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公开(公告)号：US20100059257A1
公开(公告)日：2010-03-11
申请号：US12369143
申请日：2009-02-11
申请人： Jin-Hak CHOI , Seoung-Jae Lee , Bae-Kyun Kim , Eun-Ju Yang , Jong-Yun Kim , Yeo-Joo Yoon
发明人： Jin-Hak CHOI , Seoung-Jae Lee , Bae-Kyun Kim , Eun-Ju Yang , Jong-Yun Kim , Yeo-Joo Yoon
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/206 , C23C18/22 , C23C18/32 , C23C18/42 , C23C18/54 , H01L2224/45144 , H01L2224/85444 , H05K3/383 , H05K2203/0392 , H05K2203/0716 , H05K2203/072 , H05K2203/1476 , Y10T428/24917
摘要： Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
摘要翻译： 公开了一种对化学镀镍 - 镀金的方法和印刷电路板。 根据本发明的实施例的方法包括：在物体的表面上形成第一镀镍层; 在所述第一镀镍层上形成第二镀镍层; 以及在所述第二镀镍层上形成镀金层。
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公开(公告)号：US07982138B2
公开(公告)日：2011-07-19
申请号：US12369143
申请日：2009-02-11
申请人： Jin-Hak Choi , Seoung-Jae Lee , Bae-Kyun Kim , Eun-Ju Yang , Jong-Yun Kim , Yeo-Joo Yoon
发明人： Jin-Hak Choi , Seoung-Jae Lee , Bae-Kyun Kim , Eun-Ju Yang , Jong-Yun Kim , Yeo-Joo Yoon
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/206 , C23C18/22 , C23C18/32 , C23C18/42 , C23C18/54 , H01L2224/45144 , H01L2224/85444 , H05K3/383 , H05K2203/0392 , H05K2203/0716 , H05K2203/072 , H05K2203/1476 , Y10T428/24917
摘要： Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
摘要翻译： 公开了一种对化学镀镍 - 镀金的方法和印刷电路板。 根据本发明的实施例的方法包括：在物体的表面上形成第一镀镍层; 在所述第一镀镍层上形成第二镀镍层; 以及在所述第二镀镍层上形成镀金层。
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