公开(公告)号：US5346765A

公开(公告)日：1994-09-13

申请号：US768302

申请日：1992-03-04

申请人： Shigeru Maeda ,  Tomoharu Miyamoto

发明人： Shigeru Maeda ,  Tomoharu Miyamoto

IPC分类号： H05K13/00 ,  H05K13/02 ,  H05K13/04 ,  B32B5/16 ,  B32B7/12

CPC分类号： H05K13/0084 ,  H05K13/021 ,  H05K13/0417 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891 ,  Y10T428/2896

摘要： A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination, said thermoplastic resin consisting of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate resin or polyester resin, or their combination.

摘要翻译： PCT No.PCT / JP91 / 00133 Sec。 371日期：1992年3月4日 102（e）1992年3月4日PCT PCT 1991年2月5日PCT公布。 WO91 / 12187 PCT出版物 日本1991年8月22日。一种用于包装芯片型电子部件的盖带，其可热封到具有给定间隔的塑料载带，用于容纳芯片型电子部件，其特征在于，外层是 由聚酯，聚丙烯或尼龙组成的双轴取向膜，粘合层由导电细粉末在热塑性树脂中的分散体组成，所述导电细粉末由氧化锡，氧化锌，氧化钛，炭黑或Si-基有机 化合物或其组合，所述热塑性树脂由聚氨酯树脂，丙烯酸树脂，聚氯乙烯树脂，乙烯 - 乙酸乙烯酯树脂或聚酯树脂组成，或它们的组合。

公开(公告)号：US5208103A

公开(公告)日：1993-05-04

申请号：US785116

申请日：1991-10-30

申请人： Tomoharu Miyamoto ,  Shigeru Maeda

发明人： Tomoharu Miyamoto ,  Shigeru Maeda

IPC分类号： C09J7/02 ,  H05K13/00

CPC分类号： C09J7/0203 ,  C09J7/0296 ,  H05K13/0084 ,  C09J2201/162 ,  Y10S428/922 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/2878 ,  Y10T428/2891 ,  Y10T428/2896

摘要： The present invention provides a cover tape used for packaging of electronic parts in the form of a chip, which comprises an outer layer, an intermediate layer and an adhesion layer and which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film, the intermediate layer is a polyolefin film which causes its own cohesive failure to enable peeling, and the adhesion layer consists of a dispersion of conductive fine powders of tin oxide or the like in a thermoplastic resin. In the cover tape, the adhesion layer has been subjected to antistatic treatment using the conductive fine powders, and hence generation of static electricity by the contact of the electronic parts with the cover tape or at the time of cover tape pelling is reduced, and the antistatic effect is stable against the use conditions and the lapse of time and has no influence on the sealing property of the cover tape.

公开(公告)号：US20150174004A1

公开(公告)日：2015-06-25

申请号：US14363001

申请日：2012-02-24

申请人： Tomoharu Miyamoto ,  Kazumasa Kimoto ,  Yoshimichi Ohya ,  Ryo Yamaguchi ,  Katsuhiro Shimizu ,  Masaki Takeda

发明人： Tomoharu Miyamoto ,  Kazumasa Kimoto ,  Yoshimichi Ohya ,  Ryo Yamaguchi ,  Katsuhiro Shimizu ,  Masaki Takeda

IPC分类号： A61J1/03 ,  B65D75/36 ,  B65D75/52 ,  B65D25/20

CPC分类号： A61J1/035 ,  A61J7/04 ,  A61J2205/50 ,  B65D25/205 ,  B65D75/367 ,  B65D75/527 ,  B65D2575/3245

摘要： A tablet packaging body (100), comprising: a main body sheet (200) and a sealing member (300). The main body sheet (200) has a recessed section (230). The sealing member (300) is sealed to the main body sheet (200) so as to cover an opening in the recessed section (230). The sealing member (300) can be readily peeled from at least one section of the main body sheet (200) such that the recessed section (230) is opened. The recessed section (230) has a size whereby a plurality of medicines (T3) can be housed therein.

摘要翻译： 一种片剂包装体（100），包括：主体片（200）和密封件（300）。 主体片（200）具有凹部（230）。 密封构件（300）被密封到主体片（200）以覆盖凹部（230）中的开口。 密封构件（300）可以容易地从主体片（200）的至少一个部分剥离，使得凹部（230）打开。 凹部（230）具有容纳多个药剂（T3）的尺寸。