公开(公告)号：US08225500B2

公开(公告)日：2012-07-24

申请号：US12586242

申请日：2009-09-17

申请人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A process to make a connector is enclosed. The claimed embodiment comprises the following steps. First, design an insulating substrate using a customer specification. Second, program a Computer Numerical Control machine tool to form holes in the insulating substrate according to the design made in step one. Third, program a computer controlled dispensing machine tool to dispense conductive polymer into each hole formed in step 2. Fourth, form holes in the insulating substrate using the programmed Computer Numerical Control machine tool. Fifth, place a pin in each hole. Sixth, using a computer controlled automated dispensing machine, dispense electrically conductive polymer into each hole around the pin. And, finally, cure the polymer to hold the pin in place.

摘要翻译： 封装一个连接器的过程。 所要求保护的实施例包括以下步骤。 首先，使用客户规格设计绝缘基板。 二，根据第一步设计的计算机数控机床在绝缘基板上形成孔。 第三，编写计算机控制的分配机床，以将导电聚合物分配到在步骤2中形成的每个孔中。第四，使用编程的计算机数字控制机床在绝缘基板中形成孔。 第五，在每个孔中放一个针。 第六，使用计算机控制的自动点胶机，将导电聚合物分配到销周围的每个孔中。 并且，最后，固化聚合物以将销固定到位。

公开(公告)号：US20100024211A1

公开(公告)日：2010-02-04

申请号：US12584629

申请日：2009-09-08

申请人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H05K3/00

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

摘要翻译： 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

公开(公告)号：US20100018054A1

公开(公告)日：2010-01-28

申请号：US12586136

申请日：2009-09-16

申请人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H01R43/04

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

摘要翻译： 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

公开(公告)号：US08499442B2

公开(公告)日：2013-08-06

申请号：US12584629

申请日：2009-09-08

申请人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H01R9/00

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

摘要翻译： 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，Ultem®，Polyimide，Torlon®。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

公开(公告)号：US07666008B2

公开(公告)日：2010-02-23

申请号：US11803979

申请日：2007-05-15

申请人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H01R4/58

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastomechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastomeric Memory Material. One embodiment includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastomeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastomeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. Another embodiment substitutes a metal plated through hole for the pin and uses elastomeric flex dots on both ends of the through hole.

摘要翻译： 用于产生弹性连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 一个实施例包括安装在绝缘体（3）中的机械销（2），每个机械销顶部均有导电弹性体复合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 另一个实施例用金属电镀通孔代替销，并在通孔的两端使用弹性体挠性点。

公开(公告)号：US20100005651A1

公开(公告)日：2010-01-14

申请号：US12586242

申请日：2009-09-17

申请人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H05K3/00

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

公开(公告)号：US20080072422A1

公开(公告)日：2008-03-27

申请号：US11803979

申请日：2007-05-15

申请人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

发明人： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC分类号： H01R12/00

CPC分类号： H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

摘要翻译： 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。