公开(公告)号：US20110292633A1

公开(公告)日：2011-12-01

申请号：US13196002

申请日：2011-08-02

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

IPC分类号： H05K7/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。

公开(公告)号：US08011082B2

公开(公告)日：2011-09-06

申请号：US12092835

申请日：2006-10-26

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

IPC分类号： G01R31/28

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.

摘要翻译： 封装至少一个微电子元件的封装载体具有用于将封装电连接到另一器件的导电连接焊盘的图案。 通过提供牺牲载体来制造包装载体; 将导电图案施加到所述载体的一侧; 弯曲载体以形成具有升高部分和凹陷部分的形状; 在存在导电图案的一侧在载体上形成体部件; 去除牺牲载体; 以及将微电子元件放置在在载体的升高部分已经存在的位置处在本体构件中形成的凹部中，并将微电子元件连接到导电图案。 此外，封装中的孔提供对微电子元件的敏感表面的访问。

公开(公告)号：US08541797B2

公开(公告)日：2013-09-24

申请号：US11719240

申请日：2005-11-14

申请人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

发明人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

IPC分类号： H01L27/15

CPC分类号： H01L33/60 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An illuminator includes a substrate, a structured conductive layer applied to one surface of the substrate, and at least one light source connected to the structured conductive layer. The illuminator further includes an unstructured reflective layer applied on top of the structured conductive layer. The unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source.

摘要翻译： 照明器包括衬底，施加到衬底的一个表面的结构化导电层和连接到结构化导电层的至少一个光源。 照明器还包括施加在结构化导电层顶部上的非结构化反射层。 所述非结构化反射层至少在所述至少一个光源的周围具有基本上连续的延伸。

公开(公告)号：US20090078948A1

公开(公告)日：2009-03-26

申请号：US11719240

申请日：2005-11-14

申请人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

发明人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.

摘要翻译： 本发明涉及一种包括衬底（12），施加到衬底的一个表面的结构化导电层（16）和连接到结构化导电层的至少一个光源（18,26）的照明器（10）。 照明器的特征在于，其还包括施加在所述结构化导电层顶部上的非结构化反射层（24），所述非结构化反射层至少在所述至少一个光源的周围具有基本上连续的延伸。 由于非结构化的反射层，可以提高照明器的光学效率。 本发明还涉及一种用于制造这种照明器的方法。

公开(公告)号：US20080276454A1

公开(公告)日：2008-11-13

申请号：US12092835

申请日：2006-10-26

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

IPC分类号： H05K3/00 ,  H01R43/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。