公开(公告)号：US5319183A

公开(公告)日：1994-06-07

申请号：US18269

申请日：1993-02-16

申请人： Kimio Hosoya ,  Yoshihiro Teruya ,  Yasushi Kobayashi

发明人： Kimio Hosoya ,  Yoshihiro Teruya ,  Yasushi Kobayashi

IPC分类号： B23K1/018 ,  B23K26/06 ,  B23K26/14 ,  B23K26/36 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/26 ,  B23K26/16

CPC分类号： B23K26/1464 ,  B23K1/018 ,  B23K26/066 ,  B23K26/142 ,  B23K26/1494 ,  B23K26/362 ,  H05K3/0038 ,  H05K3/027 ,  H05K2203/0257 ,  H05K2203/082 ,  H05K2203/108 ,  H05K2203/175 ,  H05K3/225 ,  H05K3/26

摘要： Method and apparatus for cutting a pattern of a printed wiring board and method and apparatus for cleaning a printed wiring board are provided, wherein a laser beam is irradiated onto a printed wiring board to evaporate the irradiated portion, to thereby cut a pattern or clean the printed wiring board. A laser beam is irradiated onto a cutting spot of the pattern of the printed wiring board to volatilize and remove the cutting spot, and a laser beam having a lower energy density and a larger irradiation area than that used for the pattern cutting is applied to a region of the wiring board around the cut spot, to remove molten matter adhering to that region. A suction nozzle for sweeping a surface region including the cut spot of the printed wiring board and for withdrawing molten matter adhering to the region, or a tape feeding apparatus by which an incombustible sheet or tape is disposed in close contact with the cutting spot of the pattern of the wiring board for collecting particles scattered during the pattern cutting is provided, whereby defective insulation attributable to adhesion of molten matter to the wiring board during the pattern cutting is prevented. Laser beams are applied to the printed wiring board obliquely from two directions to dry-clean the wiring board, whereby solder balls can be removed and defective pin contact is prevented without entailing an increase of the initial cost or running cost.

摘要翻译： 提供了用于切割印刷电路板的图案的方法和装置以及用于清洁印刷电路板的方法和装置的方法和装置，其中将激光束照射到印刷线路板上以蒸发照射部分，从而切割图案或清洁 印刷线路板。 将激光束照射到印刷电路板的图案的切割点上以挥发除去切割点，并且将具有比用于图案切割的能量密度和照射面积更大的照射区域的激光束施加到 区域，以除去附着在该区域的熔融物质。 一种用于扫除包括印刷线路板的切割点的表面区域并用于抽出附着在该区域上的熔融物质的表面区域的吸嘴，或者设置不燃性片材或带子的带材供给装置， 提供了用于收集在图案切割期间散射的颗粒的布线板的图案，由此防止了在图案切割期间由于熔融物质对布线板的粘附而导致的不良绝缘。 激光束从两个方向倾斜地施加到印刷电路板上以干燥布线板，从而可以去除焊球并防止引脚接触不良，而不增加初始成本或运行成本。

公开(公告)号：US5466908A

公开(公告)日：1995-11-14

申请号：US200654

申请日：1994-02-23

申请人： Kimio Hosoya ,  Yoshihiro Teruya ,  Yasushi Kobayashi

发明人： Kimio Hosoya ,  Yoshihiro Teruya ,  Yasushi Kobayashi

IPC分类号： B23K1/018 ,  B23K26/06 ,  B23K26/14 ,  B23K26/36 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/26 ,  B23K26/00

CPC分类号： B23K26/1464 ,  B23K1/018 ,  B23K26/066 ,  B23K26/142 ,  B23K26/1494 ,  B23K26/362 ,  H05K3/0038 ,  H05K3/027 ,  H05K2203/0257 ,  H05K2203/082 ,  H05K2203/108 ,  H05K2203/175 ,  H05K3/225 ,  H05K3/26

摘要： Method and apparatus for cutting a pattern of a printed wiring board and for cleaning a printed wiring board wherein a laser beam is irradiated onto a printed wiring board to evaporate the irradiated portion. A suction nozzle for sweeping a surface region including the cut spot of the printed wiring board and for withdrawing molten matter adhering to the region, or a tape feeding apparatus by which an incombustible sheet or tape is disposed in close contact with the cutting spot of the pattern of the wiring board for collecting particles scattered during the pattern cutting is provided. Further, a laser beam is applied to a resin layer on an internal-layer pattern to expose the pattern, the width of the internal-layer pattern is determined, and the internal-layer pattern is cut in accordance with the determined width. Laser beams are applied to the printed wiring board obliquely from two directions to dry-clean the wiring board.

摘要翻译： 用于切割印刷线路板的图案和用于清洁印刷线路板的方法和设备，其中激光束照射到印刷线路板上以蒸发照射部分。 一种用于扫描包括印刷线路板的切割点并用于抽出粘附到该区域的熔融物质的表面区域的吸嘴，或者用于将不燃性片或带设置在与该区域的切割点紧密接触的带馈送装置 提供了用于收集在图案切割期间散射的颗粒的布线板的图案。 此外，将激光束施加到内层图案上的树脂层以露出图案，确定内层图案的宽度，并根据确定的宽度切割内层图案。 激光束从两个方向倾斜地施加到印刷电路板上以干燥布线板。