公开(公告)号：US08011082B2

公开(公告)日：2011-09-06

申请号：US12092835

申请日：2006-10-26

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

IPC分类号： G01R31/28

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.

摘要翻译： 封装至少一个微电子元件的封装载体具有用于将封装电连接到另一器件的导电连接焊盘的图案。 通过提供牺牲载体来制造包装载体; 将导电图案施加到所述载体的一侧; 弯曲载体以形成具有升高部分和凹陷部分的形状; 在存在导电图案的一侧在载体上形成体部件; 去除牺牲载体; 以及将微电子元件放置在在载体的升高部分已经存在的位置处在本体构件中形成的凹部中，并将微电子元件连接到导电图案。 此外，封装中的孔提供对微电子元件的敏感表面的访问。

公开(公告)号：US20110292633A1

公开(公告)日：2011-12-01

申请号：US13196002

申请日：2011-08-02

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

IPC分类号： H05K7/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。

公开(公告)号：US20080276454A1

公开(公告)日：2008-11-13

申请号：US12092835

申请日：2006-10-26

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Will J.H. Ansems

IPC分类号： H05K3/00 ,  H01R43/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。

公开(公告)号：US08351222B2

公开(公告)日：2013-01-08

申请号：US13196002

申请日：2011-08-02

申请人： Johannes Wilhelmus Weekamp ,  Antonius Constan Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

发明人： Johannes Wilhelmus Weekamp ,  Antonius Constan Johanna Cornelis Van Den Ackerveken ,  Will J. H. Ansems

IPC分类号： H05K7/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

摘要翻译： 封装至少一个微电子元件（60）的封装（例如传感器裸片）并且具有导电连接焊盘（31），用于通过提供牺牲载体来将封装电连接到另一器件。 将导电图案（30）施加到所述载体的一侧; 弯曲载体以便形成载体的形状，其中载体具有升高部分和凹陷部分; 在所述载体上在所述导电图案（30）的一侧形成本体构件（45）; 去除牺牲载体; 以及将微电子元件（60）放置在已经在所述载体的所述升高部分的位置处已经在所述本体构件（45）中形成的凹部（47）中，并且将所述微电子元件（60）连接到所述导电 图案（30）。 此外，在封装中布置有一个孔（41），用于提供对微电子元件（60）敏感表面的通路。

公开(公告)号：US09675265B2

公开(公告)日：2017-06-13

申请号：US12518278

申请日：2007-12-07

申请人： Johannes Wilhelmus Weekamp ,  Johannes Herman Savenije ,  Aaldert Elevelt ,  Marcus Jozef Van Bommel

发明人： Johannes Wilhelmus Weekamp ,  Johannes Herman Savenije ,  Aaldert Elevelt ,  Marcus Jozef Van Bommel

IPC分类号： A61B5/04 ,  A61B5/042 ,  A61J15/00

CPC分类号： A61B5/0421 ,  A61J15/0003 ,  A61J15/0073 ,  A61J15/0084

摘要： The invention is related to a feeding tube (1, 11, 15) in particular for total parental nutrition and/or medicine dosing including at least one inner tubing (9), at least one lumen (2, 13), at least one sensing element, in particular an electrode (3), the sensing element being connected to at least one monitoring device by a wiring (4, 12, 17) for internal monitoring of a patient's vital functions. The wiring (4, 12, 17) is at least partially wounded in tight contact with a surface of the inner tubing (9). Wherein the inner tubing (9) is at least partially surrounded by an outer tubing (8) in order to cover the inner tubing (9) and/or the wiring (4, 12, 17).

公开(公告)号：US09232663B2

公开(公告)日：2016-01-05

申请号：US14241187

申请日：2012-08-29

申请人： Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

发明人： Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

IPC分类号： H01L21/00 ,  H05K3/30 ,  H05K3/20 ,  H01L25/075 ,  F21K99/00 ,  F21S4/00 ,  H01L27/15 ,  H01L33/62 ,  F21V21/002 ,  H05K13/04 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

摘要： There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100′), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

摘要翻译： 提供一种用于制造发光二极管，LED，矩阵（100）的方法，包括以下步骤：提供具有与曲折连接轨道（116）互连的多个部件区域（111）的导体片（150）的完整性， ，将多个LED（120）安装到相应的部件区域，从而形成子组件（100'），修整和拉伸子组件，从而矫正连接轨道，使得在拉伸步骤期间形成m×n个LED导体矩阵。

公开(公告)号：US20120283669A1

公开(公告)日：2012-11-08

申请号：US13409210

申请日：2012-03-01

申请人： Bret A. Coldren ,  Peter Paul Willem Leonard Van Den Bekerom ,  Antonius Wilhelmus Maria De Laat ,  Johannes Wilhelmus Weekamp ,  Victor Lust ,  Gerald Yewey

发明人： Bret A. Coldren ,  Peter Paul Willem Leonard Van Den Bekerom ,  Antonius Wilhelmus Maria De Laat ,  Johannes Wilhelmus Weekamp ,  Victor Lust ,  Gerald Yewey

IPC分类号： A61F9/00 ,  A61M31/00

CPC分类号： A61F9/00772 ,  A61F2250/0068

摘要： Lacrimal inserts such as punctal plugs may be utilized for delivery of medication to the eye. The plug includes a body portion sized to pass through a lacrimal punctum and be positioned within a lacrimal canaliculus of the eyelid. The plug may contain a core, or reservoir, at least partially within the body portion comprising a therapeutic agent that is configured for controlled, pulsatile release into the eye.

摘要翻译： 诸如泪点塞的泪液插入物可用于将药物递送至眼睛。 塞子包括尺寸适于穿过泪点并被定位在眼睑的泪小管内的体部。 塞子可以包含至少部分地在主体部分内的芯部或储存器，其包括被配置为用于受控地，脉动地释放到眼睛中的治疗剂。

公开(公告)号：US20120200939A1

公开(公告)日：2012-08-09

申请号：US13499918

申请日：2010-09-29

申请人： Stein Kuiper ,  Johannes Wilhelmus Weekamp

发明人： Stein Kuiper ,  Johannes Wilhelmus Weekamp

IPC分类号： G02B3/12 ,  C25D11/02

CPC分类号： G02B3/14 ,  G02B26/005

摘要： The invention relates to an electrowetting-on-dielectric device (200). This is an electro wetting device comprising one or more cells, wherein each cell comprises an electrowetting composition of first and second immiscible fluids, the first fluid being an electrolytic solution (240), a first electrode (230), separated from the electrowetting composition by a dielectric (231), and a voltage source (260) for applying an operating voltage difference between the first electrode (230) and the electrolytic solution to operate the electrowetting device. According to the invention, the first electrode (230) of the electrowetting-on-dielectric device (200) comprises a valve metal, and the electrolytic solution (240) is capable of anodizing the valve metal to form a metal oxide at the operating voltage difference. This provides the electrowetting-on-dielectric device (200) with self-repairing properties thereby preventing breakdown of the dielectric. As a result, the electrowetting device can be operated at a low voltage, and it has an improved reliability.

摘要翻译： 本发明涉及一种电润湿介电装置（200）。 这是一种包含一个或多个电池的电润湿装置，其中每个电池包括第一和第二不混溶流体的电润湿组合物，第一流体是电解溶液（240），第一电极（230），其与电润湿组合物分离， 电介质（231）和用于在第一电极（230）和电解液之间施加工作电压差以操作电润湿装置的电压源（260）。 根据本发明，电介质电介质器件（200）的第一电极（230）包括阀金属，并且电解溶液（240）能够在操作电压下阳极氧化阀金属以形成金属氧化物 区别。 这提供了具有自修复性能的电介质电介质器件（200），从而防止电介质的破坏。 结果，电润湿装置可以在低电压下操作，并且其可靠性提高。

公开(公告)号：US20120143060A1

公开(公告)日：2012-06-07

申请号：US12810346

申请日：2008-12-22

申请人： Johannes Wilhelmus Weekamp ,  Gideon Frederik Maria Wiegerinck ,  Remco Yuri Van de Moesoijk ,  Richard Davidsen

发明人： Johannes Wilhelmus Weekamp ,  Gideon Frederik Maria Wiegerinck ,  Remco Yuri Van de Moesoijk ,  Richard Davidsen

IPC分类号： A61B8/00 ,  H05K13/00

CPC分类号： G10K11/004 ,  A61B8/4472 ,  A61B8/546 ,  B06B1/0622

摘要： A transducer assembly (10) is provided that includes a housing (12), a lens (14), an array of transducer elements (18), an interposer assembly (22), a transducer array 5 control assembly (30), and a heat sink assembly (32). The interposer assembly (22) includes a plurality of signals tracks (56) that provide electrical connections between the array of transducer elements (18) and the transducer array control assembly (30). The interposer assembly (22) further includes heat transporter bars (50) for transporting heat within the interposer (22) to the heat sink assembly (32). A flexible interconnection 10 assembly (28) is disposed between the interposer assembly (22) and the transducer array control assembly (30) providing re-workable electrical connections between the signal tracks (56) of the interposer assembly (22) and the transducer array control assembly (30).

摘要翻译： 提供了一种换能器组件（10），其包括壳体（12），透镜（14），换能器元件阵列（18），插入件组件（22），换能器阵列5控制组件（30）和 散热器组件（32）。 插入器组件（22）包括提供换能器元件阵列（18）和换能器阵列控制组件（30）之间的电连接的多个信号轨道（56）。 插入器组件（22）还包括用于将内插器（22）内的热传递到散热器组件（32）的热运送棒（50）。 柔性互连10组件（28）设置在插入器组件（22）和换能器阵列控制组件（30）之间，从而在插入器组件（22）的信号轨道（56）和换能器阵列之间提供可重新工作的电连接 控制组件（30）。

公开(公告)号：US20110275962A1

公开(公告)日：2011-11-10

申请号：US13127089

申请日：2009-11-05

申请人： Szabolcs Deladi ,  Jan F. Suijver ,  Godefridus Antonius Harks ,  Johannes Wilhelmus Weekamp ,  Antonius J.J. Rademakers ,  Maya Ella Barley

发明人： Szabolcs Deladi ,  Jan F. Suijver ,  Godefridus Antonius Harks ,  Johannes Wilhelmus Weekamp ,  Antonius J.J. Rademakers ,  Maya Ella Barley

IPC分类号： A61N7/00

CPC分类号： A61B8/4461 ,  A61B8/12 ,  A61B8/445 ,  A61B18/1492 ,  G10K11/28

摘要： The invention relates to an acoustical switch wherein the idea to the ultrasound propagation direction may be changes without moving the switch. The switch device comprises two sheets of acoustically transparent material. The sheets constitute opposite walls of a housing. The switch device further comprises one or more orifices for allowing conduction of fluid into and/or out of said housing. The switch device may be made reflective by filling the housing with a gas via the one or more orifices. Moreover, the switch device may be made transmissive to ultrasound by filling the housing with a liquid via the one or more orifices and/or by subjecting the housing to underpressure via the one or more orifices. The acoustical switch device fits well within a catheter, which has severe dimensional limitations.

摘要翻译： 本发明涉及一种声学开关，其中超声波传播方向的想法可以是不改变开关而改变的。 开关装置包括两片声透明材料。 纸张构成外壳的相对壁。 开关装置还包括用于允许流体进入和/或离开所述壳体的一个或多个孔。 开关装置可以通过经由一个或多个孔口用气体填充壳体来制成反射性的。 此外，开关装置可以通过经由一个或多个孔口填充液体的壳体和/或经由一个或多个孔口对壳体进行负压来对超声波进行透射。 声学开关装置很好地配合在具有严格尺寸限制的导管内。