公开(公告)号：US20070284759A1

公开(公告)日：2007-12-13

申请号：US11587240

申请日：2005-04-21

申请人： Hiroshi Suguro ,  Hideto Sakata ,  Terunao Tsuchiya ,  Takaichi Shimomura

发明人： Hiroshi Suguro ,  Hideto Sakata ,  Terunao Tsuchiya ,  Takaichi Shimomura

IPC分类号： H01L21/58 ,  B30B9/30 ,  H01L23/12

CPC分类号： H01L23/49855 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07754 ,  H01L21/67144 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/16238 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.

摘要翻译： 制造具有IC标签的片材1的方法包括以下步骤：制备和供给片21a，其上形成有电导体; 在片材21a上提供具有电导体的粘合剂18; 制备多个IC芯片20并连续馈送IC芯片20; 将每个IC芯片20连续地布置在片材21a的电导体22上; 并且通过粘合剂18将每个IC芯片20固定到电导体22上。 形成有电导体的片材21a包括非导电片21和一对电导体22。 片21a的一对电导体22与电导体一起设置在非导电片21上，沿馈送方向延伸并且彼此间隔开。

公开(公告)号：US06890385B2

公开(公告)日：2005-05-10

申请号：US10399943

申请日：2002-08-23

申请人： Terunao Tsuchiya ,  Takuya Sakata

发明人： Terunao Tsuchiya ,  Takuya Sakata

IPC分类号： C23C14/04 ,  C23C16/00 ,  C23C16/04

CPC分类号： C23C14/042

摘要： A second metal mask (13) having a screen part (13A) provided with a plurality of parallel, fine slits (13a) arranged at very small intervals is placed on a base plate (12) serving also as a first metal mask and provided with a plurality of windows (18) defining regions in which a material is to be deposited. One end of the second metal mask (13) is fastened to the base plate (12) by a mask clamp (20) and the other end of the same is fastened to a slider (23). Resilient force is applied to the slider (23) by compression coil springs (30). Thus, the screen part (13A) of the second metal mask (13) is tensioned and thereby the slits (13a) are stretched straight and are extended at predetermined pitches. A substrate (17) placed on the second mask (13) is subjected to a vacuum evaporation process to form fine patterns on the substrate (17) in a gang-patterning mode.

摘要翻译： 具有设置有以非常小的间隔排列的多个平行的细小狭缝（13a）的屏幕部分（13A）的第二金属掩模（13）被放置在也用作第一金属掩模的基板（12）上，并且 设置有限定要在其中沉积材料的区域的多个窗口（18）。 第二金属掩模（13）的一端通过掩模夹（20）固定在基板（12）上，并且另一端固定在滑块（23）上。 弹性力通过压缩螺旋弹簧（30）施加到滑块（23）。 因此，第二金属掩模（13）的屏幕部分（13A）被张紧，从而狭缝（13a）被拉直并且以预定间距延伸。 放置在第二掩模（13）上的衬底（17）进行真空蒸发处理，以在组合图形模式下在衬底（17）上形成精细图案。

公开(公告)号：US08456307B2

公开(公告)日：2013-06-04

申请号：US11587240

申请日：2005-04-21

申请人： Hiroshi Suguro ,  Hideto Sakata ,  Terunao Tsuchiya ,  Takaichi Shimomura

发明人： Hiroshi Suguro ,  Hideto Sakata ,  Terunao Tsuchiya ,  Takaichi Shimomura

IPC分类号： G08B13/14

CPC分类号： H01L23/49855 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07754 ,  H01L21/67144 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/16238 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.

摘要翻译： 制造具有IC标签的片材1的方法包括以下步骤：制备并供给具有形成在其上的电导体的片材21a; 在带有电导体的片材21a上提供粘合剂18; 制备多个IC芯片20并连续馈送IC芯片20; 将每个IC芯片20依次布置在片21a的电导体22上; 并且通过粘合剂18将每个IC芯片20固定到电导体22上。其上形成有电导体的片材21a包括非导电片21和一对电导体22.片21a的一对电导体22具有 电导体设置在非导电片21上，沿进给方向延伸并且彼此间隔开。