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公开(公告)号：US07442925B2
公开(公告)日：2008-10-28
申请号：US11370006
申请日：2006-03-04
申请人： Masatoshi Yasutake , Takuya Nakaue , Kazutoshi Watanabe , Osamu Takaoka , Atsushi Uemoto , Naoya Watanabe , Yoshiteru Shikakura
发明人： Masatoshi Yasutake , Takuya Nakaue , Kazutoshi Watanabe , Osamu Takaoka , Atsushi Uemoto , Naoya Watanabe , Yoshiteru Shikakura
IPC分类号： G01N13/16
CPC分类号： G01N23/225 , G01Q60/34
摘要： The present invention provides a working method using a scanning probe which can enhance a working speed and prolong a lifetime of the probe. The present invention provides the working method using a scanning probe which works a sample by performing the relative scanning of a probe supported on a cantilever on the sample at a predetermined scanning speed. The working method can work the object to be worked while forcibly and relatively vibrating the probe in the direction orthogonal to or parallel to a working surface of the sample at low frequency of 100 to 1000 Hz.
摘要翻译： 本发明提供一种使用扫描探针的工作方法，其可以提高工作速度并延长探针的寿命。 本发明提供了使用扫描探针的工作方法，该扫描探针通过以预定扫描速度执行支撑在样品上的悬臂上的探针的相对扫描来对样品进行工作。 该工作方法可以在100至1000Hz的低频下，以与样品的工作表面正交或平行的方向强制地相对振动探针，从而对被加工物进行加工。
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2.发明申请公开(公告)号：US20080132151A1
公开(公告)日：2008-06-05
申请号：US11810230
申请日：2007-06-04
CPC分类号： G03F1/82 , G03F7/0002
摘要： There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.
摘要翻译： 有一个微加工设备，用于去除在加工时产生的微加工粉尘，同时使用探头将工件M加工在液体W内。 该装置包括：工件待放置的台阶; 具有探针尖端的探针，具有移动装置的加工装置，所述移动装置使所述载物台和所述探针相对于彼此移动，以通过所述探针末端加工所述工件;以及微加工除尘装置，其具有第一电极和第二电极 其布置在液体中以夹住探针尖端;以及电压施加装置，其在两个电极之间施加电压以移动液体中的微加工灰尘。
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3.发明申请PHOTOMASK DEFECT-SHAPE RECOGNITION APPARATUS, PHOTOMASK DEFECT-SHAPE RECOGNITION METHOD, AND PHOTOMASK DEFECT CORRECTION METHOD 审中-公开光电子缺陷形状识别装置，光电子缺陷形状识别方法和光电子缺陷校正方法公开(公告)号：US20090028420A1
公开(公告)日：2009-01-29
申请号：US12175061
申请日：2008-07-17
申请人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
发明人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
CPC分类号： G03F1/84
摘要： To recognize a defect portion and a mask pattern with a distinctly distinguished state through AFM observation of a photomask without being influenced by a double-tips image, provided is a method of recognizing, through AFM observation of a photomask including a substrate (2) and the mask pattern formed on the substrate (2a) with a predetermined pattern, a shape (5) of a projection type defect portion projected from the mask pattern, including the steps of storing a reference image an observation image in which an edge line of the defect portion is first confirmed at the time of AFM observation; and correcting, after the storing step, the edge line (L2) of the defect portion confirmed through the observation image obtained by the scanning performed hereinafter into a normal line (L1) with reference to the reference image, in which the shape of the defect portion is recognized based on the observed image after the correction.
摘要翻译： 通过AFM观察光掩模来识别具有明显区分状态的缺陷部分和掩模图案，而不受双尖端图像的影响，提供了一种通过AFM观察包括基板（2）和 以预定图案形成在基板（2a）上的掩模图案，从掩模图案突出的投影型缺陷部分的形状（5），包括以下步骤：将参考图像存储在其中的观察图像， AFM观察时首先确认缺陷部位; 并且在存储步骤之后，通过下文进行的扫描获得的观察图像确定的缺陷部分的边缘线（L2）参照参考图像变为法线（L1），其中缺陷的形状 基于校正后的观察图像来识别部分。
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4.发明申请公开(公告)号：US20070278177A1
公开(公告)日：2007-12-06
申请号：US11809518
申请日：2007-06-01
申请人： Kazushige Kondo , Masatoshi Yasutake , Takuya Nakaue , Osamu Takaoka , Atsushi Uemoto , Kazutoshi Watanabe , Yoshiteru Shikakura
发明人： Kazushige Kondo , Masatoshi Yasutake , Takuya Nakaue , Osamu Takaoka , Atsushi Uemoto , Kazutoshi Watanabe , Yoshiteru Shikakura
摘要： Under the condition that the height is fixed at a target height by turning off a feedback control system of a Z piezoelectric actuator of a cantilever of an atomic force microscope having a probe, which is harder than a processed material, flexure and twisting of the cantilever when carrying out mechanical processing while selectively repeating scanning only on the processed area (in the case of detecting flexure, parallel with the cantilever and in the case of detecting twisting, vertical with the cantilever) is monitored by a quadrant photodiode position sensing detector and the processing is repeated till a flexure amount or a twisting amount, namely, till an elastic deformation amount of the cantilever becomes not more than a determined threshold. It is not necessary to carry out scanning of the observation in obtaining the height information for detection of an end point, so that it is possible to improve a throughput of processing.
摘要翻译： 通过关闭具有探针的原子力显微镜的悬臂的Z型压电致动器的反馈控制系统，该高度被固定在目标高度的条件下，其比加工材料更硬，悬臂的弯曲和扭曲 当在被处理区域（在检测弯曲的情况下，与悬臂平行的情况下，并且在检测到扭转的情况下，与悬臂垂直的情况下）进行机械处理时，通过象限光电二极管位置感测检测器监视 重复加工直到挠曲量或扭转量，即直到悬臂的弹性变形量变得不大于确定的阈值。 在获得用于检测终点的高度信息时，不需要进行观察的扫描，从而可以提高处理的吞吐量。
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公开(公告)号：US20070131249A1
公开(公告)日：2007-06-14
申请号：US11633333
申请日：2006-12-04
申请人： Takuya Nakaue
发明人： Takuya Nakaue
摘要： A probe to which a foreign matter has adhered is pressed to a sample. At this time, between a scanner in a cantilever side and a sample base, there are relatively generated a horizontal oscillation and a vertical oscillation. By generating a suitable friction to the probe tip, the foreign matter having adhered to the tip of the probe is removed, and it can be washed.
摘要翻译： 将具有异物附着的探针按压到样品上。 此时，在悬臂侧的扫描仪和样本基座之间，相对产生水平振荡和垂直振荡。 通过向探针尖端产生合适的摩擦力，去除了附着在探针的尖端上的异物，并且可以将其清洗。
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6.发明授权公开(公告)号：US08062494B2
公开(公告)日：2011-11-22
申请号：US11810230
申请日：2007-06-04
IPC分类号： B23H7/00
CPC分类号： G03F1/82 , G03F7/0002
摘要： There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.
摘要翻译： 有一个微加工设备，用于去除在加工时产生的微加工粉尘，同时使用探头将工件M加工在液体W内。 该装置包括：工件待放置的台阶; 具有探针尖端的探针，具有移动装置的加工装置，所述移动装置使所述载物台和所述探针相对于彼此移动，以通过所述探针末端加工所述工件;以及微加工除尘装置，其具有第一电极和第二电极 其布置在液体中以夹住探针尖端;以及电压施加装置，其在两个电极之间施加电压以移动液体中的微加工灰尘。
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7.发明申请公开(公告)号：US20090092905A1
公开(公告)日：2009-04-09
申请号：US12145985
申请日：2008-06-25
申请人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
发明人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
CPC分类号： G03F1/72 , G01Q80/00 , G03F1/84 , Y10T83/162
摘要： Provided is a photomask defect correction method of correcting a defect on a photomask including a substrate (2) and a mask pattern (3) by cutting and removing processing a defect portion (5) based on observation data obtained through AFM observation of the photomask in advance, including: an area setting step of setting a processing area (E1) based on the observation data, and setting areas adjacent to the processing area as removing processing areas (E2) of cutting wastes for cutting and removing the cutting wastes which are produced by the cutting and removing processing and may be firmly adhered; a processing step of cutting and removing processing the defect portion with a probe; and a moving step of moving the cutting wastes by scanning the probe with a weaker pressing force than the pressing force at the time of cutting and processing within the removing processing areas of cutting wastes to conduct a cutting wastes removing process.
摘要翻译： 提供一种光掩模缺陷校正方法，其通过基于通过光掩模的AFM观察获得的观察数据，通过对缺陷部分（5）进行切割和去除处理来校正包括基板（2）和掩模图案（3）的光掩模上的缺陷 包括：基于观察数据设定处理区域（E1）的区域设定步骤和与处理区域相邻的设定区域作为切割废弃物的去除处理区域（E2），该处理区域用于切割和去除生成的切割废弃物 通过切割和去除加工，并可以牢固地粘附; 用探针对缺陷部进行切削加工的加工工序; 以及通过以比在切割废料的去除处理区域内的切割和加工时的按压力更弱的按压力扫描探针以进行切割废物除去处理来移动切割废料的移动步骤。
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8.发明申请公开(公告)号：US20090038383A1
公开(公告)日：2009-02-12
申请号：US12145952
申请日：2008-06-25
申请人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
发明人： Takuya Nakaue , Atsushi Uemoto , Osamu Takaoka
IPC分类号： G01B5/28
摘要： Provided is a photomask defect correction method including: an observing step of scanning plurality of lines one after another while controlling a distance between the probe tip and a surface (2a) of the substrate so that displacement of the probe becomes constant to recognize a shape of the defect portion (5) through AFM observation; and a processing step of scanning a plurality of lines one after another while pressing the probe tip to the recognized defect portion with a predetermined force to subject the defect portion to cutting and removing processing, in which, at the observing step, the scanning for every one line is set in a parallel direction (C direction) to an edge (3a) of a mask pattern (3), and the scanning of the plurality of lines is performed one after another from the mask pattern side towards a tip side (D direction) of the defect portion.
摘要翻译： 提供一种光掩模缺陷校正方法，包括：在控制探针尖端与基板的表面（2a）之间的距离的同时扫描多条线的观察步骤，使得探针的位移变得恒定，以识别 通过AFM观察的缺陷部分（5）; 以及处理步骤，其以预定的力将探针尖端按压到所识别的缺陷部分，一次一个地扫描多条线，以使缺陷部分进行切割和去除处理，其中在观察步骤中，对于每个 将一条线设置在与掩模图案（3）的边缘（3a）平行的方向（C方向）上，并且从掩模图案侧朝向尖端侧（D）逐个进行多条线的扫描 方向）。
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公开(公告)号：US20060219901A1
公开(公告)日：2006-10-05
申请号：US11370006
申请日：2006-03-04
申请人： Masatoshi Yasutake , Takuya Nakaue , Kazutoshi Watanabe , Osamu Takaoka , Atsushi Uemoto , Naoya Watanabe , Yoshiteru Shikakura
发明人： Masatoshi Yasutake , Takuya Nakaue , Kazutoshi Watanabe , Osamu Takaoka , Atsushi Uemoto , Naoya Watanabe , Yoshiteru Shikakura
CPC分类号： G01N23/225 , G01Q60/34
摘要： The present invention provides a working method using a scanning probe which can enhance a working speed and prolong a lifetime of the probe. The present invention provides the working method using a scanning probe which works a sample by performing the relative scanning of a probe supported on a cantilever on the sample at a predetermined scanning speed. The working method can work the object to be worked while forcibly and relatively vibrating the probe in the direction orthogonal to or parallel to a working surface of the sample at low frequency of 100 to 1000 Hz.
摘要翻译： 本发明提供一种使用扫描探针的工作方法，其可以提高工作速度并延长探针的寿命。 本发明提供了使用扫描探针的工作方法，该扫描探针通过以预定扫描速度执行支撑在样品上的悬臂上的探针的相对扫描来对样品进行工作。 该工作方法可以在100至1000Hz的低频下，以与样品的工作表面正交或平行的方向强制地相对振动探针，从而对被加工物进行加工。
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