公开(公告)号：US07751174B2

公开(公告)日：2010-07-06

申请号：US10538136

申请日：2003-12-09

申请人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kiminori Yokoyama

发明人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kiminori Yokoyama

IPC分类号： H01G4/228 ,  H01G2/20 ,  H01B1/00 ,  H01B1/12

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01G4/005

摘要： The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).

摘要翻译： 本发明旨在解决传统的热固性导电浆料相对于内部电极和外部电极之间的结合性质的问题，以便提供一种适于其安装在一个或多个陶瓷电极上的多层陶瓷电子部件 基板和电镀处理。 多层陶瓷电子部件技术领域本发明涉及一种多层陶瓷电子部件，其特征在于，具有由包含高熔点导电性粒子，熔点为300℃以下的金属粉末的热固性导电膏形成的外部电极 和一种或多种树脂。

公开(公告)号：US20060044098A1

公开(公告)日：2006-03-02

申请号：US10538136

申请日：2003-12-09

申请人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kimnori Yokoyama

发明人： Takeshi Kimura ,  Yamato Takada ,  Michinori Komagata ,  Masahiro Kitamura ,  Kimnori Yokoyama

IPC分类号： H01F21/04

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01G4/005

摘要： The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).

摘要翻译： 本发明旨在解决传统的热固性导电浆料相对于内部电极和外部电极之间的结合性质的问题，以便提供一种适于其安装在一个或多个陶瓷电子部件上的多层陶瓷电子部件 底物和电镀处理。 多层陶瓷电子部件技术领域本发明涉及一种多层陶瓷电子部件，其特征在于，具有由包含高熔点导电性粒子，熔点为300℃以下的金属粉末的热固性导电膏形成的外部电极 和一种或多种树脂。

公开(公告)号：US4311729A

公开(公告)日：1982-01-19

申请号：US116963

申请日：1980-01-30

申请人： Gen Itakura ,  Hideki Kuramitsu ,  Yamato Takada ,  Takayuki Kuroda ,  Yoshio Irie

发明人： Gen Itakura ,  Hideki Kuramitsu ,  Yamato Takada ,  Takayuki Kuroda ,  Yoshio Irie

IPC分类号： H01C7/10 ,  H01B3/00 ,  H01C7/00 ,  H01C7/102 ,  H01C17/06 ,  H01C17/30 ,  H01G4/008 ,  H01G4/01 ,  H01G4/12 ,  H01C17/18 ,  C23C3/02

CPC分类号： H01C7/102 ,  H01C17/06 ,  H01C17/30 ,  H01C7/006

摘要： Method for manufacturing a ceramic electronic component such as a voltage-dependent non-linear resistor element and a semiconductive ceramic capacitor is disclosed, in which a precisely uniform metal coating is formed on a surface of a ceramic and the metal coating is then heat treated to convert the metal of the metal coating to a metal compound to form a metal compound coating on the surface of the ceramic and/or diffuse a portion of or all of the metal coating into the ceramic, for attaining completely different electric properties than those of untreated ceramic. The present method is particularly useful in the application to a semiconductive ceramic capacitor.

摘要翻译： 公开了一种用于制造诸如电压相关的非线性电阻元件和半导体陶瓷电容器的陶瓷电子部件的方法，其中在陶瓷的表面上形成精确均匀的金属涂层，然后将金属涂层进行热处理 将金属涂层的金属转化为金属化合物以在陶瓷的表面上形成涂覆的金属化合物和/或将一部分或全部金属涂层扩散到陶瓷中，以获得与未处理的金属涂层完全不同的电性能 陶瓷。 本方法在半导体陶瓷电容器的应用中特别有用。