公开(公告)号：US6121690A

公开(公告)日：2000-09-19

申请号：US110965

申请日：1998-07-07

申请人： Shigeru Yamada ,  Youichi Kohara

发明人： Shigeru Yamada ,  Youichi Kohara

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： In order to solve the aforementioned problems, a semiconductor device according to the present invention comprises a semiconductor chip, a plurality of first electrode pads respectively placed along a peripheral edge portion of the semiconductor chip and having first and second transverse ends, and a plurality of second electrode pads respectively having transverse ends near from center lines of the semiconductor chip, the transverse ends being respectively placed at the same distances from the center lines as the first transverse ends of the first electrode pads along the peripheral edge portion of the semiconductor chip, and having widths broader than those of the first electrode pads.The width of each second electrode pad is formed to 1.5 to 2 times as long as that of each first electrode pad.Wires for electrically connecting the first and second electrode pads and leads are formed so as to be bonded at substantially the same intervals.The heights of the wires are formed so as to be substantially identical to each other.

摘要翻译： 为了解决上述问题，本发明的半导体装置包括：半导体芯片，分别沿着半导体芯片的周边部分放置并具有第一和第二横向端的多个第一电极焊盘，以及多个 第二电极焊盘分别具有靠近半导体芯片的中心线的横向端部，横向端部分别与沿着半导体芯片的周缘部分的第一电极焊盘的第一横向端部的中心线的距离相等， 并且具有比第一电极焊盘更宽的宽度。 每个第二电极焊盘的宽度形成为每个第一电极焊盘的宽度的1.5至2倍。 用于电连接第一和第二电极焊盘和引线的导线形成为以大致相同的间隔结合。 电线的高度形成为彼此基本相同。