Packaging process for semiconductors
    1.
    发明授权
    Packaging process for semiconductors 失效
    半导体封装工艺

    公开(公告)号:US4305897A

    公开(公告)日:1981-12-15

    申请号:US104853

    申请日:1979-12-18

    摘要: A process for packaging semiconductors or integrated circuits including semiconductors involves positioning a lead frame on which semiconductors or an integrated circuit are mounted between two thermoplastic resin moldings, at least one of which moldings has a cavity for holding the semiconductors or the integrated circuit and thereafter integrally joining the thermoplastic resin moldings under heat and pressure to the lead frame. An uneven surface is provided on at least a part of the surfaces to be joined of either or both of the two thermoplastic resin moldings. This uneven surface is formed around the cavity in a thermoplastic resin molding having a cavity or on a surface of the thermoplastic resin molding having no cavity which corresponds to the surface to be joined to the other thermoplastic molding having a cavity. The lead frame is interposed or arranged between the two thermoplastic resin moldings so that at least one void is formed between the uneven surface to be joined of at least one of the two thermoplastic resin moldings and the lead frame. The thermoplastic resin moldings are joined by the application of heat and pressure to the lead frame so that at least a part of the at least one void formed prior to joining remains and in this manner harmful flash is prevented from being formed by molten resin produced under the application of heat and pressure.

    摘要翻译: 用于封装半导体或包括半导体的集成电路的方法包括将引线框架定位在半导体或集成电路上安装在两个热塑性树脂模制件之间,其中至少一个模制件具有用于保持半导体或集成电路的空腔, 将热塑性树脂模制品在热和压力下接合到引线框架。 在两个热塑性树脂成型体中的任一个或两个的待连接表面的至少一部分上设置有不平坦的表面。 这种不平坦的表面在具有空腔的热塑性树脂模制件的空腔周围形成,或者在热塑性树脂模制件的没有空腔的热塑性树脂模制件的表面上形成,该热塑性树脂模制件具有对应于具有空腔的另一个热塑性模塑件的 引线框架插入或布置在两个热塑性树脂模制品之间,使得在两个热塑性树脂模制品中的至少一个和引线框架之间的待连接的不平坦表面之间形成至少一个空隙。 热塑性树脂模制品通过施加热和压力连接到引线框架,使得在接合之前形成的至少一个空隙的至少一部分保持不变,并且以这种方式防止由下面产生的熔融树脂形成有害闪光 应用热和压力。

    Frame of a game racket
    3.
    发明授权
    Frame of a game racket 失效
    一个游戏球拍的框架

    公开(公告)号:US4194738A

    公开(公告)日:1980-03-25

    申请号:US919220

    申请日:1978-06-26

    IPC分类号: A63B49/02 A63B49/10

    CPC分类号: A63B49/10 A63B2049/0212

    摘要: The present invention is directed to a hollow frame for a game racket substantially constructed from a first fiber reinforced thermoplastic frame member which continuously provides outside peripheral portions of the tadpole shape of the frame including a head portion, a straight handle portion and a triangular throat portion which connects the head and handle portions, and a second fiber reinforced thermoplastic frame member which integrally provides the inside remaining portions, as viewed in the tadpole plan view, of the head, throat and handle portion, wherein the first and second frame members are joined together so as to form a hollow frame.

    摘要翻译: 本发明涉及一种用于游戏球的空心框架,其基本上由第一纤维增强热塑性框架构件构成,该第一纤维增强热塑性框架构件连续地提供框架的t ole形状的外围部分,包括头部,直柄部和三角形喉部 其连接头部和手柄部分,以及第二纤维增强热塑性框架部件,其一体地提供头部,喉部和手柄部分中的t ole俯视图中的内部剩余部分,其中第一和第二框架部件被连接 一起形成中空框架。

    Golf club shaft
    4.
    发明授权
    Golf club shaft 失效
    高尔夫球杆杆

    公开(公告)号:US3998458A

    公开(公告)日:1976-12-21

    申请号:US594889

    申请日:1975-07-10

    IPC分类号: A63B53/10

    摘要: A golf club shaft made of a filament reinforced resin wherein a group of filaments are wound at a winding angle of 10.degree. or less and another group of filaments are wound at a winding angle of 25.degree. to 65.degree. and capable of much reducing the torsion of the shaft, reducing the weight of the shaft, increasing the bending strength of the shaft and increasing the flying distance of a golf ball.

    摘要翻译: 一种由细丝增强树脂制成的高尔夫球杆杆,其中一组细丝以10°或更小的卷取角度卷绕,另一组细丝以25°至65°的卷绕角度卷绕,并且能够大大减少扭转 的轴,减轻轴的重量,增加轴的弯曲强度并增加高尔夫球的飞行距离。