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公开(公告)号:US08351222B2
公开(公告)日:2013-01-08
申请号:US13196002
申请日:2011-08-02
申请人: Johannes Wilhelmus Weekamp , Antonius Constan Johanna Cornelis Van Den Ackerveken , Will J. H. Ansems
发明人: Johannes Wilhelmus Weekamp , Antonius Constan Johanna Cornelis Van Den Ackerveken , Will J. H. Ansems
IPC分类号: H05K7/00
CPC分类号: H05K7/00 , B01L3/502707 , B01L2200/12 , B01L2300/0627 , B01L2300/0645 , B01L2300/0816 , B01L2300/0838 , H01L2224/85385 , H05K1/0284 , H05K1/182 , H05K3/0014 , H05K3/20 , H05K13/046 , H05K2201/09118 , H05K2201/10151 , Y10T29/49002 , Y10T29/49004 , Y10T29/49124 , Y10T29/49147 , Y10T29/49169 , Y10T29/4981
摘要: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).
摘要翻译: 封装至少一个微电子元件(60)的封装(例如传感器裸片)并且具有导电连接焊盘(31),用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案(30)施加到所述载体的一侧; 弯曲载体以便形成载体的形状,其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案(30)的一侧形成本体构件(45); 去除牺牲载体; 以及将微电子元件(60)放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件(45)中形成的凹部(47)中,并且将所述微电子元件(60)连接到所述导电 图案(30)。 此外,在封装中布置有一个孔(41),用于提供对微电子元件(60)敏感表面的通路。
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公开(公告)号:US08011082B2
公开(公告)日:2011-09-06
申请号:US12092835
申请日:2006-10-26
申请人: Johannes Wilhelmus Weekamp , Antonius Constant Johanna Cornelis Van Den Ackerveken , Will J. H. Ansems
发明人: Johannes Wilhelmus Weekamp , Antonius Constant Johanna Cornelis Van Den Ackerveken , Will J. H. Ansems
IPC分类号: G01R31/28
CPC分类号: H05K7/00 , B01L3/502707 , B01L2200/12 , B01L2300/0627 , B01L2300/0645 , B01L2300/0816 , B01L2300/0838 , H01L2224/85385 , H05K1/0284 , H05K1/182 , H05K3/0014 , H05K3/20 , H05K13/046 , H05K2201/09118 , H05K2201/10151 , Y10T29/49002 , Y10T29/49004 , Y10T29/49124 , Y10T29/49147 , Y10T29/49169 , Y10T29/4981
摘要: A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.
摘要翻译: 封装至少一个微电子元件的封装载体具有用于将封装电连接到另一器件的导电连接焊盘的图案。 通过提供牺牲载体来制造包装载体; 将导电图案施加到所述载体的一侧; 弯曲载体以形成具有升高部分和凹陷部分的形状; 在存在导电图案的一侧在载体上形成体部件; 去除牺牲载体; 以及将微电子元件放置在在载体的升高部分已经存在的位置处在本体构件中形成的凹部中,并将微电子元件连接到导电图案。 此外,封装中的孔提供对微电子元件的敏感表面的访问。
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