公开(公告)号：US6153938A

公开(公告)日：2000-11-28

申请号：US122782

申请日：1998-07-27

申请人： Naoya Kanda ,  Toyoki Asada ,  Yoshio Oozeki ,  Yasuo Amano ,  Kunio Matsumoto ,  Yasuhiro Narikawa

发明人： Naoya Kanda ,  Toyoki Asada ,  Yoshio Oozeki ,  Yasuo Amano ,  Kunio Matsumoto ,  Yasuhiro Narikawa

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L23/12 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3011

摘要： A stable low-connecting resistance connection arrangement having a high yield rate without using any special material or process for a substrate. A flip-chip connecting structure in which the semiconductor integrated circuit (IC) chip is mounted directly on an organic circuit substrate. To achieve reliable connection and low-connecting resistance, the present invention absorbs variation of the heights of projecting electrodes formed on a semiconductor IC chip and substrate electrodes of an organic circuit substrate for example, by deforming the substrate electrodes and/or substrate layer of the organic circuit substrate. Resin of a conductive paste disposed between the projecting electrodes and substrate electrodes is squeezed out leaving a high density conductive particle layer to lower a contact resistance between such electrodes.

摘要翻译： 稳定的低连接电阻连接装置，具有高产率而不使用任何特殊材料或工艺用于基板。 一种倒装芯片连接结构，其中半导体集成电路（IC）芯片直接安装在有机电路基板上。 为了实现可靠的连接和低连接电阻，本发明通过使基板电极和/或基板层变形来吸收形成在半导体IC芯片和有机电路基板的基板电极上的突起电极的高度的变化，例如， 有机电路基板。 设置在突出电极和基板电极之间的导电膏的树脂被挤出，留下高密度导电颗粒层以降低这些电极之间的接触电阻。