公开(公告)号：US09111967B2

公开(公告)日：2015-08-18

申请号：US13446255

申请日：2012-04-13

申请人： Kenji Sekiguchi ,  Yasushi Fujii ,  Tetsuya Sakazaki

发明人： Kenji Sekiguchi ,  Yasushi Fujii ,  Tetsuya Sakazaki

IPC分类号： B08B9/00 ,  H01L21/67 ,  C11D7/50 ,  C11D11/00 ,  H01L21/02 ,  H01L21/768

CPC分类号： H01L21/67051 ,  C11D7/5004 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/76898

摘要： Disclosed is a liquid processing method capable of rapidly penetrating a liquid chemical into a concave portion formed on the surface of a substrate with the chemical liquid. The liquid processing method includes wetting the inside of the concave portion by supplying an organic solvent having surface tension smaller than the chemical liquid to the substrate, and cleaning the inside of the concave portion with the chemical liquid by supplying a cleaning liquid including the chemical liquid to the substrate and substituting the liquid inside the concave portion with the chemical liquid.

摘要翻译： 公开了一种液体处理方法，其能够将化学液体迅速地渗透到形成在基板表面上的凹部中。 液体处理方法包括通过向基板供给具有小于化学液体的表面张力的有机溶剂来润湿凹部的内部，并且通过提供包含化学液体的清洗液，用化学液体清洁凹部的内部 并用化学液体代替凹部内的液体。

公开(公告)号：US20120260949A1

公开(公告)日：2012-10-18

申请号：US13446255

申请日：2012-04-13

申请人： Kenji SEKIGUCHI ,  Yasushi FUJII ,  Tetsuya SAKAZAKI

发明人： Kenji SEKIGUCHI ,  Yasushi FUJII ,  Tetsuya SAKAZAKI

IPC分类号： B08B3/08 ,  B08B9/093 ,  B08B3/02

CPC分类号： H01L21/67051 ,  C11D7/5004 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/76898

摘要： Disclosed is a liquid processing method capable of rapidly penetrating a liquid chemical into a concave portion formed on the surface of a substrate with the chemical liquid. The liquid processing method includes wetting the inside of the concave portion by supplying an organic solvent having surface tension smaller than the chemical liquid to the substrate, and cleaning the inside of the concave portion with the chemical liquid by supplying a cleaning liquid including the chemical liquid to the substrate and substituting the liquid inside the concave portion with the chemical liquid.

摘要翻译： 公开了一种液体处理方法，其能够将化学液体迅速地渗透到形成在基板表面上的凹部中。 液体处理方法包括通过向基板供给具有小于化学液体的表面张力的有机溶剂来润湿凹部的内部，并且通过提供包含化学液体的清洗液，用化学液体清洁凹部的内部 并用化学液体代替凹部内的液体。