摘要:
A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).
摘要:
A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.
摘要:
The invention is related to a feeding tube (1, 11, 15) in particular for total parental nutrition and/or medicine dosing including at least one inner tubing (9), at least one lumen (2, 13), at least one sensing element, in particular an electrode (3), the sensing element being connected to at least one monitoring device by a wiring (4, 12, 17) for internal monitoring of a patient's vital functions. The wiring (4, 12, 17) is at least partially wounded in tight contact with a surface of the inner tubing (9). Wherein the inner tubing (9) is at least partially surrounded by an outer tubing (8) in order to cover the inner tubing (9) and/or the wiring (4, 12, 17).
摘要:
There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100′), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.
摘要:
Lacrimal inserts such as punctal plugs may be utilized for delivery of medication to the eye. The plug includes a body portion sized to pass through a lacrimal punctum and be positioned within a lacrimal canaliculus of the eyelid. The plug may contain a core, or reservoir, at least partially within the body portion comprising a therapeutic agent that is configured for controlled, pulsatile release into the eye.
摘要:
The invention relates to an electrowetting-on-dielectric device (200). This is an electro wetting device comprising one or more cells, wherein each cell comprises an electrowetting composition of first and second immiscible fluids, the first fluid being an electrolytic solution (240), a first electrode (230), separated from the electrowetting composition by a dielectric (231), and a voltage source (260) for applying an operating voltage difference between the first electrode (230) and the electrolytic solution to operate the electrowetting device. According to the invention, the first electrode (230) of the electrowetting-on-dielectric device (200) comprises a valve metal, and the electrolytic solution (240) is capable of anodizing the valve metal to form a metal oxide at the operating voltage difference. This provides the electrowetting-on-dielectric device (200) with self-repairing properties thereby preventing breakdown of the dielectric. As a result, the electrowetting device can be operated at a low voltage, and it has an improved reliability.
摘要:
A transducer assembly (10) is provided that includes a housing (12), a lens (14), an array of transducer elements (18), an interposer assembly (22), a transducer array 5 control assembly (30), and a heat sink assembly (32). The interposer assembly (22) includes a plurality of signals tracks (56) that provide electrical connections between the array of transducer elements (18) and the transducer array control assembly (30). The interposer assembly (22) further includes heat transporter bars (50) for transporting heat within the interposer (22) to the heat sink assembly (32). A flexible interconnection 10 assembly (28) is disposed between the interposer assembly (22) and the transducer array control assembly (30) providing re-workable electrical connections between the signal tracks (56) of the interposer assembly (22) and the transducer array control assembly (30).
摘要:
The invention relates to an acoustical switch wherein the idea to the ultrasound propagation direction may be changes without moving the switch. The switch device comprises two sheets of acoustically transparent material. The sheets constitute opposite walls of a housing. The switch device further comprises one or more orifices for allowing conduction of fluid into and/or out of said housing. The switch device may be made reflective by filling the housing with a gas via the one or more orifices. Moreover, the switch device may be made transmissive to ultrasound by filling the housing with a liquid via the one or more orifices and/or by subjecting the housing to underpressure via the one or more orifices. The acoustical switch device fits well within a catheter, which has severe dimensional limitations.
摘要:
A method for manufacturing a microelectronic package comprising a silicon MEMS microphone comprises the following steps: providing a basic panel (100) having several rows of interconnected substrates (90), wherein the substrates (90) are provided with electrically conductive connection pads (31), electrically conductive tracks (33), and a grid (40) comprising tiny holes (41); arranging an IC chip (50), a silicon MEMS microphone (60) and a ring-shaped element (95) on the substrates (90), wherein the ring-shaped element (95) is arranged around the microphone (60); and folding the substrates (90) in three, wherein an open side of the ring-shaped element (95) is closed. The IC chip (50) and the microphone (60) are safely accommodated in the package (5) that is obtained in this way. The connection pads (31) allow for easy connection of the package (5) to another device, while 32 electrical connections to the IC chip (50) are also easily realized through these connection pads (31). An electrical connection of the microphone (60) to the IC chip (50) is realized through the electrically conductive tracks (33).
摘要:
The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.