摘要:
The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3.
摘要:
The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3.
摘要:
The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3.
摘要:
An electromagnetic relay is provided which enables a coating process with a coating agent even after being mounted on a printed circuit board having undergone reflow heating by preventing invasion of water while maintaining air permeability. A main body making up the electromagnetic relay includes an electrical contact portion, electromagnetic driving portion and molded resin base and is covered with the molded resin cover. One or more through holes are formed by applying laser beam from a rear side of the molded resin cover. A spot diameter of each through hole on a surface of an outside of the molded resin cover is 0.1 μm to 10 μm. Instead of the molded resin cover, through-holes each having a size of 0.1 μm to 10 μm may be formed by applying the laser beam to the molded resin base. Moreover, a liquid crystal polymer may be used as the molded resin cover or base having a filtering function, by forming holes to pass through only skin layers making up the liquid crystal polymer by applying the laser beam to the liquid crystal polymer.
摘要:
Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low. Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition. The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 [mu]m or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less. Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800 DEG C. in a furnace at an angle of 60 DEG to 90 DEG with respect to the injection direction of a starting material of the powder, and setting the relative velocity of the starting material of the powder and/or the spherical powder to stainless steel and/or iron to 5 m/s or less.
摘要:
The present invention provides ceramic powder capable of being incorporated into rubber or a resin for the preparation of a composition, which shows excellent heat resistance and flame retardancy and which is used, for instance, as a semiconductor-sealing material. The ceramic powder has a multi-peak frequency distribution pattern having at least two peaks as a particle size distribution as determined using a laser diffraction-scattering type particle size-analyzer, wherein the maximum particle size for the first peak ranges from 40 to 80 μm and that for the second peak ranges from 3 to 8 μm and wherein the rate of the particles having a particle size of not less than 20 μm and less than 40 μm is not more than 20% by mass (inclusive of 0% by mass).
摘要:
To provide an amorphous silica powder suitable for a sealing material for semiconductors having improved HTSL properties and HTOL properties, and a process for its production.An amorphous silica powder containing Al in an amount of from 0.03 to 20 mass % as calculated as Al2O3 measured by atomic absorption spectrophotometry, wherein the average particle size is at most 50 μm, and when the amorphous silica powder is divided according to the average particle size into two powders, a powder having a particle size smaller than the average particle size has a higher content as calculated as Al2O3 than a powder having a particle size larger than the average particle size.
摘要翻译:提供适用于具有改进的HTSL性质和HTOL性质的半导体密封材料的无定形二氧化硅粉末及其生产方法。 一种无定形二氧化硅粉末,其含有以原子吸收分光光度法测定的Al 2 O 3为0.03〜20质量%的Al,平均粒径为50μm以下,并且当无定形二氧化硅粉末按照平均粒子 尺寸变成两种粉末,粒径小于平均粒度的粉末具有比Al2O3计算的含量高于具有比平均粒径大的粉末的粉末。
摘要:
The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m2/g, an average sphericity degree of not less than 0.90 and a purity of not less than 99% by mass. The inorganic hollow powder can be prepared by a method comprising the steps of forming a flame using a burner provided with at least a triplet-tubular portion comprising, in order from the outermost side, a combustion-improving gas-supply pipe, a combustible gas-supply pipe and an inorganic raw powder-supply pipe assembled together; injecting, into the flame at a high discharge speed, inorganic raw powder having a specific particle size through the inorganic raw powder-supply pipe, while the powder is entrained with a carrier gas having a specific relative humidity, to thus subject the powder to a heat-treatment.
摘要:
To provide a silica powder which is excellent in flowability and packing properties and which is less likely to form a flash, a process for its production, and a composition having it incorporated in at least one of a rubber and a resin, particularly a sealing material.A silica powder containing an ultrafine powder in an amount of from 0.1 to 20 mass % and having an average sphericity of at least 0.85, wherein the ultrafine powder has, as the particle size measured by a dynamic light scattering particle size distribution measuring apparatus, an average particle size of from 150 to 250 nm, a content of particles having a particle size of at most 100 nm being less than 10 mass % (not including 0 mass %) and a content of particles having a particle size exceeding 100 nm and not exceeding 150 nm being from 10 to 50 mass %. A process for producing a silica powder, which comprises spraying a silica powder material to a high temperature zone of at least 1,750° C. formed by a burner for heat treatment, wherein the high temperature zone is formed in a range of from the forward end of the burner to 3.0-4.5 m therefrom, and to such a high temperature zone, a silica powder material containing from 0.05 to 10 mass % of a metal silicon powder is sprayed. A sealing material employing the silica powder of the present invention.
摘要:
The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3.