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公开(公告)号:US09693455B1
公开(公告)日:2017-06-27
申请号:US14227346
申请日:2014-03-27
申请人: Seong Won Park , Hun Teak Lee , WoonJae Beak , MinJung Kim , ChangHwan Kim , ByungHyun Kwak , GwangTae Kim , HeeSoo Lee
发明人: Seong Won Park , Hun Teak Lee , WoonJae Beak , MinJung Kim , ChangHwan Kim , ByungHyun Kwak , GwangTae Kim , HeeSoo Lee
CPC分类号: H05K1/112 , H01L2224/16225 , H01L2224/73204 , H05K1/09 , H05K1/113 , H05K1/14 , H05K1/18 , H05K1/186 , H05K3/32 , H05K3/36 , H05K3/4007 , H05K3/4038 , H05K3/46 , H05K3/4614 , H05K3/4623 , H05K2201/04 , H05K2203/061 , H05K2203/0733
摘要: A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.