公开(公告)号：US06674948B2

公开(公告)日：2004-01-06

申请号：US09928893

申请日：2001-08-13

申请人： Jang-Hun Yeh ,  Xueya Wen ,  Jinhui Zhai

发明人： Jang-Hun Yeh ,  Xueya Wen ,  Jinhui Zhai

IPC分类号： G02B604

CPC分类号： G02B6/4214 ,  G02B6/08 ,  G02B6/4212 ,  G02B6/423 ,  G02B6/4249 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2224/05599

摘要： A optoelectronic module comprises one or more VCSELs electrically connected to an IC and optically connected to a fiber optic faceplate. The fiber optic faceplate, comprising a closely packed bundle of optical fibers, permits efficient capture of light from the VCSELs. Precise alignment of the faceplate with respect to the VCSELs is not needed since light not collected by one fiber is captured by another nearby optical fiber. One method of fabricating the module comprises forming substrate layers on both sides of the VCSELs such that features can be formed on the first substrate layer while the second temporary substrate layer provides structural support. The method further comprises forming apertures on the first substrate layer by etching. An etch stop buffer layer positioned between the first substrate layer and the VCSELs protects the VCSELs from being etched in the process. The second temporary substrate layer is removed after the fiber optic faceplate is mounted on the first substrate side. An alternate method of VCSEL fabrication comprises forming an aperture by patterning a dielectric layer above an active layer within the VCSEL. The aperture in the dielectric layer can be formed with a high degree of precisely using conventional patterning techniques. The dielectric layer is part of a current confinement element that concentrates current in an active region. A top DBR can also be formed of multiple layers of dielectric.

摘要翻译： 光电子模块包括电连接到IC并光学连接到光纤面板的一个或多个VCSEL。 包括紧密堆叠的光纤束的光纤面板允许有效地捕获来自VCSEL的光。 不需要面板相对于VCSEL的精确对准，因为一个光纤未收集的光被另一个附近的光纤捕获。 制造模块的一种方法包括在VCSEL的两侧形成衬底层，使得可在第一衬底层上形成特征，而第二临时衬底层提供结构支撑。 该方法还包括通过蚀刻在第一基底层上形成孔。 位于第一基底层和VCSEL之间的蚀刻停止缓冲层保护VCSEL在该过程中不被蚀刻。 在光纤面板安装在第一基板侧上之后，移除第二临时基板层。 VCSEL制造的替代方法包括通过在VCSEL内的有源层上方图案化电介质层来形成孔。 电介质层中的孔径可以使用常规的图案化技术高精度地形成。 电介质层是将电流集中在有源区中的电流限制元件的一部分。 顶部DBR也可以由多层电介质形成。

公开(公告)号：US06692979B2

公开(公告)日：2004-02-17

申请号：US09928528

申请日：2001-08-13

申请人： Jang-Hun Yeh ,  Xueya Wen ,  Jinhui Zhai

发明人： Jang-Hun Yeh ,  Xueya Wen ,  Jinhui Zhai

IPC分类号： H01L2100

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4249 ,  H01S5/0216 ,  H01S5/0217 ,  H01S5/141 ,  H01S5/18305 ,  H01S5/18311 ,  H01S5/423

摘要： A optoelectronic module comprises one or more VCSELs electrically connected to an IC and optically connected to a fiber optic faceplate. The fiber optic faceplate, comprising a closely packed bundle of optical fibers, permits efficient capture of light from the VCSELs. Precise alignment of the faceplate with respect to the VCSELs is not needed since light not collected by one fiber is captured by another nearby optical fiber. One method of fabricating the module comprises forming substrate layers on both sides of the VCSELs such that features can be formed on the first substrate layer while the second temporary substrate layer provides structural support. The method further comprises forming apertures on the first substrate layer by etching. An etch stop buffer layer positioned between the first substrate layer and the VCSELs protects the VCSELs from being etched in the process. The second temporary substrate layer is removed after the fiber optic faceplate is mounted on the first substrate side. An alternate method of VCSEL fabrication comprises forming an aperture by patterning a dielectric layer above an active layer within the VCSEL. The aperture in the dielectric layer can be formed with a high degree of precisely using conventional patterning techniques. The dielectric layer is part of a current confinement element that concentrates current in an active region. A top DBR can also be formed of multiple layers of dielectric.

摘要翻译： 光电子模块包括电连接到IC并光学连接到光纤面板的一个或多个VCSEL。 包括紧密堆叠的光纤束的光纤面板允许有效地捕获来自VCSEL的光。 不需要面板相对于VCSEL的精确对准，因为一个光纤未收集的光被另一个附近的光纤捕获。 制造模块的一种方法包括在VCSEL的两侧形成衬底层，使得可在第一衬底层上形成特征，而第二临时衬底层提供结构支撑。 该方法还包括通过蚀刻在第一基底层上形成孔。 位于第一基底层和VCSEL之间的蚀刻停止缓冲层保护VCSEL在该过程中不被蚀刻。 在光纤面板安装在第一基板侧上之后，移除第二临时基板层。 VCSEL制造的替代方法包括通过在VCSEL内的有源层上方图案化电介质层来形成孔。 电介质层中的孔径可以使用常规的图案化技术高精度地形成。 电介质层是将电流集中在有源区中的电流限制元件的一部分。 顶部DBR也可以由多层电介质形成。