公开(公告)号：US08414979B2

公开(公告)日：2013-04-09

申请号：US12530070

申请日：2008-03-04

申请人： Yohzoh Yamashina ,  Hiroyuki Tokuda ,  Youichi Tanimoto ,  David ,  Nobuyuki Koike

发明人： Yohzoh Yamashina ,  Hiroyuki Tokuda ,  Youichi Tanimoto ,  David ,  Nobuyuki Koike

IPC分类号： B05D3/06

CPC分类号： C09D175/16 ,  B05D3/067 ,  C08G18/3853 ,  C08G18/672 ,  C08G18/8125

摘要： An object of the present invention is to provide a radiation-curable coating material which forms a cured coating film having high hardness and low curing shrinkage, a radiation-curable resin composition for obtaining the radiation-curable coating material, and a method for forming a protective layer using the radiation-curable coating material. The present invention provides a radiation-curable resin composition including an urethane (meth)acrylate (A), which is obtained by reacting a bicyclo ring-containing polyisocyanate compound (a1), a hydroxyl group-containing, trifunctional or higher polyfunctional (meth)acrylate (a2) and a tris(2-hydroxyalkyl)isocyanurate di(meth)acrylate (a3); a radiation-curable coating material including the above resin composition; and a method for forming a protective layer, which includes: applying the above radiation-curable coating material onto a support to form a layer of the radiation-curable coating material thereon; and irradiating the layer of the coating material with radiation thereby curing the layer of the coating material to form a protective layer.

摘要翻译： 本发明的目的是提供一种形成具有高硬度和低固化收缩率的固化涂膜的可辐射固化涂料，用于获得可辐射固化涂料的辐射固化树脂组合物，以及用于形成 使用可辐射固化涂层材料的保护层。 本发明提供一种含有双环环的多异氰酸酯化合物（a1），含羟基的三官能以上的多官能（甲基）丙烯酸酯化合物（甲基）丙烯酸酯（A） 丙烯酸酯（a2）和三（2-羟烷基）异氰脲酸酯二（甲基）丙烯酸酯（a3）; 包含上述树脂组合物的可辐射固化涂料; 以及形成保护层的方法，其包括：将上述可辐射固化涂层材料施加到支撑体上以在其上形成可辐射固化涂层材料层; 并且用辐射照射涂层材料层，从而固化涂层材料层以形成保护层。

公开(公告)号：US20100104765A1

公开(公告)日：2010-04-29

申请号：US12530070

申请日：2008-03-04

申请人： Yohzoh Yamashina ,  Hiroyuki Tokuda ,  Youichi Tanimoto ,  (none) David ,  Nobuyuki Koike

发明人： Yohzoh Yamashina ,  Hiroyuki Tokuda ,  Youichi Tanimoto ,  (none) David ,  Nobuyuki Koike

IPC分类号： C08L77/00 ,  C08F20/00 ,  C08G18/67 ,  C08J7/04

CPC分类号： C09D175/16 ,  B05D3/067 ,  C08G18/3853 ,  C08G18/672 ,  C08G18/8125

摘要： An object of the present invention is to provide a radiation-curable coating material which forms a cured coating film having high hardness and low curing shrinkage, a radiation-curable resin composition for obtaining the radiation-curable coating material, and a method for forming a protective layer using the radiation-curable coating material. The present invention provides a radiation-curable resin composition including an urethane (meth)acrylate (A), which is obtained by reacting a bicyclo ring-containing polyisocyanate compound (a1), a hydroxyl group-containing, trifunctional or higher polyfunctional (meth)acrylate (a2) and a tris(2-hydroxyalkyl)isocyanurate di(meth)acrylate (a3); a radiation-curable coating material including the above resin composition; and a method for forming a protective layer, which includes: applying the above radiation-curable coating material onto a support to form a layer of the radiation-curable coating material thereon; and irradiating the layer of the coating material with radiation thereby curing the layer of the coating material to form a protective layer.

摘要翻译： 本发明的目的是提供一种形成具有高硬度和低固化收缩率的固化涂膜的可辐射固化涂料，用于获得可辐射固化涂料的辐射固化树脂组合物，以及用于形成 使用可辐射固化涂层材料的保护层。 本发明提供一种含有双环环的多异氰酸酯化合物（a1），含羟基的三官能以上的多官能（甲基）丙烯酸酯化合物（甲基）丙烯酸酯（A） 丙烯酸酯（a2）和三（2-羟烷基）异氰脲酸酯二（甲基）丙烯酸酯（a3）; 包含上述树脂组合物的可辐射固化涂料; 以及形成保护层的方法，其包括：将上述可辐射固化涂层材料施加到支撑体上以在其上形成可辐射固化涂层材料层; 并且用辐射照射涂层材料层，从而固化涂层材料层以形成保护层。

公开(公告)号：US06887967B2

公开(公告)日：2005-05-03

申请号：US10349078

申请日：2003-01-23

申请人： Eiju Ichinose ,  Yohzoh Yamashina ,  Hidenobu Ishikawa

发明人： Eiju Ichinose ,  Yohzoh Yamashina ,  Hidenobu Ishikawa

IPC分类号： C08G18/34 ,  C08G18/62 ,  C08G18/69 ,  C08G18/79 ,  C08L63/00 ,  C08L79/08 ,  H05K1/00 ,  H05K1/03 ,  C08G73/10 ,  C08G59/42

CPC分类号： H05K1/0346 ,  C08G18/345 ,  C08G18/6208 ,  C08G18/69 ,  C08G18/792 ,  C08L63/00 ,  C08L79/08 ,  H05K3/4676 ,  C08L2666/20 ,  C08L2666/22

摘要： A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

摘要翻译： 提供一种热固性聚酰亚胺树脂组合物，其包含聚酰亚胺树脂和环氧树脂，其具有优异的耐热性，低介电常数和低介电损耗角正切，并且还产生具有良好机械性能如拉伸强度和拉伸伸长率的固化制品。 另外，提供了一种聚酰亚胺树脂组合物中使用的聚酰亚胺树脂的制造方法。 热固性聚酰亚胺树脂组合物包含具有数均分子量为300〜6000的羧基和直链烃结构的聚酰亚胺树脂（X）和环氧树脂（Y）。 通过使多异氰酸酯化合物（a1）与具有直链烃结构的多元醇化合物（a2）反应而得到的末端具有异氰酸酯基的预聚物（A）与数均分子量 直链烃结构的重量为300〜6000，在有机溶剂中具有三个以上羧基的多元羧酸的酸酐（B）。

公开(公告)号：US06784275B2

公开(公告)日：2004-08-31

申请号：US10180313

申请日：2002-06-27

申请人： Eiju Ichinose ,  Yohzoh Yamashina ,  Hidenobu Ishikawa

发明人： Eiju Ichinose ,  Yohzoh Yamashina ,  Hidenobu Ishikawa

IPC分类号： C08G7310

CPC分类号： G03F7/0387 ,  C08G73/1035 ,  C08G73/14 ,  H05K3/4676

摘要： Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

摘要翻译： 公开了一种活性能量射线固化性聚酰亚胺树脂组合物，其包含具有异氰脲酸酯环，脂环结构，酰亚胺环和（甲基）丙烯酰基的聚合性聚酰亚胺树脂（I），并且能够用稀碱水溶液 。