ,  C03C15/00 ,  C03C23/0075 ,  G11B23/505

    摘要： Of process steps of polymer removal in a substrate processing apparatus (3), in a step of discharging and spreading a removal solution to coat a rotating substrate (W), data indicative of the number of revolutions of a substrate, the temperature and flow rate of a removal solution, and removal solution discharge time is collected and a combination thereof is synthetically assessed to detect a processing abnormality. In a pure water discharge step, data indicative of the number of revolutions of a substrate, the flow rate of pure water and pure water discharge time is collected and a combination thereof synthetically assessed to detect a processing abnormality. Thus, a processing abnormality in polymer removal is detected based on a combination of important control elements in important steps largely exerting influence on the results of processing, thereby allowing detection of a processing abnormality with a higher degree of accuracy.

    摘要翻译： 在基板处理装置（3）中的聚合物去除的工艺步骤中，在排出和铺展除去溶液以涂覆旋转基板（W）的步骤中，指示基板的转数，温度和流速 的去除溶液，并且收集去除溶液的放电时间，并综合评估其组合以检测处理异常。 在纯水排出步骤中，收集表示基板的转数，纯水的流量和纯水排出时间的数据，合成评价其组合以检测处理异常。 因此，基于重要步骤中的重要控制元件的组合检测聚合物去除中的处理异常，大大影响处理结果，从而以更高的准确度检测处理异常。

    System for and method of processing substrate
    7.
    发明授权
    System for and method of processing substrate 有权

    公开(公告)号：US06807455B2

    公开(公告)日：2004-10-19

    申请号：US10459833

    申请日：2003-06-11

    申请人： Takushi Yoshida ,  Tetsuya Hamada

    发明人： Takushi Yoshida ,  Tetsuya Hamada

    IPC分类号： G06F1900

    CPC分类号： H01L21/6715 ,  G05B2219/32192 ,  G05B2219/33284 ,  G05B2219/45031 ,  H01L21/67253 ,  Y02P90/22

    摘要： A reference command value is transmitted from an apparatus server (90) through a network (96d) to spin processing units (SR1-SR4) of a substrate processing apparatus (1). Next, a plurality of correction amounts for making processing states in the respective spin processing units (SR1-SR4) substantially the same are computed from a plurality of measured values corresponding to the respective spin processing units (SR1-SR4) and the reference command value, and are additionally stored in a correction amount database (90a). For execution of substrate processing, a plurality of correction amounts corresponding to the reference command value are extracted from the database, and corresponding ones of the correction amounts plus the reference command value are transmitted to the respective spin processing units (SR1-SR4).

    Damper means
    9.
    发明授权
    Damper means 失效
    阻尼器意味着

    公开(公告)号：US5871207A

    公开(公告)日：1999-02-16

    申请号：US725743

    申请日：1996-10-04

    申请人： Takushi Yoshida

    发明人： Takushi Yoshida

    IPC分类号： A47B91/04 ,  A47B97/00 ,  F16F15/04 ,  B60H3/12 ,  A47B23/00 ,  B60R5/00 ,  F16M1/00

    CPC分类号： F16F15/04

    摘要： A damper device for attachment to a shock-affected component, including a pair of elastic members for absorbing shock which may be applied to the shock-affected component, each of the elastic members taking the form of a block and having first and second sides which are opposite to each other, and a slit formed in the first side and extending into the interior of the elastic member, a support member for supporting the elastic members, the support member having a pair of spaced apart projecting pieces and an intermediate section interconnecting the spaced apart projecting pieces, each of the projecting pieces being formed to have a substantially inverted L-shape in cross-section, the intermediate section being adapted to be mounted on the shock-affected component, the elastic members being adapted to be supported to the support member by causing the elastic members to be fitted on tips of the projecting pieces through slits in the elastic members, and a pair of receiving plates adapted to be mounted on the shock-affected component close to second sides of the elastic members and elastically engaged with the second sides the elastic members and elastically engaged with the second sides of the elastic members, so that where the damper device is attached to the shock-affected component, the elastic members are securely supported to the shock-affected component through the support members and receiving plates without readily detaching from the shock-affected component.

    摘要翻译： 一种用于附接到受冲击影响的部件的阻尼器装置，包括一对用于吸收冲击的弹性部件，所述弹性部件可应用于受冲击影响的部件，每个弹性部件呈块形，具有第一和第二侧 彼此相对，并且形成在第一侧并延伸到弹性构件内部的狭缝，用于支撑弹性构件的支撑构件，支撑构件具有一对间隔开的突出片和中间部分， 间隔开的突出片，每个突出片形成为具有大致倒L形的横截面，中间部分适于安装在受冲击影响的部件上，弹性部件适于被支撑到 支撑构件通过使弹性构件通过弹性构件中的狭缝装配在突出片的顶端上，并且适配于一对接收板 安装在靠近弹性构件的第二侧的受冲击影响的部件上并与弹性构件的第二侧弹性接合并与弹性构件的第二侧弹性接合，使得在阻尼器装置附接到冲击 受影响的部件，弹性构件通过支撑构件和接收板牢固地支撑到受冲击影响的部件上，而不易与冲击影响的部件分离。