公开(公告)号：US09693455B1

公开(公告)日：2017-06-27

申请号：US14227346

申请日：2014-03-27

申请人： Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

发明人： Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

IPC分类号： H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K1/09 ,  H05K1/18 ,  H05K1/14 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K1/112 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/09 ,  H05K1/113 ,  H05K1/14 ,  H05K1/18 ,  H05K1/186 ,  H05K3/32 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/04 ,  H05K2203/061 ,  H05K2203/0733

摘要： A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

公开(公告)号：US20150318259A1

公开(公告)日：2015-11-05

申请号：US14696741

申请日：2015-04-27

申请人： KyungOe Kim ,  Seong Won Park ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  WanIl Lee

发明人： KyungOe Kim ,  Seong Won Park ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  WanIl Lee

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13005 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16113 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/80011 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/81947 ,  H01L2224/81948 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/2064 ,  H01L2924/014 ,  H01L2924/00014

摘要： An integrated circuit packaging system, and a method of manufacture thereof, includes: an integrated circuit; a substrate having a substrate contact; an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and an encapsulation over the internal interconnect.

摘要翻译： 一种集成电路封装系统及其制造方法，包括：集成电路; 具有基板接触的基板; 在衬底和集成电路之间的内部互连，内部互连是直接在衬底触点和集成电路上的无回流连接; 以及在内部互连上的封装。