公开(公告)号：US20180061724A1

公开(公告)日：2018-03-01

申请号：US15792351

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/00 ,  H01L23/10 ,  H01L23/26 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/85 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0384 ,  H01L2224/04042 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48482 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/85

摘要： A method for remapping an extracted die is provided. The method includes one or more of removing an extracted die from a previous integrated circuit package, the extracted die including a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and bonding an interposer to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.

公开(公告)号：US20170330841A1

公开(公告)日：2017-11-16

申请号：US15248151

申请日：2016-08-26

申请人： Texas Instruments Incorporated

发明人： Benjamin Stassen Cook ,  Steven Kummerl ,  Kurt Peter Wachtler

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/315 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/9205 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/83 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/206 ,  H01L2924/00012

摘要： A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

公开(公告)号：US20160181168A1

公开(公告)日：2016-06-23

申请号：US14600691

申请日：2015-01-20

申请人： Global Circuit Innovations Incorporated

发明人： Erick Merle Spory

IPC分类号： H01L23/053 ,  H01L23/20 ,  H01L21/48 ,  H01L23/00 ,  H01L21/52

CPC分类号： H01L24/49 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/047 ,  H01L23/057 ,  H01L23/10 ,  H01L23/49551 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/98 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/03312 ,  H01L2224/03332 ,  H01L2224/03334 ,  H01L2224/03901 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05548 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83192 ,  H01L2224/85207 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged integrated circuit for operating reliably at elevated temperatures is provided. The packaged integrated circuit includes a modified extracted die, which includes one or more extended bond pads, a package comprising a base and a lid, and a plurality of new bond wires. The modified extracted die is placed into a cavity of the base. After the modified extracted die is placed into the cavity, the plurality of new bond wires are bonded between the one or more extended bond pads of the modified extracted die and package leads of the package base or downbonds. After bonding the plurality of new bond wires, the lid is sealed to the base.

摘要翻译： 提供了一种用于在高温下可靠运行的封装集成电路。 封装的集成电路包括改进的提取模头，其包括一个或多个延伸的接合焊盘，包括基座和盖子的封装以及多个新的接合线。 将改良的提取的模具放入基座的空腔中。 在改进的提取的模具被放置到空腔中之后，多个新的接合线结合在改进的提取模具的一个或多个延伸的接合焊盘和封装基底的封装引线或者向下的焊接点之间。 在粘接多个新的接合线之后，将盖子密封到基座。

公开(公告)号：US4274576A

公开(公告)日：1981-06-23

申请号：US093321

申请日：1979-11-13

申请人： Rafique S. Shariff

发明人： Rafique S. Shariff

IPC分类号： H01L21/60 ,  H05K13/04 ,  B23K28/00

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K13/0486 ,  H01L2224/75 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T225/304 ,  Y10T29/49821 ,  Y10T29/49822

摘要： A semiconductor chip mounted on a substrate by solder columns connecting one side of the chip to the substrate, is removed from the substrate by cooling the unconnected side of the chip to embrittle the solder columns and then twisting the chip with small angle rotational motion to shear the columns at their midpoints. A mechanism for cooling and rotating the chip makes use of the cooling substance to minimize the contact of the substrate with the cooling substance.

摘要翻译： 通过将芯片的一侧连接到基板的焊料柱安装在基板上的半导体芯片通过冷却芯片的未连接侧而使焊料柱脆化，然后以小角度的旋转运动来剪切芯片 列在它们的中点。 用于冷却和旋转芯片的机构利用冷却物质来最小化衬底与冷却物质的接触。

公开(公告)号：US20160329312A1

公开(公告)日：2016-11-10

申请号：US14704044

申请日：2015-05-05

申请人： Sean M. O'Mullan ,  Michael S. Alfano ,  Bryan Black

发明人： Sean M. O'Mullan ,  Michael S. Alfano ,  Bryan Black

IPC分类号： H01L25/18 ,  G01R31/28 ,  H01L23/498 ,  H01L21/66 ,  H01L25/00

CPC分类号： H01L25/18 ,  G01R31/2834 ,  G01R31/2856 ,  G01R31/2884 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/98 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/181 ,  H01L2924/014 ,  H01L2924/00014

摘要： Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor chip mounted on the interposer and a second semiconductor chip mounted on and electrically connected to the first semiconductor chip by the interposer. The second semiconductor chip includes offloaded logic of the first semiconductor chip.

摘要翻译： 公开了各种半导体芯片和插入器件。 一方面，提供了一种装置，其包括插入器，安装在插入件上的第一半导体芯片和通过插入器安装在第一半导体芯片上并与第一半导体芯片电连接的第二半导体芯片。 第二半导体芯片包括第一半导体芯片的卸载逻辑。

公开(公告)号：US20150303127A1

公开(公告)日：2015-10-22

申请号：US14753514

申请日：2015-06-29

申请人： Volterra Semiconductor LLC

发明人： Mihalis Michael ,  Ilijah Jergovic

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/3675 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/42 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2731 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2224/98 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configured to cover the second die surface and the packaging surface and can be attached thereto by a layer of adhesive positioned between the heat spreader and the semiconductor die. A semiconductor package array can include an array of semiconductor dies and a heat spreader configured to cover each semiconductor die. A conductive lead can be electrically connected to the integrated circuit in a semiconductor die and can extend from the first die surface. Manufacturing a semiconductor package can include applying thermally conductive adhesive to the heat spreader and placing the heat spreader proximate the semiconductor die.

摘要翻译： 半导体封装可以包括具有集成电路的半导体管芯，第一管芯表面和相对的第二管芯表面。 包装可以附接到模具并且具有与第一模具表面相对的保持器表面。 散热器可以被配置为覆盖第二模具表面和包装表面，并且可以通过位于散热器和半导体管芯之间的粘合剂层附接到散热器。 半导体封装阵列可以包括半导体管芯阵列和配置成覆盖每个半导体管芯的散热器。 导电引线可以与半导体管芯中的集成电路电连接并且可以从第一管芯表面延伸。 制造半导体封装可以包括将热传导粘合剂施加到散热器并将散热器放置在半导体管芯附近。

公开(公告)号：US20140099485A1

公开(公告)日：2014-04-10

申请号：US14015650

申请日：2013-08-30

申请人： APPLIED MATERIALS, INC.

发明人： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC分类号： H01L21/67 ,  H01L21/683 ,  B32B7/14

CPC分类号： B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

摘要翻译： 公开了使用其组合基板的成型组件以及用于翻新所述组件的改进方法的方法，其利用形成在用于连接两个基板的粘合剂中的至少一个通道，以改善组件的制造，性能和翻新。 在一个实施例中，组件包括通过粘合剂层固定到第二衬底的第一衬底。 组件包括通道，其具有由粘合剂层限定的至少一个侧面并具有暴露于组件的外部的出口。

公开(公告)号：US6034875A

公开(公告)日：2000-03-07

申请号：US98977

申请日：1998-06-17

申请人： Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

发明人： Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

IPC分类号： H01L21/60 ,  H01L23/367 ,  H05K3/22 ,  H05K3/34 ,  H05K7/20

CPC分类号： H01L24/81 ,  H01L23/3672 ,  H01L24/75 ,  H05K3/3494 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/755 ,  H01L2224/75745 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0116 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/0776 ,  H05K2203/081 ,  H05K2203/1121 ,  H05K2203/176 ,  H05K2203/304 ,  H05K3/225 ,  Y10T29/4913 ,  Y10T29/4973 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/53174

摘要： A method and apparatus for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.

摘要翻译： 一种用于在返工过程中冷却基板上的电气部件的方法和设备。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。

公开(公告)号：US5556024A

公开(公告)日：1996-09-17

申请号：US315319

申请日：1994-09-29

申请人： David C. Olson ,  Robert Phillips, III

发明人： David C. Olson ,  Robert Phillips, III

IPC分类号： B23K1/018 ,  G01R1/04 ,  G01R31/28 ,  H01L21/60 ,  H05K13/04 ,  H05K3/30 ,  B23K3/00

CPC分类号： H05K13/0486 ,  B23K1/018 ,  G01R1/0483 ,  G01R31/2867 ,  H01L24/799 ,  H01L24/98 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/131 ,  H01L2224/75703 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/19

摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

公开(公告)号：US5029747A

公开(公告)日：1991-07-09

申请号：US562171

申请日：1990-08-03

申请人： Alexander J. Russo ,  Daniel M. Andrews ,  Gregory E. Pitts

发明人： Alexander J. Russo ,  Daniel M. Andrews ,  Gregory E. Pitts

IPC分类号： H05K3/22 ,  H05K3/34 ,  H05K13/04

CPC分类号： H05K13/0486 ,  H05K3/225 ,  H01L2224/98 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/176 ,  H05K3/3494

摘要： A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

摘要翻译： 一种将具有多个电引线的有缺陷的电子部件替换为与焊接部分上的电触头相接合的接合位置的切割引线的接合部分，将该焊针重新接合到触头，更换有缺陷的部件并将更换部件的引线接合到 电接点。 优选地，引线与短截线的重新连接同时切割。 引线可以结合到短截线的顶部或者结合到短截线的侧面。 提供粘合工具以同时切割引线并重新粘结所得到的短截线。