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公开(公告)号：US5928066A
公开(公告)日：1999-07-27
申请号：US993989
申请日：1997-12-18
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
摘要翻译： 公开了半导体晶片的外围倒角部分的抛光装置。 抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件 所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。
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2.发明授权Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效具有取向平面的镜面抛光晶圆倒角的方法和装置公开(公告)号：US06332828B1
公开(公告)日：2001-12-25
申请号：US09613870
申请日：2000-07-11
IPC分类号： B24B906
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
摘要翻译： 公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。 用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。 本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且 根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。
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3.发明授权Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效具有取向平面的镜面抛光晶圆倒角的方法和装置
公开(公告)号：US6113463A
公开(公告)日：2000-09-05
申请号：US623771
申请日：1996-03-29
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.
摘要翻译： 公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。 用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。 本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且 根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。
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公开(公告)号：US5918587A
公开(公告)日：1999-07-06
申请号：US608190
申请日：1996-02-28
IPC分类号： B26F3/06 , B28D5/00 , C03B33/095 , H01L21/304 , B26F3/02
CPC分类号： C03B33/095 , B28D5/0005 , Y10T225/304
摘要： The invention seeks to provide a method of producing slices, such as semiconductor wafers, from a rod-like ingot, which does not require any cutting margin for slicing so that less material is consumed, and also is free from warping or denatured layer of the slices, as well as being free from operating environment deterioration with high quality. A cylindrical ingot is obtained by cutting or grinding the outer periphery of a rod-like ingot, and it is then formed with a plurality of annular grooves at a predetermined pitch in its longitudinal direction to obtain a cylindrical work with annular grooves. The work is then severed in the section defined by the bottom of each annular groove by generating a stress in excess of the rupture strength of the slice in the groove.After the heating of the cylindrical work with annular grooves, the under-process end face of the work is suitably cooled quickly by cooling water jet from a jet nozzle from the outer periphery toward the center of the work.
摘要翻译： 本发明寻求提供一种从棒状锭生产切片例如半导体晶片的方法，其不需要任何切割余量用于切片，从而消耗更少的材料，并且也不会有翘曲或变性层 切片，以及高品质的环境恶化。 通过切割或研磨棒状锭的外周而获得圆柱形锭，然后在其长度方向上以预定间距形成多个环形槽，以获得具有环形槽的圆柱形加工。 然后通过产生超过槽中切片的断裂强度的应力在每个环形槽的底部限定的部分中切断工件。 在用环形槽加热圆筒形工件之后，通过从射流喷嘴从外周向工件的中心冷却水射流，工件的处理前端面被适当地冷却。
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公开(公告)号：US06896023B2
公开(公告)日：2005-05-24
申请号：US10308423
申请日：2002-12-03
CPC分类号： B29C65/10 , B29C65/4835 , B29C66/1122 , B29C66/1222 , B29C66/1226 , B29C66/1312 , B29C66/3452 , B29C66/54 , B29C66/543 , B29C66/545 , B29C66/80 , B29C66/843 , B29L2031/307 , B63B5/24 , B63B9/06 , B63B2221/10
摘要： Framework, defining a predetermined curing area, corresponds in size and shape to a provisionally-assembled watercraft body to be subjected to adhesive curing. Openable/closeable gate, constituting one end portion of the framework, allows the provisionally-assembled watercraft body to be carried therethrough into the curing area. Positioning mechanism positions the carried provisionally-assembled watercraft body in the curing area. Warm air blowing mechanism includes a plurality of nozzles provided at predetermined intervals on and along upper horizontal portions of the framework and gate and at a level slightly higher than peripheral edges of a hull and deck of the watercraft body to be joined by adhesive, which blow warm air downward onto the peripheral edges of the watercraft body.
摘要翻译： 限定预定固化区域的框架在尺寸和形状上对应于要经受粘合剂固化的临时组装的船体。 构成框架的一个端部的可开启/关闭的门允许临时组装的船体通过其进入固化区域。 定位机构将装载的临时组装的船体位于定位区域。 暖风吹风机构包括多个喷嘴，其以预定的间隔设置在框架和闸门的上部水平部分上，并且在稍高于要通过粘合剂接合的船体的船体和甲板的周边边缘的水平处， 将暖气向下流到船体的周边。
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公开(公告)号：US5711250A
公开(公告)日：1998-01-27
申请号：US561398
申请日：1995-11-21
申请人： Toshihiro Tsuchiya
发明人： Toshihiro Tsuchiya
CPC分类号： A01K63/003 , A01K63/006
摘要： A device for raising aquarium fish is a combination of a water tank and a receptacle assembly. The water tank has an upper opening, a lid for closing the upper opening and provided with an illumination mechanism and a filtration mechanism, and a fastening portion. The receptacle assembly is for supplying electricity to the illumination and filtration mechanisms and has a fastened portion for engagement with the fastening portion of the water tank. The receptacle assembly includes an assembly body having an open side facing downward, accommodating a plurality of electric plug recieving receptacles therein and having a receptacle cover disposed inside the assembly body at a position spaced a predetermined distance from the open side of the assembly body for positioning and fixing the plurality of receptacles, and an assembly holder having a lateral wall portion attached to the assembly body and a vertical wall portion extending from the lateral wall portion and parallel to the direction faced by the open side of the assembly body at a distance from the assembly body.
摘要翻译： 用于升高水族鱼的装置是水箱和容器组合体的组合。 水箱具有上开口，用于封闭上开口的盖，并具有照明机构和过滤机构，以及紧固部。 插座组件用于向照明和过滤机构供电，并且具有用于与水箱的紧固部分接合的紧固部分。 插座组件包括具有朝向下方的开口侧的组装体，在其中容纳多个电插头接收插座，并且具有插座盖，该插座盖设置在与组件本体的开口侧隔开预定距离的位置处，用于定位 并且固定所述多个插座，以及具有附接到所述组件主体的侧壁部分的组件保持器和从所述侧壁部分延伸并平行于所述组件主体的敞开侧面的方向的垂直壁部分， 组装体。
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公开(公告)号：US5733177A
公开(公告)日：1998-03-31
申请号：US688174
申请日：1996-07-29
IPC分类号： B24B1/00 , B24B37/005 , B24B37/10 , H01L21/304 , B24B7/04
CPC分类号： B24B37/042
摘要： The invention concerns a process of polishing wafers, in which a silicon wafer held on a wafer support plate rotatable under a predetermined applied pressure, is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad cloth applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed. Quality comparable to that of wafers obtainable by a prior art three-step polishing process can be obtained with a two-step wafer polishing step comprising a primary polishing step and a final polishing step. The primary polishing step is performed by setting a high polishing pressure of 300 to 700 g/cm.sup.2 and a reference relative speed of 50 to 150 m/min., and quick increase of the relative speed to 2 to 4 times and quick reduction of the polishing pressure down to 1/2 to 1/10 are caused in a final stage of the primary polishing step. The final polishing step is performed by setting a reference polishing pressure of 100 to 400 g/cm.sup.2 and a reference relative speed of 50 to 150 m/min., and in its final stage the relative speed is quickly reduced to 1/2 to 1/5.
摘要翻译： 本发明涉及抛光晶片的方法，其中保持在可预定施加压力下旋转的晶片支撑板上的硅晶片通过在多个抛光步骤中的机械化学抛光进行研磨，其中研磨材料插入在晶片和抛光垫之间 施加到以预定相对速度相对于晶片支撑板移动的抛光表面板的布。 通过现有技术的三步抛光工艺可获得的晶片的质量可以通过包括初级抛光步骤和最终抛光步骤的两步晶片抛光步骤获得。 通过设定300〜700g / cm 2的高研磨压力和50〜150m /分钟的基准相对速度，进行一次抛光工序，将相对速度快速提高至2〜4倍，快速降低 在主抛光步骤的最后阶段引起抛光压力降至+ E，fra 1/2 + EE至+ E，fra 1/10 + EE。 通过设定100〜400g / cm 2的基准研磨压力和50〜150m /分钟的基准相对速度来进行最终的研磨工序，在最终阶段将相对速度迅速降低至+ E， / 2 + EE至+ E，fra 1/5 + EE。
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公开(公告)号：US5408955A
公开(公告)日：1995-04-25
申请号：US216422
申请日：1994-03-23
申请人： Toshihiro Tsuchiya
发明人： Toshihiro Tsuchiya
CPC分类号： A01K63/006 , A01K63/06
摘要： A hinge device is used in an aquarium tank including a tank body and a lid member mounted on the tank body and having a front lid pivotably attached thereto. The hinge device includes bottomed holes formed in the opposite side surfaces of the lid member, a pair of pin members each including an abutment portion, a shaft portion and a resilient portion between the abutment portion and the shaft portion, and bearing holes formed on opposite side walls of the front lid. The front lid is pivotably attached to the lid member, with the abutment portion abutted against the bottom of the bottomed hole and the shaft portion thrust into the bearing hole by the resilient force of the resilient portion.
摘要翻译： 铰链装置用于包括罐体和安装在罐体上的盖构件的水族箱中，并具有可枢转地附接到其上的前盖。 铰链装置包括形成在盖构件的相对侧表面中的底孔，一对销构件，每个销构件包括邻接部分，轴部分和邻接部分和轴部分之间的弹性部分，以及形成在相对侧上的轴承孔 前盖的侧壁。 前盖可枢转地附接到盖构件，抵靠部分抵靠有底孔的底部，并且轴部分由弹性部分的弹力推入轴承孔。
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公开(公告)号：US4815157A
公开(公告)日：1989-03-28
申请号：US113767
申请日：1987-10-28
申请人： Toshihiro Tsuchiya
发明人： Toshihiro Tsuchiya
CPC分类号： A47L11/4072 , A47L11/33 , A47L11/4013 , A47L11/4041 , A47L11/4069
摘要： A floor cleaner of the present invention has wheels provided on a main body casing which is journaled to a proximal portion of an operation handle, a rotary cleaning body on each side end portion of which is mounted a driven roller which is freely engageable by a respective one of the wheels, individual rotatable auxiliary rotary cleaning bodies located at both side end portions of the main body casing, respectively, and ducts communicating one of the dust collecting chambers, the chambers having dust intakes that respectively face the rotary cleaning body.
摘要翻译： 本发明的地板清洁器具有设置在主体外壳上的轮子，该主体壳体位于操作手柄的基端部，旋转清洁体的每个侧端部安装有从动辊，该从动辊可以由相应的 一个轮子，分别位于主体壳体的两个侧端部的单独的可旋转辅助旋转清洁体，以及连通一个集尘室的管道，具有分别面向旋转清洁体的吸尘器的室。
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公开(公告)号：US5934981A
公开(公告)日：1999-08-10
申请号：US972680
申请日：1997-11-18
申请人： Koichi Tanaka , Toshihiro Tsuchiya , Koji Morita , Tsutomu Takaku
发明人： Koichi Tanaka , Toshihiro Tsuchiya , Koji Morita , Tsutomu Takaku
IPC分类号： B24B37/30 , H01L21/304 , B24B1/00
CPC分类号： H01L21/02024 , B24B37/042
摘要： A method and an apparatus, for polishing a thin plate. The method comprises the steps of: rotating a holding plate on one surface of which the thin plate is held to adhere; and bringing the thin plate held on the rotating holding plate into contact with a polishing pad mounted on a surface of a rotating turn table, to polish the thin plate. The step of polishing the one surface of the holding plate is carried out by using the polishing pad for polishing the thin plate before the thin plate is held to adhere on the one surface of the holding plate.
摘要翻译： 一种用于抛光薄板的方法和装置。 该方法包括以下步骤：将保持板保持在其上的薄板的一个表面上旋转; 并且将保持在旋转保持板上的薄板与安装在旋转台的表面上的抛光垫接触，以对该薄板进行抛光。 在保持板的一个表面之前，通过使用用于抛光薄板的抛光垫在保持板的一个表面上粘附之前，进行抛光保持板的一个表面的步骤。
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