Defective part recognition device and defective part recognition method

    公开(公告)号:US11953447B2

    公开(公告)日:2024-04-09

    申请号:US17636182

    申请日:2020-06-22

    IPC分类号: G01N21/88 G06T7/00

    摘要: A defective part recognition device includes a microscope for obtaining a magnified image of a unit area for recognizing a defective part on the surface of a multi-layer film substrate; a spectral camera having an imaging surface where the magnified image is formed; and an information processing part for processing the spectrum information from the spectral camera. The information processing part includes a machine learning part for a clustering process on the spectrum information for each pixel, and a defect recognition part for recognizing a defective part from the result of the machine learning part. The machine learning part sets a cluster in the unit area and generates a histogram with a frequency, the number of pixels clustered into the cluster. The defect recognition part compares the frequency distribution of the generated histogram with that of a histogram free of defects and recognizes a defective part.

    LASER REPAIR METHOD AND LASER REPAIR DEVICE

    公开(公告)号:US20220281029A1

    公开(公告)日:2022-09-08

    申请号:US17625579

    申请日:2020-05-27

    摘要: Even in the case where an underlayer differs or a film thickness varies, high-quality repair is allowed to be performed.
    When a laser repair method performs repair work by setting a laser irradiation area for a defect part of a multi-layer film substrate and irradiating the defect part with a laser beam under a set laser working condition, the laser repair method includes: identifying a peripheral region of a laser beam irradiation position; dividing the identified peripheral region into a plurality of divided regions for each common reflected light information; inferring a layer structure at the laser beam irradiation position from analogy based on an arrangement pattern of the divided regions positioned around the laser beam irradiation position; and setting the laser working condition of the laser beam to be emitted based on the layer structure inferred from analogy.

    SUBSTRATE MOUNTING METHOD AND ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE

    公开(公告)号:US20210119098A1

    公开(公告)日:2021-04-22

    申请号:US17253829

    申请日:2019-05-29

    摘要: A substrate mounting method of an electronic component on a wiring substrate includes steps of patterning to form a conductive elastic protrusion on an electrode pad provided on the wiring substrate to correspond to a contact point of the electronic component, forming an adhesive layer made of a photosensitive thermosetting resin on the wiring substrate, lowering viscosity of the adhesive layer by heating the adhesive layer to a first temperature zone, electrically connecting the contact point of the electronic component to the electrode pad on the wiring substrate through the conductive elastic protrusion, under a state where the viscosity of the adhesive layer is lowered, by pressing the electronic component after the electronic component is positioned on the wiring substrate, and fixing the electronic component onto the wiring substrate by heating the adhesive layer to a second temperature zone higher than the first temperature zone to cure the adhesive layer.

    PHOTO-ALIGNING EXPOSURE DEVICE
    4.
    发明申请

    公开(公告)号:US20200379282A1

    公开(公告)日:2020-12-03

    申请号:US16636784

    申请日:2018-08-06

    IPC分类号: G02F1/13 G02F1/1337 G03F7/20

    摘要: A photo-aligning exposure device that performs a photo-aligning process by performing scanning exposure on an irradiated plane in one direction includes: a light source that emits scattering light toward the irradiated plane; an optical filter that selectively emits an ultraviolet ray out of the light emitted from the light source; and an irradiation angle restriction member that selectively emits light with which irradiation is diagonally performed with respect to the scanning direction out of the light emitted from the optical filter. The irradiation angle restriction member has a plurality of flat-plate-shaped light direction restriction plates slanted at a certain angle with respect to the irradiated plane and arrayed in parallel along the scanning direction at a predetermined distance.

    Full-Color Led Display Panel And Method For Manufacturing Same

    公开(公告)号:US20200373350A1

    公开(公告)日:2020-11-26

    申请号:US16993498

    申请日:2020-08-14

    摘要: A full-color LED display panel includes an LED array substrate 1 in which multiple LEDs 4 are arranged in a matrix form on a wiring board 5, each LED 4 emitting light in an ultraviolet or blue wavelength band; multiple fluorescent layers 2 configured to perform wavelength conversion by being excited by excitation light EL emitted from a corresponding LED 4 and by emitting fluorescence FL of a corresponding color, each fluorescent layer 2 being provided on at least one corresponding LED 4 for red, green, or blue color, and containing, in a dispersed manner, a fluorescent colorant 14 and an adjustment colorant 15 that selectively transmits light in a predetermined wavelength band; and a light shielding member 3 that reflects or absorbs excitation light EL and fluorescence FL, and is provided between the fluorescent layers 2.

    Proximity exposure method
    6.
    发明授权

    公开(公告)号:US10768529B2

    公开(公告)日:2020-09-08

    申请号:US16338088

    申请日:2017-08-23

    IPC分类号: G03F7/20 G03F9/00 G03F1/42

    摘要: A proximity exposure method, wherein a mask (M) of which the master patterns (31) are formed larger than the resolution limit of the resist (R) is prepared with respect to the resist patterns (43) having the minimum pitch (P) equal to or smaller than the resolution limit of the resist (R); in the first exposure step, the mask (M) and the workpiece (W) are relatively step-moved by the pitch (P) of the resist patterns (43) after the mask patterns (31) are exposed and transferred onto the workpiece (W); and in the second exposure step, the mask patterns (31) are exposed and transferred onto the workpiece (W) again.

    LASER IRRADIATION DEVICE AND LASER IRRADIATION METHOD

    公开(公告)号:US20200266062A1

    公开(公告)日:2020-08-20

    申请号:US16869778

    申请日:2020-05-08

    摘要: A laser irradiation device includes a light source that generates laser light; and a laser head including cylindrical lenses that receive the laser light and generate a thin line laser beam parallel to a moving direction of a substrate, wherein the laser head irradiates a predetermined region of the substrate covered with an amorphous silicon thin film with the thin line laser beam and forms a polysilicon thin film in the predetermined region.

    BOARD CONNECTION STRUCTURE, BOARD MOUNTING METHOD, AND MICRO-LED DISPLAY

    公开(公告)号:US20200243739A1

    公开(公告)日:2020-07-30

    申请号:US16847526

    申请日:2020-04-13

    IPC分类号: H01L33/62 H01L25/075

    摘要: Provided is a board connection structure for mounting a micro LED 3 on a wiring board 4. A conductive elastic protrusion 7 is formed by patterning on an electrode pad 6 provided on the wiring board 4 at a position corresponding to a position of a corresponding electrode 5 of the micro LED 3. The elastic protrusion 7 is configured to electrically connect the electrode 5 and the electrode pad 6. This enables mounting of electronic components with a narrow electrode spacing.

    INSPECTION METHOD FOR LED CHIP, INSPECTION DEVICE THEREFOR, AND MANUFACTURING METHOD FOR LED DISPLAY

    公开(公告)号:US20200243712A1

    公开(公告)日:2020-07-30

    申请号:US16847531

    申请日:2020-04-13

    摘要: An inspection method for multiple LED chips 6 formed on a sapphire substrate 7, comprising: a first step of positioning the sapphire substrate 7 above an inspection wiring board 11 such that each electrode 10 of the multiple LED chips 6 is arranged above a corresponding electrode pad 12 provided on the inspection wiring board 11 at a position corresponding to the electrode 10, and then placing the sapphire substrate 7 on the inspection wiring board 11; a second step of electrically connecting each electrode 10 of the multiple LED chips 6 and the corresponding electrode pad 12 of the inspection wiring board 11; and a third step of supplying a current to the multiple LED chips 6 through the inspection wiring board 11, and determining the quality of the LED chips 6.