公开(公告)号：US6153938A

公开(公告)日：2000-11-28

申请号：US122782

申请日：1998-07-27

申请人： Naoya Kanda ,  Toyoki Asada ,  Yoshio Oozeki ,  Yasuo Amano ,  Kunio Matsumoto ,  Yasuhiro Narikawa

发明人： Naoya Kanda ,  Toyoki Asada ,  Yoshio Oozeki ,  Yasuo Amano ,  Kunio Matsumoto ,  Yasuhiro Narikawa

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L23/12 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3011

摘要： A stable low-connecting resistance connection arrangement having a high yield rate without using any special material or process for a substrate. A flip-chip connecting structure in which the semiconductor integrated circuit (IC) chip is mounted directly on an organic circuit substrate. To achieve reliable connection and low-connecting resistance, the present invention absorbs variation of the heights of projecting electrodes formed on a semiconductor IC chip and substrate electrodes of an organic circuit substrate for example, by deforming the substrate electrodes and/or substrate layer of the organic circuit substrate. Resin of a conductive paste disposed between the projecting electrodes and substrate electrodes is squeezed out leaving a high density conductive particle layer to lower a contact resistance between such electrodes.

摘要翻译： 稳定的低连接电阻连接装置，具有高产率而不使用任何特殊材料或工艺用于基板。 一种倒装芯片连接结构，其中半导体集成电路（IC）芯片直接安装在有机电路基板上。 为了实现可靠的连接和低连接电阻，本发明通过使基板电极和/或基板层变形来吸收形成在半导体IC芯片和有机电路基板的基板电极上的突起电极的高度的变化，例如， 有机电路基板。 设置在突出电极和基板电极之间的导电膏的树脂被挤出，留下高密度导电颗粒层以降低这些电极之间的接触电阻。

公开(公告)号：US06589802B1

公开(公告)日：2003-07-08

申请号：US09640647

申请日：2000-08-18

申请人： Toyoki Asada ,  Yuji Fujita ,  Kie Ueda ,  Naoya Kanda ,  Mari Matsuyoshi

发明人： Toyoki Asada ,  Yuji Fujita ,  Kie Ueda ,  Naoya Kanda ,  Mari Matsuyoshi

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0783 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.

摘要翻译： 本发明可以容易地去除半导体集成电路芯片并确保倒装芯片接合的可靠性的结构，电子部件的封装方法以及用于分离电子部件的方法和装置。 根据本发明，目的是通过使用两种用于粘合半导体集成电路芯片和电路板的可溶性和不溶性树脂的倒装芯片接合结构来实现的。

公开(公告)号：US06635971B2

公开(公告)日：2003-10-21

申请号：US10042270

申请日：2002-01-11

申请人： Toyoki Asada ,  Yuji Fujita ,  Hideo Sotokawa ,  Kazumi Kawamoto ,  Kunio Matsumoto ,  Shinya Hamagishi ,  Mari Matsuyoshi

发明人： Toyoki Asada ,  Yuji Fujita ,  Hideo Sotokawa ,  Kazumi Kawamoto ,  Kunio Matsumoto ,  Shinya Hamagishi ,  Mari Matsuyoshi

IPC分类号： H01L2329

CPC分类号： H01L24/31 ,  G02B6/4232 ,  G02B6/4246 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.